JPS57147258A - Cooler for electric component part - Google Patents

Cooler for electric component part

Info

Publication number
JPS57147258A
JPS57147258A JP56031369A JP3136981A JPS57147258A JP S57147258 A JPS57147258 A JP S57147258A JP 56031369 A JP56031369 A JP 56031369A JP 3136981 A JP3136981 A JP 3136981A JP S57147258 A JPS57147258 A JP S57147258A
Authority
JP
Japan
Prior art keywords
coolant
header
cooler
tube
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56031369A
Other languages
Japanese (ja)
Other versions
JPS6157706B2 (en
Inventor
Hiroshi Itahana
Yukio Yamada
Hisashi Kuwana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56031369A priority Critical patent/JPS57147258A/en
Priority to KR1019810005029A priority patent/KR890002138B1/en
Priority to BR8201181A priority patent/BR8201181A/en
Publication of JPS57147258A publication Critical patent/JPS57147258A/en
Publication of JPS6157706B2 publication Critical patent/JPS6157706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To lower the height of a cooler by disposing the liquid level of liquid coolant in an evaporation container containing the coolant at the connecting part between the container and a header. CONSTITUTION:When semiconductor elements 1A, 1B are heated by energization, the heats are transferred to the inner surfaces of evaporation containers 2A-2C and post unit 3 and are radiated to liquid coolant 12. The coolant 12 is boiled by the heats to become vapor, which is introduced to the tops of the containers 2A-2C and a connecting tube 5. Thereafter, the coolant vapor 12G is forwarded upwardly through the tube 5, the first header 8 and a condensing tube 9. Then, the coolant is thus cooled with natural convection air or forcibly cooling air 15, is then condensed to be liquefied, and is dropped into the first header 8 to be mixed with the liquid coolant 12. In this manner, since the respective components are constructed to be connected approximately horizontally, the entire height H can be lowered.
JP56031369A 1981-03-06 1981-03-06 Cooler for electric component part Granted JPS57147258A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56031369A JPS57147258A (en) 1981-03-06 1981-03-06 Cooler for electric component part
KR1019810005029A KR890002138B1 (en) 1981-03-06 1981-12-21 Radiator for semiconductor device
BR8201181A BR8201181A (en) 1981-03-06 1982-03-05 COOLING EQUIPMENT TO COOL ELECTRICAL COMPONENTS THAT PRODUCE HEAT DURING OPERATION

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56031369A JPS57147258A (en) 1981-03-06 1981-03-06 Cooler for electric component part

Publications (2)

Publication Number Publication Date
JPS57147258A true JPS57147258A (en) 1982-09-11
JPS6157706B2 JPS6157706B2 (en) 1986-12-08

Family

ID=12329332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56031369A Granted JPS57147258A (en) 1981-03-06 1981-03-06 Cooler for electric component part

Country Status (3)

Country Link
JP (1) JPS57147258A (en)
KR (1) KR890002138B1 (en)
BR (1) BR8201181A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069527A1 (en) * 2007-11-28 2009-06-04 Kabushiki Kaisha Toyota Jidoshokki Ebullient cooling unit
JP2009147367A (en) * 2009-03-13 2009-07-02 Mitsubishi Electric Corp Electric power conversion apparatus for electric train
US8107241B2 (en) 2006-03-31 2012-01-31 Mitsubishi Electric Corporation Electric power conversion apparatus including cooling units

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104080640B (en) 2012-01-30 2017-06-23 三菱电机株式会社 Electric car main circuit system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8107241B2 (en) 2006-03-31 2012-01-31 Mitsubishi Electric Corporation Electric power conversion apparatus including cooling units
WO2009069527A1 (en) * 2007-11-28 2009-06-04 Kabushiki Kaisha Toyota Jidoshokki Ebullient cooling unit
JP2009147367A (en) * 2009-03-13 2009-07-02 Mitsubishi Electric Corp Electric power conversion apparatus for electric train
JP4666084B2 (en) * 2009-03-13 2011-04-06 三菱電機株式会社 Electric power converter for train

Also Published As

Publication number Publication date
JPS6157706B2 (en) 1986-12-08
KR830008397A (en) 1983-11-18
KR890002138B1 (en) 1989-06-20
BR8201181A (en) 1983-01-18

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