JPS56104456A - Boiling cooler - Google Patents

Boiling cooler

Info

Publication number
JPS56104456A
JPS56104456A JP580480A JP580480A JPS56104456A JP S56104456 A JPS56104456 A JP S56104456A JP 580480 A JP580480 A JP 580480A JP 580480 A JP580480 A JP 580480A JP S56104456 A JPS56104456 A JP S56104456A
Authority
JP
Japan
Prior art keywords
refrigerant
refrigerant liquid
liquid
heater
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP580480A
Other languages
English (en)
Inventor
Hisao Sonobe
Teigo Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP580480A priority Critical patent/JPS56104456A/ja
Publication of JPS56104456A publication Critical patent/JPS56104456A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP580480A 1980-01-23 1980-01-23 Boiling cooler Pending JPS56104456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP580480A JPS56104456A (en) 1980-01-23 1980-01-23 Boiling cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP580480A JPS56104456A (en) 1980-01-23 1980-01-23 Boiling cooler

Publications (1)

Publication Number Publication Date
JPS56104456A true JPS56104456A (en) 1981-08-20

Family

ID=11621261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP580480A Pending JPS56104456A (en) 1980-01-23 1980-01-23 Boiling cooler

Country Status (1)

Country Link
JP (1) JPS56104456A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0321945A2 (en) * 1987-12-22 1989-06-28 Kenji Okayasu Heat conducting device
JP2009088127A (ja) * 2007-09-28 2009-04-23 Panasonic Corp 冷却装置
WO2018020582A1 (ja) * 2016-07-26 2018-02-01 富士通株式会社 冷却装置及び電子装置
JP2019016764A (ja) * 2017-07-05 2019-01-31 富士通株式会社 液浸冷却装置及び情報処理装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0321945A2 (en) * 1987-12-22 1989-06-28 Kenji Okayasu Heat conducting device
JP2009088127A (ja) * 2007-09-28 2009-04-23 Panasonic Corp 冷却装置
WO2018020582A1 (ja) * 2016-07-26 2018-02-01 富士通株式会社 冷却装置及び電子装置
JPWO2018020582A1 (ja) * 2016-07-26 2019-04-11 富士通株式会社 冷却装置及び電子装置
US10470337B2 (en) 2016-07-26 2019-11-05 Fujitsu Limited Cooling device and electronic device
JP2019016764A (ja) * 2017-07-05 2019-01-31 富士通株式会社 液浸冷却装置及び情報処理装置

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