JPS56104456A - Boiling cooler - Google Patents

Boiling cooler

Info

Publication number
JPS56104456A
JPS56104456A JP580480A JP580480A JPS56104456A JP S56104456 A JPS56104456 A JP S56104456A JP 580480 A JP580480 A JP 580480A JP 580480 A JP580480 A JP 580480A JP S56104456 A JPS56104456 A JP S56104456A
Authority
JP
Japan
Prior art keywords
refrigerant
refrigerant liquid
liquid
heater
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP580480A
Other languages
Japanese (ja)
Inventor
Hisao Sonobe
Teigo Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP580480A priority Critical patent/JPS56104456A/en
Publication of JPS56104456A publication Critical patent/JPS56104456A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain always stable cooling performance in a boiling cooler by providing nonreturning means in a refrigerant liquid flow passage and thus preventing a phenomenon that the high temperature refrigerant liquid flows into the liquid reservoir. CONSTITUTION:The refrigerant liquid 7a may not boil immediately after a heater 9 starts heating, but flows to cool due to natural convection. When the refrigerant 7a rises at temperature, a boiling occurs from the surface of the heater 9, the internal pressure in the cooling container rises, and the refrigerant liquid will flow toward the liquid reservoir 6. The flow passage of the nonreturning means 10 is closed due to the pressure difference at this time. When the refrigerant liquid 7b is stored in a predetermined amount in the reservoir 6, the passage of the means 10 is opened, the refrigerant is circulated between the boiling and the condensation to provide preferable cooling performance. When the heating amount of the heater 9 is abruptly decreased, the amount of the refrigerant vapor 7c condensed in the condensing space becomes increased, the refrigerant liquid 7b will flow toward the condensing space, the passage is opened, and the cooling is efficiently conducted.
JP580480A 1980-01-23 1980-01-23 Boiling cooler Pending JPS56104456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP580480A JPS56104456A (en) 1980-01-23 1980-01-23 Boiling cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP580480A JPS56104456A (en) 1980-01-23 1980-01-23 Boiling cooler

Publications (1)

Publication Number Publication Date
JPS56104456A true JPS56104456A (en) 1981-08-20

Family

ID=11621261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP580480A Pending JPS56104456A (en) 1980-01-23 1980-01-23 Boiling cooler

Country Status (1)

Country Link
JP (1) JPS56104456A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0321945A2 (en) * 1987-12-22 1989-06-28 Kenji Okayasu Heat conducting device
JP2009088127A (en) * 2007-09-28 2009-04-23 Panasonic Corp Cooling apparatus
WO2018020582A1 (en) * 2016-07-26 2018-02-01 富士通株式会社 Cooling device and electronic device
JP2019016764A (en) * 2017-07-05 2019-01-31 富士通株式会社 Liquid immersion cooling device and information processing device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0321945A2 (en) * 1987-12-22 1989-06-28 Kenji Okayasu Heat conducting device
JP2009088127A (en) * 2007-09-28 2009-04-23 Panasonic Corp Cooling apparatus
WO2018020582A1 (en) * 2016-07-26 2018-02-01 富士通株式会社 Cooling device and electronic device
JPWO2018020582A1 (en) * 2016-07-26 2019-04-11 富士通株式会社 Cooling device and electronic device
US10470337B2 (en) 2016-07-26 2019-11-05 Fujitsu Limited Cooling device and electronic device
JP2019016764A (en) * 2017-07-05 2019-01-31 富士通株式会社 Liquid immersion cooling device and information processing device

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