JPS57138563A - Method of grinding thin film pattern - Google Patents

Method of grinding thin film pattern

Info

Publication number
JPS57138563A
JPS57138563A JP56022001A JP2200181A JPS57138563A JP S57138563 A JPS57138563 A JP S57138563A JP 56022001 A JP56022001 A JP 56022001A JP 2200181 A JP2200181 A JP 2200181A JP S57138563 A JPS57138563 A JP S57138563A
Authority
JP
Japan
Prior art keywords
lapping
holes
stop
thin film
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56022001A
Other languages
Japanese (ja)
Inventor
Kazuhiko Amemori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56022001A priority Critical patent/JPS57138563A/en
Publication of JPS57138563A publication Critical patent/JPS57138563A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Magnetic Heads (AREA)

Abstract

PURPOSE:To grind with high dimensional accuracy of thickness of a thin film by grinding with the lapping face adjusted according to the holes in a stop marker provided on the pattern for lapping stop when lapping magnetic thin films such as thin film magnetic heads. CONSTITUTION:A metal mask 4 is provided with 4 holes 5 for lapping stop that are corresponding to the pattern 2' for lapping stop. Next, after the metal mask 4 is placed over a substrae 1 that is provided with patterns 2 and 2', so that the mask holes 5 coincide with the one end on the pattern 2', ion milling is conducted from over the mask 4 to form the first hole 6 with specified film thickness. After this an alumina film 3 is formed on the substrate 1 that is provided with holes 6, 7 and 8 with specified depths that become shallower successively. Next, a film 3 is flat-ground parallel to the substrate 1 until the first hole 6 emerges that has a bottom face of the same height as the face at which the grinding is expected to end, thus finish-working to a specified thickness.
JP56022001A 1981-02-17 1981-02-17 Method of grinding thin film pattern Pending JPS57138563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56022001A JPS57138563A (en) 1981-02-17 1981-02-17 Method of grinding thin film pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56022001A JPS57138563A (en) 1981-02-17 1981-02-17 Method of grinding thin film pattern

Publications (1)

Publication Number Publication Date
JPS57138563A true JPS57138563A (en) 1982-08-26

Family

ID=12070764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56022001A Pending JPS57138563A (en) 1981-02-17 1981-02-17 Method of grinding thin film pattern

Country Status (1)

Country Link
JP (1) JPS57138563A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145602A (en) * 1984-01-09 1985-08-01 Sumitomo Special Metals Co Ltd Composite substrate
US6893326B2 (en) * 2000-09-04 2005-05-17 Cambridge Consultants Limited Coating removal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145602A (en) * 1984-01-09 1985-08-01 Sumitomo Special Metals Co Ltd Composite substrate
US6893326B2 (en) * 2000-09-04 2005-05-17 Cambridge Consultants Limited Coating removal

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