JPS5713515B2 - - Google Patents

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Publication number
JPS5713515B2
JPS5713515B2 JP4423773A JP4423773A JPS5713515B2 JP S5713515 B2 JPS5713515 B2 JP S5713515B2 JP 4423773 A JP4423773 A JP 4423773A JP 4423773 A JP4423773 A JP 4423773A JP S5713515 B2 JPS5713515 B2 JP S5713515B2
Authority
JP
Japan
Prior art keywords
copper
substrate
metals
heating
direct bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4423773A
Other languages
Japanese (ja)
Other versions
JPS4917381A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4917381A publication Critical patent/JPS4917381A/ja
Publication of JPS5713515B2 publication Critical patent/JPS5713515B2/ja
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6586—Processes characterised by the flow of gas
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/08—Non-oxidic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/341—Silica or silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/346—Titania or titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/403—Refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/408—Noble metals, e.g. palladium, platina or silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/54—Oxidising the surface before joining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/60—Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/74—Forming laminates or joined articles comprising at least two different interlayers separated by a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Chemical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A method is described for direct bonding of metallic members to non-metallic members at elevated temperatures in a controlled reactive atmosphere without resorting to the use of electroless plating, vacuum deposition or intermediate metals. The method comprises placing a metal member such as copper, for example, in contact with a non-metallic substrate, such as alumina, heating the metal member and the substrate to a temperature slightly below the melting of the metal, e.g., between approximately 1,065 DEG C. and 1,080 DEG C. for copper, the heating being performed in a reactive atmosphere, such as an oxidizing atmosphere, for a sufficient time to create a copper-copper oxide eutectic melt which, upon cooling, bonds the copper to the substrate. Various metals, non-metals and reactive gases are described for direct bonding.
JP4423773A 1972-04-20 1973-04-20 Expired JPS5713515B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24588972A 1972-04-20 1972-04-20

Publications (2)

Publication Number Publication Date
JPS4917381A JPS4917381A (en) 1974-02-15
JPS5713515B2 true JPS5713515B2 (en) 1982-03-17

Family

ID=22928519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4423773A Expired JPS5713515B2 (en) 1972-04-20 1973-04-20

Country Status (6)

Country Link
US (1) US3766634A (en)
JP (1) JPS5713515B2 (en)
DE (1) DE2319854C2 (en)
FR (1) FR2181049B1 (en)
GB (1) GB1394322A (en)
IT (1) IT983841B (en)

Families Citing this family (214)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911570A (en) * 1973-08-21 1975-10-14 Electro Oxide Corp Electrical connector and method of making
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
JPS54157277A (en) * 1978-06-01 1979-12-12 Nippon Electric Co Method of printed board for microwave
CH633391A5 (en) * 1978-11-22 1982-11-30 Bbc Brown Boveri & Cie DISC ROTOR FOR AN ELECTRICAL MACHINE.
JPS55104979A (en) * 1979-02-02 1980-08-11 Kogyo Gijutsuin Adhesion of ceramic molded body to transition metal
JPS599510B2 (en) * 1979-10-15 1984-03-02 昭栄化学工業株式会社 Manufacturing method of ceramic piezoelectric material for spark plugs
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
US4245488A (en) * 1980-01-04 1981-01-20 General Electric Company Use of motor power control circuit losses in a clothes washing machine
DE3036128C2 (en) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Process for direct bonding of copper foils to oxide ceramic substrates
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
JPS58102532A (en) * 1981-12-15 1983-06-18 Toshiba Corp Semiconductor device
DE3204167A1 (en) * 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim METHOD FOR DIRECTLY JOINING METAL PIECES WITH OXIDE CERAMIC SUBSTRATES
US4500029A (en) * 1982-06-11 1985-02-19 General Electric Company Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such assembly
DE3223948A1 (en) * 1982-06-26 1983-12-29 Tigra Verschleiß- und Werkzeugtechnik GmbH, 7240 Horb Method of soldering ceramic and metallic materials to one another
EP0097944B1 (en) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Method for directly bonding ceramic and metal members and laminated body of the same
DE3233022A1 (en) * 1982-09-06 1984-03-08 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Method for the direct bonding of a body to a ceramic substrate
DE3241926A1 (en) * 1982-11-12 1984-05-17 MTU Motoren- und Turbinen-Union München GmbH, 8000 München CONNECTION OF A CERAMIC ROTATION COMPONENT TO A METAL ROTATION COMPONENT FOR FLOW MACHINES, IN PARTICULAR GAS TURBINE ENGINES
JPS59150453A (en) * 1982-12-23 1984-08-28 Toshiba Corp Manufacture of substrate for seiconductor module
JPS59121860A (en) * 1982-12-28 1984-07-14 Toshiba Corp Substrate for semiconductor
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
GB8305366D0 (en) * 1983-02-25 1983-03-30 Secr Defence Cathode ray tube
JPS59190279A (en) * 1983-04-13 1984-10-29 株式会社東芝 Ceramic structure and manufacture
ATE23080T1 (en) * 1983-06-03 1986-11-15 Bbc Brown Boveri & Cie COLLECTOR FOR AN ELECTRICAL MACHINE AND PROCESS FOR ITS MANUFACTURE.
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
DE3324661A1 (en) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim METHOD FOR DIRECTLY CONNECTING METAL TO CERAMIC
JPS60107845A (en) * 1983-11-17 1985-06-13 Toshiba Corp Circuit substrate for semiconductor
US4582240A (en) * 1984-02-08 1986-04-15 Gould Inc. Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components
US4563383A (en) * 1984-03-30 1986-01-07 General Electric Company Direct bond copper ceramic substrate for electronic applications
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (en) * 1984-12-10 1988-08-03 Kollmorgen Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4602731A (en) * 1984-12-24 1986-07-29 Borg-Warner Corporation Direct liquid phase bonding of ceramics to metals
US4631099A (en) * 1985-01-04 1986-12-23 Agency Of Industrial Science & Technology Method for adhesion of oxide type ceramics with copper or alloy thereof
DE3633907A1 (en) * 1986-08-02 1988-02-04 Altan Akyuerek Method for firmly bonding a copper body to a substrate
DE3639021A1 (en) * 1986-11-14 1988-05-26 Philips Patentverwaltung METHOD FOR SOLDERING CERAMIC COMPONENTS
EP0273227A3 (en) * 1986-12-22 1989-01-25 Kalman F. Zsamboky A method of improving bond strength between a metal layer and a non-metallic substrate
FR2615049B1 (en) * 1987-05-04 1989-06-16 Alsthom MANIFOLD FOR ROTATING ELECTRIC MACHINE AND MANUFACTURING METHOD THEREOF
FR2623046B1 (en) * 1987-11-10 1990-03-23 Telemecanique Electrique METHOD FOR BINDING A COPPER SHEET TO A SUBSTRATE OF ELECTRICALLY INSULATING MATERIAL
US4788765A (en) * 1987-11-13 1988-12-06 Gentron Corporation Method of making circuit assembly with hardened direct bond lead frame
JP2755594B2 (en) * 1988-03-30 1998-05-20 株式会社 東芝 Ceramic circuit board
US4831723A (en) * 1988-04-12 1989-05-23 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US4990720A (en) * 1988-04-12 1991-02-05 Kaufman Lance R Circuit assembly and method with direct bonded terminal pin
US5070602A (en) * 1988-04-12 1991-12-10 Lance R. Kaufman Method of making a circuit assembly
US5032691A (en) * 1988-04-12 1991-07-16 Kaufman Lance R Electric circuit assembly with voltage isolation
US4902854A (en) * 1988-04-12 1990-02-20 Kaufman Lance R Hermetic direct bond circuit assembly
US4924292A (en) * 1988-04-12 1990-05-08 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US4879633A (en) * 1988-04-12 1989-11-07 Kaufman Lance R Direct bond circuit assembly with ground plane
US4860164A (en) * 1988-09-01 1989-08-22 Kaufman Lance R Heat sink apparatus with electrically insulative intermediate conduit portion for coolant flow
DE3930858C2 (en) * 1988-09-20 2002-01-03 Peter H Maier module Design
DE3930859C2 (en) * 1988-09-20 1997-04-30 Schulz Harder Juergen Process for soldering at least two elements
US5027255A (en) * 1988-10-22 1991-06-25 Westinghouse Electric Co. High performance, high current miniaturized low voltage power supply
DE3931551C2 (en) * 1989-09-22 1993-11-18 Schulz Harder Juergen Method of making a substrate
US5100740A (en) * 1989-09-25 1992-03-31 General Electric Company Direct bonded symmetric-metallic-laminate/substrate structures
US5653379A (en) * 1989-12-18 1997-08-05 Texas Instruments Incorporated Clad metal substrate
US4996116A (en) * 1989-12-21 1991-02-26 General Electric Company Enhanced direct bond structure
US5241216A (en) * 1989-12-21 1993-08-31 General Electric Company Ceramic-to-conducting-lead hermetic seal
US5273203A (en) * 1989-12-21 1993-12-28 General Electric Company Ceramic-to-conducting-lead hermetic seal
US5164359A (en) * 1990-04-20 1992-11-17 Eaton Corporation Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate
JP3011433B2 (en) * 1990-05-25 2000-02-21 株式会社東芝 Manufacturing method of ceramic circuit board
US5418002A (en) * 1990-12-24 1995-05-23 Harris Corporation Direct bonding of copper to aluminum nitride substrates
DE4103294C2 (en) * 1991-02-04 2000-12-28 Altan Akyuerek Process for the production of ceramic printed circuit boards with vias
JPH05219690A (en) * 1991-02-28 1993-08-27 Hitachi Ltd Ceramic sliding collector
DE4222973A1 (en) * 1992-07-13 1994-01-20 Asea Brown Boveri Bi-directional semiconductor switch
EP0702509B1 (en) 1992-07-17 2000-01-19 Vlt Corporation Packaging electrical components
DE4318061C2 (en) * 1993-06-01 1998-06-10 Schulz Harder Juergen Method of manufacturing a metal-ceramic substrate
DE4319848C2 (en) * 1993-06-03 1995-12-21 Schulz Harder Juergen Method of manufacturing a metal-ceramic substrate
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
CA2140311A1 (en) * 1994-01-14 1995-07-15 Joseph P. Mennucci Multilayer laminate product and process
US5490627A (en) * 1994-06-30 1996-02-13 Hughes Aircraft Company Direct bonding of copper composites to ceramics
US5586714A (en) * 1994-10-06 1996-12-24 Board Of Regents Of The University Of Nebraska Method of bonding metal to a non-metal substrate
US5644103A (en) 1994-11-10 1997-07-01 Vlt Corporation Packaging electrical components having a scallop formed in an edge of a circuit board
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
AU5960698A (en) * 1997-01-17 1998-08-07 California Institute Of Technology Microwave technique for brazing materials
DE19715540C2 (en) 1997-04-15 2002-02-07 Curamik Electronics Gmbh Method of manufacturing a domed metal-ceramic substrate
DE19729677B4 (en) * 1997-07-11 2006-05-18 Curamik Electronics Gmbh Housing for semiconductor devices, in particular for power semiconductor components
DE19749987B4 (en) * 1997-07-11 2008-09-25 Curamik Electronics Gmbh Housing for semiconductor devices, in particular for power semiconductor components
DE19753149C2 (en) * 1997-11-12 1999-09-30 Curamik Electronics Gmbh Method of manufacturing a ceramic-metal substrate
KR100352993B1 (en) 1998-12-07 2002-09-18 가부시끼가이샤 히다치 세이사꾸쇼 Composite material and application thereof
DE19927046B4 (en) * 1999-06-14 2007-01-25 Electrovac Ag Ceramic-metal substrate as a multi-substrate
DE19930207C2 (en) * 1999-06-22 2001-12-06 Schulz Harder Juergen Process for the production of substrates with structured metallizations and holding and fixing element for use in this process
DE19945794C2 (en) * 1999-09-15 2002-12-19 Curamik Electronics Gmbh Method for producing a metal-ceramic circuit board with through contacts
JP2001156196A (en) 1999-09-17 2001-06-08 Toshiba Corp High-frequency package and method for manufacturing the same
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
AU2629901A (en) 2000-01-06 2001-07-16 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (mems)
DE10047525B4 (en) * 2000-09-22 2005-06-30 Curamik Electronics Gmbh A method of producing a shaped article using a raw material containing silicon carbide in powder or particulate form and copper, and shaped articles thus produced
EP1227353B1 (en) 2001-01-16 2005-05-04 Curamik Electronics GmbH Laser mirror and method for manufacturing the same
US6888232B2 (en) * 2001-08-15 2005-05-03 Micron Technology Semiconductor package having a heat-activated source of releasable hydrogen
DE10148550B4 (en) * 2001-10-01 2007-03-29 Electrovac Ag Process for producing metal-ceramic composite materials, in particular metal-ceramic substrates
JP3969987B2 (en) * 2001-10-01 2007-09-05 Ｄｏｗａホールディングス株式会社 Ceramic / alloy joints
US20030146499A1 (en) * 2001-12-18 2003-08-07 Yasuo Kondo Composite material including copper and cuprous oxide and application thereof
DE10212495B4 (en) * 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Method for producing a metal-ceramic substrate, preferably a copper-ceramic substrate
US7754976B2 (en) 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
US6848316B2 (en) 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
JP3868854B2 (en) * 2002-06-14 2007-01-17 Ｄｏｗａホールディングス株式会社 Metal-ceramic bonded body and manufacturing method thereof
DE10227658B4 (en) * 2002-06-20 2012-03-08 Curamik Electronics Gmbh Metal-ceramic substrate for electrical circuits or modules, method for producing such a substrate and module with such a substrate
DE10229712B4 (en) * 2002-07-02 2009-06-25 Jenoptik Laserdiode Gmbh Semiconductor module
DE10229711B4 (en) * 2002-07-02 2009-09-03 Curamik Electronics Gmbh Semiconductor module with microcooler
US7159757B2 (en) * 2002-09-26 2007-01-09 Dowa Mining Co., Ltd. Metal/ceramic bonding article and method for producing same
DE10261402A1 (en) 2002-12-30 2004-07-15 Schulz-Harder, Jürgen, Dr.-Ing. Heat sink in the form of a heat pipe and method for producing such a heat sink
DE10320838B4 (en) * 2003-05-08 2014-11-06 Rogers Germany Gmbh Fiber-reinforced metal-ceramic / glass composite material as a substrate for electrical applications, method for producing such a composite material and use of this composite material
DE10327360B4 (en) 2003-06-16 2012-05-24 Curamik Electronics Gmbh Method for producing a ceramic-metal substrate
DE102004012232B4 (en) * 2004-02-20 2006-11-16 Electrovac Ag Method for producing plate stacks, in particular for producing condenser consisting of at least one plate stack
JP2005343768A (en) 2004-06-07 2005-12-15 Toyota Central Res & Dev Lab Inc Metal/ceramic joined product and method of manufacturing the same
DE102004033933B4 (en) * 2004-07-08 2009-11-05 Electrovac Ag Method for producing a metal-ceramic substrate
DE102005042554B4 (en) 2005-08-10 2008-04-30 Curamik Electronics Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
EP1959528B1 (en) 2007-02-13 2017-04-12 Laserline Gesellschaft für Entwicklung und Vertrieb von Diodenlasern mbH Diode laser assembly and method for producing such an assembly
DE102007008027A1 (en) 2007-02-13 2008-08-21 Curamik Electronics Gmbh Diode laser arrangement and method for producing such an arrangement
DE102007030389B4 (en) 2007-03-30 2015-08-13 Rogers Germany Gmbh Module unit with a heat sink
DE102009041574A1 (en) 2008-10-29 2010-05-12 Electrovac Ag Composite material, method of making a composite, and adhesive or bonding material
DE102009007625A1 (en) * 2008-11-14 2010-05-20 Osram Opto Semiconductors Gmbh Composite substrate for a semiconductor chip
DE102009015520A1 (en) 2009-04-02 2010-10-07 Electrovac Ag Metal-ceramic substrate
DE102009022877B4 (en) 2009-04-29 2014-12-24 Rogers Germany Gmbh Cooled electrical unit
JP2012528471A (en) 2009-05-27 2012-11-12 キュラミーク エレクトロニクス ゲーエムベーハー Cooled electrical component unit
DE102009033029A1 (en) 2009-07-02 2011-01-05 Electrovac Ag Electronic device
DE102010007919B4 (en) 2010-02-12 2022-03-03 Rogers Germany Gmbh Process for producing metal-ceramic substrates and metal-ceramic substrate produced by this process
DE202010009472U1 (en) 2010-04-07 2011-02-10 Electrovac Ag Packaging for metal-ceramic substrates
DE102010018668B4 (en) 2010-04-07 2012-11-15 Curamik Electronics Gmbh Packaging unit for metal-ceramic substrates
DE102010024520B4 (en) 2010-06-21 2017-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for increasing the thermo-mechanical resistance of a metal-ceramic substrate
DE102010025311B4 (en) 2010-06-28 2014-08-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for applying a metallic layer to a ceramic substrate, use of the method and composite material
DE102010025313A1 (en) 2010-06-28 2011-12-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Producing structured electrically conductive layer on substrate or layer made of ceramic material, comprises e.g. providing mixture of metallic material and oxide of it, applying mixture on substrate or layer, and structuring
DE102010049499B4 (en) 2010-10-27 2014-04-10 Curamik Electronics Gmbh Metal-ceramic substrate and method for producing such a substrate
JP6044635B2 (en) 2011-07-29 2016-12-14 ロジャース ジャーマニー ゲーエムベーハー Packaging for substrates and packaging units comprising such packaging
DE102012110382B4 (en) 2011-12-21 2021-02-18 Rogers Germany Gmbh Substrate and method for manufacturing a substrate
US8448842B1 (en) 2011-12-22 2013-05-28 Vaclong Vacuum Technology Co., Ltd. Advanced copper bonding (ACB) with ceramic substrate technology
DE102012101057A1 (en) 2011-12-27 2013-06-27 Curamik Electronics Gmbh Process for the preparation of DCB substrates
DE102012102090A1 (en) 2012-01-31 2013-08-01 Curamik Electronics Gmbh Thermoelectric generator module, metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102012102611B4 (en) 2012-02-15 2017-07-27 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
WO2013143534A1 (en) 2012-03-30 2013-10-03 Curamik Electronics Gmbh Tunnel furnace
DE102012102787B4 (en) 2012-03-30 2015-04-16 Rogers Germany Gmbh Method for producing metal-ceramic substrates
DE102013102797A1 (en) 2012-03-30 2013-10-02 Curamik Electronics Gmbh Tunnel furnace for heat treatment of material to be treated, has transport element lubricants and turnable and/or transferable stocks or supporting items or rolling elements are provided between carrier and furnace main portion
DE102012103786B4 (en) 2012-04-30 2017-05-18 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102012104903B4 (en) 2012-05-10 2023-07-13 Rogers Germany Gmbh Process for producing metal-ceramic substrates and metal-ceramic substrate produced by this process
DE102012107399B4 (en) 2012-07-10 2014-09-11 Rogers Germany Gmbh Process for producing metal-ceramic substrates and metal-ceramic substrate
DE102012106244B4 (en) 2012-07-11 2020-02-20 Rogers Germany Gmbh Metal-ceramic substrate
DE102012107570B4 (en) 2012-08-17 2017-08-03 Rogers Germany Gmbh Process for the production of hollow bodies, in particular of coolers, hollow bodies and coolers containing electrical or electronic assemblies
DE102012110322B4 (en) 2012-10-29 2014-09-11 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102013102540B4 (en) 2013-02-22 2019-07-04 Rogers Germany Gmbh Metal-ceramic substrate, module arrangement and method for producing a metal-ceramic substrate
DE102013102637B4 (en) 2013-03-14 2017-08-31 Rogers Germany Gmbh Metal-ceramic substrate and method for producing such a metal-ceramic substrate and arrangement of such metal-ceramic substrates
DE102013104739B4 (en) 2013-03-14 2022-10-27 Rogers Germany Gmbh Metal-ceramic substrates and method for producing a metal-ceramic substrate
DE102013104055B4 (en) 2013-04-22 2023-08-31 Rogers Germany Gmbh Base substrate, metal-ceramic substrate produced from a base substrate and method for producing a base substrate
DE102013105528B4 (en) 2013-05-29 2021-09-02 Rogers Germany Gmbh Metal-ceramic substrate and a method for producing a metal-ceramic substrate
DE102013108610A1 (en) 2013-08-06 2015-02-12 Rogers Germany Gmbh Metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102013013842B4 (en) 2013-08-20 2015-10-15 Rogers Germany Gmbh Process for producing metal-ceramic substrates and metal-ceramic substrate
DE102013113736B4 (en) 2013-12-10 2019-11-14 Rogers Germany Gmbh Method for producing a metal-ceramic substrate
DE102013113734B4 (en) 2013-12-10 2018-03-08 Rogers Germany Gmbh Method for producing a metal-ceramic substrate
DE102014106694B3 (en) * 2014-05-13 2015-04-02 Rogers Germany Gmbh Method for metallizing at least one plate-shaped ceramic substrate and metal-ceramic substrate
DE102014215377B4 (en) 2014-08-05 2019-11-07 Heraeus Deutschland GmbH & Co. KG Method for producing double-sided metallized ceramic substrates
DE102014224588B4 (en) 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Method for producing a plate-shaped metallized ceramic substrate, carrier for producing the substrate and use of the carrier
DE102014119386B4 (en) 2014-12-22 2019-04-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a metal-ceramic substrate and associated metal-ceramic substrate
DE102015102657B4 (en) 2015-02-25 2018-07-19 Rogers Germany Gmbh Method for producing a copper-ceramic composite substrate
JP7032042B2 (en) 2015-12-22 2022-03-08 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー Direct-bonded copper substrate improved with thick film paste
HUE053549T2 (en) 2016-02-26 2021-07-28 Heraeus Deutschland Gmbh & Co Kg Copper ceramic composite
EP3210957B1 (en) 2016-02-26 2019-01-02 Heraeus Deutschland GmbH & Co. KG Copper ceramic composite
DE202016008307U1 (en) 2016-02-26 2017-07-10 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
EP3210956B1 (en) 2016-02-26 2018-04-11 Heraeus Deutschland GmbH & Co. KG Copper ceramic composite
DE102016203112B4 (en) 2016-02-26 2019-08-29 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
DE202016008371U1 (en) 2016-02-26 2017-09-11 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
HUE053117T2 (en) 2016-02-26 2021-06-28 Heraeus Deutschland Gmbh & Co Kg Copper ceramic composite
DE202016008370U1 (en) 2016-02-26 2017-09-11 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
DE102016203030A1 (en) 2016-02-26 2017-08-31 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
DE202016008286U1 (en) 2016-02-26 2017-06-21 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
DE202016008287U1 (en) 2016-02-26 2017-06-21 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite
DE102016203058B3 (en) 2016-02-26 2017-05-18 Heraeus Deutschland GmbH & Co. KG Copper-ceramic composite and module
EP3301082A1 (en) 2016-09-30 2018-04-04 Infineon Technologies AG Method for producing a metal-ceramic substrate, and a metal-ceramic substrate
DE102016118784A1 (en) 2016-10-04 2018-04-05 Infineon Technologies Ag Chip carrier, configured for delamination-free encapsulation and stable sintering
EP3326986B1 (en) 2016-11-28 2020-11-25 Infineon Technologies AG Process for the manufacture of a metal-ceramic substrate
DE102016125348B4 (en) 2016-12-22 2020-06-25 Rogers Germany Gmbh Carrier substrate for electrical components and method for producing a carrier substrate
DE102017114891A1 (en) 2017-07-04 2019-01-10 Rogers Germany Gmbh Process for producing a via in a carrier layer made of a ceramic and carrier layer with plated through hole
DE102017121015A1 (en) 2017-09-12 2019-03-14 Rogers Germany Gmbh Adapter element for connecting a component such as a laser diode to a heat sink, a system of a laser diode, a heat sink and an adapter element and method for producing an adapter element
DE102017128316B4 (en) 2017-11-29 2019-12-05 Rogers Germany Gmbh Method for producing a metal-ceramic substrate and metal-ceramic substrate
DE102017128308B4 (en) 2017-11-29 2020-04-23 Rogers Germany Gmbh Process for the production of a metal-ceramic substrate
DE102018101198A1 (en) * 2018-01-19 2019-07-25 Osram Opto Semiconductors Gmbh METHOD FOR PRODUCING A HOUSING COVER FOR A LASER COMPONENT AND HOUSING COVER FOR A LASER COMPONENT AND A LASER COMPONENT
DE102018104521B4 (en) 2018-02-28 2022-11-17 Rogers Germany Gmbh metal-ceramic substrates
DE102018104532B4 (en) 2018-02-28 2023-06-29 Rogers Germany Gmbh Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate
DE102018207955B4 (en) 2018-05-22 2023-05-17 Schweizer Electronic Ag Printed circuit board module with integrated power electronic metal-ceramic module and method for its production
DE102018123681A1 (en) 2018-09-26 2020-03-26 Rogers Germany Gmbh Carrier substrate for electrical, in particular electronic components and method for producing a carrier substrate
CN109946249B (en) * 2019-03-18 2021-06-01 江苏科技大学 Method for colorimetric determination of hydrogen sulfide by using headspace single-drop liquid phase microextraction method and intelligent equipment
DE102019110106A1 (en) 2019-04-17 2020-10-22 Rogers Germany Gmbh Method for producing a composite ceramic and composite ceramic produced using such a method
DE102019113308A1 (en) 2019-05-20 2020-11-26 Rogers Germany Gmbh A method for producing a metal-ceramic substrate and a metal-ceramic substrate produced by such a method
DE102019113714A1 (en) 2019-05-23 2020-11-26 Rogers Germany Gmbh Adapter element for connecting an electronic component to a heat sink element, system with such an adapter element and method for producing such an adapter element
JP6782996B1 (en) 2019-07-08 2020-11-11 株式会社ワールドメタル Bonded base material and metal layer
DE102019125124A1 (en) 2019-09-18 2021-03-18 Rogers Germany Gmbh Process for processing a metal-ceramic substrate, system for such a process and metal-ceramic substrates produced with such a process
TWI761734B (en) 2019-11-26 2022-04-21 財團法人工業技術研究院 Direct bonded copper ceramic substrate
DE102019134004A1 (en) 2019-12-11 2021-06-17 Rogers Germany Gmbh Process for processing a metal-ceramic substrate, system for such a process and metal-ceramic substrates produced with such a process
DE102019135097A1 (en) 2019-12-19 2021-06-24 Rogers Germany Gmbh A method for producing a metal-ceramic substrate and a metal-ceramic substrate produced by such a method
DE102019135146B4 (en) 2019-12-19 2022-11-24 Rogers Germany Gmbh metal-ceramic substrate
DE102019135099A1 (en) 2019-12-19 2021-06-24 Rogers Germany Gmbh A method for producing a metal-ceramic substrate and a metal-ceramic substrate produced by such a method
DE102020106521A1 (en) 2020-03-10 2021-09-16 Rogers Germany Gmbh Electronic module and method for manufacturing an electronic module
DE102020119209A1 (en) 2020-07-21 2022-01-27 Rogers Germany Gmbh Power module and method of manufacturing a power module
DE102020119208A1 (en) 2020-07-21 2022-01-27 Rogers Germany Gmbh Method for producing a metal-ceramic substrate and metal-ceramic substrate produced by such a method
DE102021100463A1 (en) 2021-01-13 2022-07-14 Rogers Germany Gmbh Method of making a metal-ceramic substrate and metal-ceramic substrate made by such a method
EP4032870A1 (en) 2021-01-22 2022-07-27 Heraeus Deutschland GmbH & Co. KG Structured metal / ceramic substrate and method for structuring metal-ceramic substrates
DE102021105109A1 (en) 2021-03-03 2022-09-08 Rogers Germany Gmbh Method for processing a metal-ceramic substrate and metal-ceramic substrate
DE102021105520B4 (en) 2021-03-08 2022-10-27 Rogers Germany Gmbh Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate
DE102021107690A1 (en) 2021-03-26 2022-09-29 Rogers Germany Gmbh Method for producing a metal-ceramic substrate and metal-ceramic substrate produced by such a method
DE102021107872A1 (en) 2021-03-29 2022-09-29 Rogers Germany Gmbh Carrier substrate for electrical, in particular electronic, components and method for producing a carrier substrate
EP4112586A1 (en) 2021-06-29 2023-01-04 Heraeus Deutschland GmbH & Co. KG Method for producing a metal/ceramic substrate using a continuous furnace
EP4112587A1 (en) 2021-06-29 2023-01-04 Heraeus Deutschland GmbH & Co. KG Method for producing a metal-ceramic substrate though rapid heating
DE102021125557A1 (en) 2021-10-01 2023-04-06 Rogers Germany Gmbh Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate
DE102021126529A1 (en) 2021-10-13 2023-04-13 Rogers Germany Gmbh Process for producing metal-ceramic substrates and metal-ceramic substrate produced by such a process
EP4186880A1 (en) 2021-11-26 2023-05-31 Heraeus Deutschland GmbH & Co. KG Metal-ceramic substrate, method for producing the same and module
EP4311819A1 (en) 2022-07-29 2024-01-31 Heraeus Electronics GmbH & Co. KG Metal-ceramic substrate with contact area
EP4311818A1 (en) 2022-07-29 2024-01-31 Heraeus Electronics GmbH & Co. KG Metal-ceramic substrate with contact area
EP4332267A1 (en) 2022-09-05 2024-03-06 Heraeus Electronics GmbH & Co. KG Method for producing a metal-ceramic substrate and metal-ceramic substrate
DE102022129493A1 (en) 2022-11-08 2024-05-08 Rogers Germany Gmbh Metal-ceramic substrate and process for producing metal-ceramic substrates

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB784931A (en) *
US2482178A (en) * 1944-02-29 1949-09-20 Western Electric Co Composite structure for forming a seal with glass
US2564738A (en) * 1947-02-25 1951-08-21 Foerderung Forschung Gmbh Method of forming a vacuum-tight bond between ceramics and metals
GB761045A (en) * 1952-08-29 1956-11-07 Lodge Plugs Ltd Improvements in or relating to the bonding of ceramics with copper
NL83997C (en) * 1953-05-12
US3030704A (en) * 1957-08-16 1962-04-24 Gen Electric Method of making non-rectifying contacts to silicon carbide
US3128545A (en) * 1959-09-30 1964-04-14 Hughes Aircraft Co Bonding oxidized materials
US3366409A (en) * 1965-06-10 1968-01-30 Philips Corp Ceramic-to-metal seal
NL153508B (en) * 1966-11-30 1977-06-15 Philips Nv PROCEDURE FOR VACUUM-TIGHT CONNECTION OF A CERAMIC OBJECT TO A METAL OBJECT AND ELECTRIC DISCHARGE TUBE EQUIPPED WITH A POWER SUPPLY CONDUCTOR OBTAINED IN ACCORDANCE WITH THIS PROCEDURE.
US3517432A (en) * 1968-05-02 1970-06-30 Atomic Energy Commission Diffusion bonding of ceramics
BE759209A (en) * 1969-11-25 1971-04-30 Western Electric Co GLASS TO METAL WELDING PROCESS
US3717926A (en) * 1970-01-29 1973-02-27 G Kravetsky Method of joining graphite articles
US3676292A (en) * 1970-10-07 1972-07-11 Olin Corp Composites of glass-ceramic-to-metal,seals and method of making same

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