JPS57157550A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57157550A
JPS57157550A JP56042208A JP4220881A JPS57157550A JP S57157550 A JPS57157550 A JP S57157550A JP 56042208 A JP56042208 A JP 56042208A JP 4220881 A JP4220881 A JP 4220881A JP S57157550 A JPS57157550 A JP S57157550A
Authority
JP
Japan
Prior art keywords
frame
electrode
cover
ceramic insulator
secured onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56042208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS639664B2 (enrdf_load_stackoverflow
Inventor
Yutaka Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56042208A priority Critical patent/JPS57157550A/ja
Publication of JPS57157550A publication Critical patent/JPS57157550A/ja
Publication of JPS639664B2 publication Critical patent/JPS639664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56042208A 1981-03-23 1981-03-23 Semiconductor device Granted JPS57157550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56042208A JPS57157550A (en) 1981-03-23 1981-03-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56042208A JPS57157550A (en) 1981-03-23 1981-03-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57157550A true JPS57157550A (en) 1982-09-29
JPS639664B2 JPS639664B2 (enrdf_load_stackoverflow) 1988-03-01

Family

ID=12629594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56042208A Granted JPS57157550A (en) 1981-03-23 1981-03-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57157550A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61114659A (ja) * 1984-11-09 1986-06-02 Hitachi Ltd 映像出力回路
JPS61125156A (ja) * 1984-11-22 1986-06-12 Nec Corp 半導体装置
WO2015025447A1 (ja) * 2013-08-23 2015-02-26 富士電機株式会社 半導体装置
JP6108026B1 (ja) * 2016-12-16 2017-04-05 富士電機株式会社 圧接型半導体モジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144982U (enrdf_load_stackoverflow) * 1988-03-28 1989-10-05

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61114659A (ja) * 1984-11-09 1986-06-02 Hitachi Ltd 映像出力回路
JPS61125156A (ja) * 1984-11-22 1986-06-12 Nec Corp 半導体装置
WO2015025447A1 (ja) * 2013-08-23 2015-02-26 富士電機株式会社 半導体装置
JPWO2015025447A1 (ja) * 2013-08-23 2017-03-02 富士電機株式会社 半導体装置
US9842786B2 (en) 2013-08-23 2017-12-12 Fuji Electric Co., Ltd. Semiconductor device
JP6108026B1 (ja) * 2016-12-16 2017-04-05 富士電機株式会社 圧接型半導体モジュール
JP2018098451A (ja) * 2016-12-16 2018-06-21 富士電機株式会社 圧接型半導体モジュール

Also Published As

Publication number Publication date
JPS639664B2 (enrdf_load_stackoverflow) 1988-03-01

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