JPS5715444A - Sealing of electronic component - Google Patents

Sealing of electronic component

Info

Publication number
JPS5715444A
JPS5715444A JP9016080A JP9016080A JPS5715444A JP S5715444 A JPS5715444 A JP S5715444A JP 9016080 A JP9016080 A JP 9016080A JP 9016080 A JP9016080 A JP 9016080A JP S5715444 A JPS5715444 A JP S5715444A
Authority
JP
Japan
Prior art keywords
resin
case
outer case
insulation
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9016080A
Other languages
Japanese (ja)
Inventor
Teruhisa Takaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9016080A priority Critical patent/JPS5715444A/en
Publication of JPS5715444A publication Critical patent/JPS5715444A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed

Abstract

PURPOSE:To provide a sealed components body excellent in strength and insulation with an increased selective freedom of an outer case by injecting resin into an outer case to solidify with electronic components pressed against a resin layer previously provided in semicured state on the bottom of the case. CONSTITUTION:A material with a large mechanical strength, for example, metal such as Fe and Al, synthetic resin such as urea resin, ceramics of the like is used the base material of the outer case 1 irrelevant to insulation. A sealing agent such as epoxy resin and phenol resin is injected into the bottom of the case 1 to form a resin layer 3 half hard by temperature treatment. Then, electronic components 4, single or in a unit, are inserted into the case pressed against the resin layer 3 with the lead wire 6 outside and a resin-sealing material 5 such as epoxy resin is injected thereinto to make a sealed components body by heating and hardening. This can prevent poor insulation due to the contact of components with the outer case while enhancing the mechanical strength.
JP9016080A 1980-07-02 1980-07-02 Sealing of electronic component Pending JPS5715444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9016080A JPS5715444A (en) 1980-07-02 1980-07-02 Sealing of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9016080A JPS5715444A (en) 1980-07-02 1980-07-02 Sealing of electronic component

Publications (1)

Publication Number Publication Date
JPS5715444A true JPS5715444A (en) 1982-01-26

Family

ID=13990733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9016080A Pending JPS5715444A (en) 1980-07-02 1980-07-02 Sealing of electronic component

Country Status (1)

Country Link
JP (1) JPS5715444A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012080137A1 (en) * 2010-12-14 2012-06-21 Robert Bosch Gmbh Method for producing an electronic assembly having a shaped body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012080137A1 (en) * 2010-12-14 2012-06-21 Robert Bosch Gmbh Method for producing an electronic assembly having a shaped body

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