JPS5715445A - Sealing of electronic components - Google Patents
Sealing of electronic componentsInfo
- Publication number
- JPS5715445A JPS5715445A JP9016180A JP9016180A JPS5715445A JP S5715445 A JPS5715445 A JP S5715445A JP 9016180 A JP9016180 A JP 9016180A JP 9016180 A JP9016180 A JP 9016180A JP S5715445 A JPS5715445 A JP S5715445A
- Authority
- JP
- Japan
- Prior art keywords
- case
- outer case
- resin
- electronic components
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
PURPOSE:To provide an outer case excellent in strength and electric insulation by means of a layer made of an electrically insulating material previously provided on the inner surface of the case in a method of sealing electronic components into the outer case with an electrically insulating material such as resin. CONSTITUTION:For example, a metalic one made of Fe or the like large in the mechanical strength is used in an outer case 1 irrelevant to electrical insulation. A hard resin, ceramics or the like can be used for the case 1. For example phenol resin baking paint is applied on the inner surface of the case 1 (preferably on the outer surface) and heated to make an electrically insulating resin film 2. For example, an epoxy resin 5 is injected into the outer case in which electronic components 3, single or in a unit, are hung with a lead wire 4 to mold into sealed components body. This provides an outer case large in the mechanical strength and excellent in the electrical insulation thereby preventing poor insulation in the sealed components body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9016180A JPS5715445A (en) | 1980-07-02 | 1980-07-02 | Sealing of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9016180A JPS5715445A (en) | 1980-07-02 | 1980-07-02 | Sealing of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5715445A true JPS5715445A (en) | 1982-01-26 |
Family
ID=13990761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9016180A Pending JPS5715445A (en) | 1980-07-02 | 1980-07-02 | Sealing of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5715445A (en) |
-
1980
- 1980-07-02 JP JP9016180A patent/JPS5715445A/en active Pending
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