JPS57138422U - - Google Patents

Info

Publication number
JPS57138422U
JPS57138422U JP1981025689U JP2568981U JPS57138422U JP S57138422 U JPS57138422 U JP S57138422U JP 1981025689 U JP1981025689 U JP 1981025689U JP 2568981 U JP2568981 U JP 2568981U JP S57138422 U JPS57138422 U JP S57138422U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981025689U
Other versions
JPS6114183Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981025689U priority Critical patent/JPS6114183Y2/ja
Publication of JPS57138422U publication Critical patent/JPS57138422U/ja
Application granted granted Critical
Publication of JPS6114183Y2 publication Critical patent/JPS6114183Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Amplifiers (AREA)
  • Microwave Amplifiers (AREA)
JP1981025689U 1981-02-25 1981-02-25 Expired JPS6114183Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981025689U JPS6114183Y2 (ja) 1981-02-25 1981-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981025689U JPS6114183Y2 (ja) 1981-02-25 1981-02-25

Publications (2)

Publication Number Publication Date
JPS57138422U true JPS57138422U (ja) 1982-08-30
JPS6114183Y2 JPS6114183Y2 (ja) 1986-05-02

Family

ID=29823384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981025689U Expired JPS6114183Y2 (ja) 1981-02-25 1981-02-25

Country Status (1)

Country Link
JP (1) JPS6114183Y2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03121606A (ja) * 1989-10-05 1991-05-23 Nec Corp マイクロ波ミリ波高出力トランジスタ
JP2012039160A (ja) * 2011-11-21 2012-02-23 Toshiba Corp 半導体装置
JP2012156362A (ja) * 2011-01-27 2012-08-16 Fujitsu Ltd 伝送線路、集積回路搭載装置および通信機モジュール
JP2015088975A (ja) * 2013-10-31 2015-05-07 三菱電機株式会社 増幅器
JP2016225636A (ja) * 2016-07-25 2016-12-28 富士通株式会社 集積回路搭載装置および通信機モジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431973B2 (en) * 2008-12-10 2013-04-30 Kabushiki Kaisha Toshiba High frequency semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03121606A (ja) * 1989-10-05 1991-05-23 Nec Corp マイクロ波ミリ波高出力トランジスタ
JP2012156362A (ja) * 2011-01-27 2012-08-16 Fujitsu Ltd 伝送線路、集積回路搭載装置および通信機モジュール
US9007152B2 (en) 2011-01-27 2015-04-14 Fujitsu Limited Transmission line, impedance transformer, integrated circuit mounted device, and communication device module
JP2012039160A (ja) * 2011-11-21 2012-02-23 Toshiba Corp 半導体装置
JP2015088975A (ja) * 2013-10-31 2015-05-07 三菱電機株式会社 増幅器
JP2016225636A (ja) * 2016-07-25 2016-12-28 富士通株式会社 集積回路搭載装置および通信機モジュール

Also Published As

Publication number Publication date
JPS6114183Y2 (ja) 1986-05-02

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