JPS56135950A - Cooling device by boiling - Google Patents

Cooling device by boiling

Info

Publication number
JPS56135950A
JPS56135950A JP3890980A JP3890980A JPS56135950A JP S56135950 A JPS56135950 A JP S56135950A JP 3890980 A JP3890980 A JP 3890980A JP 3890980 A JP3890980 A JP 3890980A JP S56135950 A JPS56135950 A JP S56135950A
Authority
JP
Japan
Prior art keywords
liquid
refrigerant
pipe
heating body
vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3890980A
Other languages
Japanese (ja)
Inventor
Teigo Okada
Hisao Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3890980A priority Critical patent/JPS56135950A/en
Publication of JPS56135950A publication Critical patent/JPS56135950A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a stable cooling performance by providing a cooler between a liquid reservoir and a suction-discharge pipe to prevent flow-out of a refrigerant from the liquid reservoir due to overheat of a heating body or the like in a circulation device wherein cooling is made by liquefying heated refrigerant vapor through condensation. CONSTITUTION:When the heating body 9 such as a semiconductor element and an electronic apparatus starts to heat and thereby the temperature rises, refrigerant vapor 7c is generated from refrigerant liquid 7a, goes into a condensor 3 through a vapor pipe 2 and is liquefied through condensation in the condensor, and refrigerant liquid 7d returns into an evaporator 1 through a return pipe 4. The heating body 9 is cooled by this circulation. When the heating body is overheated and the vapor penetrates into the liquid reservoir 6 through a connecting pipe 5, sealing by the liquid 8 turns impossible and the liquid flows out to the suction-discharge pipe 10. On this occasion, the refrigerant vapor is liquefied by a cooler 11 provided between the pipe and the liquid reservoir and connected with a refrigerator 12 and is returned to the reservoir 6 from the return pipe 12. By this constitution, the cooling device by boiling having the constantly stable cooling performance can be obtained.
JP3890980A 1980-03-28 1980-03-28 Cooling device by boiling Pending JPS56135950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3890980A JPS56135950A (en) 1980-03-28 1980-03-28 Cooling device by boiling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3890980A JPS56135950A (en) 1980-03-28 1980-03-28 Cooling device by boiling

Publications (1)

Publication Number Publication Date
JPS56135950A true JPS56135950A (en) 1981-10-23

Family

ID=12538324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3890980A Pending JPS56135950A (en) 1980-03-28 1980-03-28 Cooling device by boiling

Country Status (1)

Country Link
JP (1) JPS56135950A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6866092B1 (en) * 1981-02-19 2005-03-15 Stephen Molivadas Two-phase heat-transfer systems
CN102721305A (en) * 2012-04-09 2012-10-10 舒少辛 Flue gas heating device and flue gas heating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6866092B1 (en) * 1981-02-19 2005-03-15 Stephen Molivadas Two-phase heat-transfer systems
CN102721305A (en) * 2012-04-09 2012-10-10 舒少辛 Flue gas heating device and flue gas heating method

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