JPS57138422U - - Google Patents
Info
- Publication number
- JPS57138422U JPS57138422U JP1981025689U JP2568981U JPS57138422U JP S57138422 U JPS57138422 U JP S57138422U JP 1981025689 U JP1981025689 U JP 1981025689U JP 2568981 U JP2568981 U JP 2568981U JP S57138422 U JPS57138422 U JP S57138422U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Amplifiers (AREA)
- Microwave Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981025689U JPS6114183Y2 (https=) | 1981-02-25 | 1981-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981025689U JPS6114183Y2 (https=) | 1981-02-25 | 1981-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57138422U true JPS57138422U (https=) | 1982-08-30 |
| JPS6114183Y2 JPS6114183Y2 (https=) | 1986-05-02 |
Family
ID=29823384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981025689U Expired JPS6114183Y2 (https=) | 1981-02-25 | 1981-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6114183Y2 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03121606A (ja) * | 1989-10-05 | 1991-05-23 | Nec Corp | マイクロ波ミリ波高出力トランジスタ |
| JP2012039160A (ja) * | 2011-11-21 | 2012-02-23 | Toshiba Corp | 半導体装置 |
| JP2012156362A (ja) * | 2011-01-27 | 2012-08-16 | Fujitsu Ltd | 伝送線路、集積回路搭載装置および通信機モジュール |
| JP2015088975A (ja) * | 2013-10-31 | 2015-05-07 | 三菱電機株式会社 | 増幅器 |
| JP2016225636A (ja) * | 2016-07-25 | 2016-12-28 | 富士通株式会社 | 集積回路搭載装置および通信機モジュール |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8431973B2 (en) * | 2008-12-10 | 2013-04-30 | Kabushiki Kaisha Toshiba | High frequency semiconductor device |
-
1981
- 1981-02-25 JP JP1981025689U patent/JPS6114183Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03121606A (ja) * | 1989-10-05 | 1991-05-23 | Nec Corp | マイクロ波ミリ波高出力トランジスタ |
| JP2012156362A (ja) * | 2011-01-27 | 2012-08-16 | Fujitsu Ltd | 伝送線路、集積回路搭載装置および通信機モジュール |
| US9007152B2 (en) | 2011-01-27 | 2015-04-14 | Fujitsu Limited | Transmission line, impedance transformer, integrated circuit mounted device, and communication device module |
| JP2012039160A (ja) * | 2011-11-21 | 2012-02-23 | Toshiba Corp | 半導体装置 |
| JP2015088975A (ja) * | 2013-10-31 | 2015-05-07 | 三菱電機株式会社 | 増幅器 |
| JP2016225636A (ja) * | 2016-07-25 | 2016-12-28 | 富士通株式会社 | 集積回路搭載装置および通信機モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6114183Y2 (https=) | 1986-05-02 |