JPS57154862A - Structure for semiconductor sealing - Google Patents
Structure for semiconductor sealingInfo
- Publication number
- JPS57154862A JPS57154862A JP3942381A JP3942381A JPS57154862A JP S57154862 A JPS57154862 A JP S57154862A JP 3942381 A JP3942381 A JP 3942381A JP 3942381 A JP3942381 A JP 3942381A JP S57154862 A JPS57154862 A JP S57154862A
- Authority
- JP
- Japan
- Prior art keywords
- sealing structure
- semiconductor sealing
- mounting
- electrode
- interposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To increase the mounting density of semiconductor products by a method wherein a part on the external surface which forms the sealing structure is used as an electrode, and an insulating material is interposed between electrodes. CONSTITUTION:The semiconductor sealing structure 10 has a cylindrical outside shape, and three electrode sections 12 are formed at both ends and the intermediate part of the structue 10. And an insulating material 14 is interposed between each electrode section 12. This semiconductor sealing structure 10 can be mounted in a horizontal attitude against the surface of a printed substrate 16 when it is installed on a printed wiring pattern, for example, and the mounting area of the mounting thickness of which can be reduced, thereby enabling to increase the degree of integration (mounting density).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3942381A JPS57154862A (en) | 1981-03-20 | 1981-03-20 | Structure for semiconductor sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3942381A JPS57154862A (en) | 1981-03-20 | 1981-03-20 | Structure for semiconductor sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57154862A true JPS57154862A (en) | 1982-09-24 |
Family
ID=12552567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3942381A Pending JPS57154862A (en) | 1981-03-20 | 1981-03-20 | Structure for semiconductor sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57154862A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288498A (en) * | 1985-06-14 | 1986-12-18 | 株式会社村田製作所 | Electronic component-built-in multilayer ceramic substrate |
-
1981
- 1981-03-20 JP JP3942381A patent/JPS57154862A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288498A (en) * | 1985-06-14 | 1986-12-18 | 株式会社村田製作所 | Electronic component-built-in multilayer ceramic substrate |
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