DE102012106244B4 - Metal-ceramic substrate - Google Patents

Abstract

Metal-ceramic substrate with a plurality of layers (12.1, 12.2) forming a substrate body (12), each consisting of a ceramic material and lying in a stack on top of one another and connected to one another in a planar manner to form the substrate body (12, 21), furthermore with at least one of an outer metallization (9) formed of a metallic material, which is provided on at least one surface side of the substrate body (12, 21) and is structured to form conductor tracks, contact surfaces and / or fastening surfaces for regions (9.1, 9.2) forming components (11) having a cooler structure which is provided exclusively in the layers (12.2) made of the ceramic material and is formed by at least two adjoining layers (12.2) made of the ceramic material, which is used to form at least one cooling channel (13, 26) which is provided by a cooling medium can be flowed through, are provided with a plurality of openings (15) such that the cooling channel (13, 26) has flow paths for the cooling medium which branch in the direction parallel to the surface sides of the layers (12.2, 23, 24) and perpendicular thereto, the openings (15) in the layers (12.2) forming the cooler structure form a sieve-like structure in which the openings (15) are surrounded by intersecting material webs (16) made of the ceramic material and are separated from one another by them, the openings (15) in adjacent layers (12.2) forming the cooler structure being offset relative to one another in this way are arranged in such a way that each opening (15) in a layer (12.2) is opposite a material web (16) made of the ceramic material of an adjacent layer (12.2), with intersection points (17) of the material webs (16) of each layer (12.2) crossing points (17 ) connect the material webs (16) of the adjacent layer (12.2) to one another in a direction perpendicular to the surface sides of the layers (12.2) and thereby in form posts (18) within the cooling structure and the posts (18) formed by the crossing points (17) are provided with a core made of metallic material, which ends at a layer (12.1) made of a ceramic material.

Description

The invention relates to a metal-ceramic substrate according to patent claim 1.

Metal-ceramic substrates, in particular also those in the form of printed circuit boards for electrical and electronic circuits or modules, and methods for producing such substrates are known. As a rule, these substrates consist of a ceramic insulating layer, each of which is provided with a metallization on its two surface sides. This is then, for example, a metal foil, e.g. is formed from copper from a copper alloy, which is connected over the entire surface to the ceramic insulating layer using a suitable method.

The so-called “DCB process” (direct copper bond technology) is known, for example, for connecting metal layers or sheets (for example copper sheets or foils) to one another and / or to ceramic or ceramic layers, using metal - or copper sheets or metal or copper foils, which have on their surface sides a layer or a coating (melting layer) made of a chemical compound of the metal and a reactive gas, preferably oxygen. In this example in the US 3,744,120 A. or in the DE 23 19 854 A The described process forms this layer or this coating (melting layer) a eutectic with a melting temperature below the melting temperature of the metal (e.g. copper), so that by placing the film on the ceramic and by heating all layers, these can be connected to one another, namely by melting the Metals or copper essentially only in the area of the melting layer or oxide layer.

• • Oxidieren einer Kupferfolie derart, dass sich eine gleichmäßige Kupferoxidschicht ergibt;
• • Auflegen des Kupferfolie auf die Keramikschicht;
• • Erhitzen des Verbundes auf eine Prozesstemperatur zwischen etwa 1025 bis 1083°C, z.B. auf ca. 1071 °C;
• • Abkühlen auf Raumtemperatur.

This DCB process then has, for example, the following process steps:

• • Oxidizing a copper foil in such a way that a uniform copper oxide layer results;
• • placing the copper foil on the ceramic layer;
• • heating the composite to a process temperature between about 1025 to 1083 ° C, for example to about 1071 ° C;
• • Cool down to room temperature.

A DCB method is also described in BURGESS, JF et al .: The direct bonding of metals to ceramics and application in electronics. In: Electrocomponent Science and Technology, Vol. 2, 1976, pp. 233-240 , Analogous to this aforementioned DCB method for direct bonding of copper to copper or copper to ceramic, other direct metal bonding methods or technologies are also known with which the connection of metal layers or sheets in general and with one another is analogous / or is possible with ceramic or ceramic layers. The DCB process and the process analogous to this are referred to below as the DMB process (Direct Metal Bond process).

The so-called active soldering process is also known ( DE 22 13 115 A ; EP 0 153 618 A2 ) For example for connecting metal layers or metal foils forming metallizations, in particular also copper layers or copper foils or aluminum layers or aluminum foils with ceramic material. In this method, which is also used specifically for the production of metal-ceramic substrates, a connection between a metal foil, for example copper foil, and a ceramic substrate, for example aluminum nitride ceramic, is used at a temperature between approximately 800-1000 ° C. made of a braze, which in addition to a main component such as copper, silver and / or gold also contains an active metal. This active metal, which is, for example, at least one element from the group Hf, Ti, Zr, Nb, Ce, creates a connection between the solder and the ceramic by chemical reaction, while the connection between the solder and the metal is a metallic brazing connection ,

The invention has for its object to develop a metal-ceramic substrate according to claim 1 so that an optimal cooling effect is also achieved by power components, with a compact design of the substrate. To achieve this object, a metal-ceramic substrate is designed according to claim 1. Substrates for cooling components are also made of US 4,814,030 A . DE 100 35 170 A1 . US 2011/0308791 A1 . US 6 242 075 B1 . DE 197 10 783 A1 and US 2007/0 246 204 A1 known. EP 0 780 654 A1 describes a plate-type heat exchanger.

In the invention, all flow or cooling channels forming the cooler structure are each formed exclusively in at least one layer of ceramic. In one embodiment of the metal-ceramic substrate with a substrate body with a plurality of layers of ceramic, internal metallizations and plated-through holes are also provided, specifically outside the cooler structure. As a result, while maintaining optimal cooling, there is also the possibility of a very complex and versatile design of the conductor track structures formed by the outer and inner metallization with a reduced substrate construction volume.

For the purposes of the invention, “through-plating” means in general a region that is provided in a layer made of the ceramic material, penetrates this layer completely, ie extends from one surface side of this layer to the other surface side, consists of a metallic material and is preferably solid is formed and creates an electrical and / or thermal connection through the layer of the ceramic material.

“Ceramic material” in the sense of the invention means ceramic or mixed ceramic.

For the purposes of the invention, the expression “essentially” or “approximately” means deviations from the respectively exact value by +/- 10%, preferably by +/- 5% and / or deviations in the form of changes which are insignificant for the function.

In a further development of the invention, the metal-ceramic substrate is designed, for example,
that the cooler structure with the at least one flow channel is formed exclusively in at least two layers of the ceramic material, and / or
that the inner metallizations and / or plated-through holes are located outside the region of the substrate body that forms the cooler structure, and / or
that there is at least one inner metallization between two layers of the substrate body, of which at least one layer also forms the cooler structure with the at least one flow channel,
and or
that at least one plated-through hole is provided in a layer of the substrate body, which is also part of the cooler structure, and that this plated-through hole is located outside the area of the cooler structure,
and or
that the at least one cooler structure is formed by a plurality of adjoining layers or partial layers, each of which is formed on the at least one cooler structure by a sieve-like structure with a plurality of openings separated by material webs and material webs surrounding them and are arranged such that they are offset from one another such that each opening of a layer or partial layer, a material web is opposite an adjacent layer or partial layer and the openings form a cooler structure with branching flow paths, in particular with flow paths that branch in the axial directions parallel to the surface sides of the layers or partial layers and perpendicular thereto, preferably crossing points of the material webs of each partial layer or Layer at crossing points of the material webs of adjacent partial layers or layers in an axial direction perpendicular to the surface sides of the layers or partial layers connect each other to form posts that extend the entire height of the cooler structure,
and or
that the posts formed by the crossing points are provided according to the invention with a core made of metallic material,
and or
that the surface side of the substrate body which has at least one outer metallization is formed by a layer of the ceramic material,
and or
that the substrate body is provided with an outer metallization, preferably with an outer structured metallization, on its two sides of the surface facing away from one another and each formed by a layer of the ceramic material, and that preferably on both outer metallizations ( 9 ) at least one component is arranged,
and or
that the substrate body, with respect to its layers, its thickness and the type of material used for the layers, is symmetrical or essentially symmetrical to a central plane running parallel to the surface sides of the substrate body,
and or
that when the cooler structure is formed exclusively in at least one layer made of the ceramic material, the at least one flow channel extends to the outer metallization or at least a region of the outer metallization,
and or
that when the cooler structure is formed exclusively in at least one layer of the ceramic material between the at least one flow channel of the cooler structure and the at least one outer metallization, at least
a layer made of the ceramic material is provided, and that in this layer preferably at least one plated-through hole is formed which extends to the outer metallization,
and or
that connections for supplying and / or discharging the cooling medium are provided on a surface side of the substrate body,
and or
that the outer metallizations of foils are formed from a metallic material, preferably with a thickness in the range between 0.02 mm-1 mm, for example in the range between 0.15 mm and 0.6 mm,
and or
that the inner metallizations in thick or thin film technology by baking an electrical conductive paste are made, with a thickness smaller than the thickness of the outer metallizations,
and or
that the ceramic material is at least one of the following aluminum oxide, aluminum nitride, silicon nitride, silicon carbide or a mixed ceramic made of aluminum oxide and zirconium oxide,
and or
that the material of the outer and inner metallizations and the plated-through holes is copper or copper alloy or aluminum or a copper or aluminum alloy,
and or
that the layers of the substrate body are connected to one another by surface bonding, preferably by active soldering and / or DMB bonding and / or by adhesive bonding and / or by sinter bonding,
and or
that the at least one outer metallization is connected to the substrate body by flat bonding, preferably by active soldering or DMB bonding and / or by adhesive bonding,
the aforementioned features can be used individually or in any combination.

• 1 in vereinfachter Darstellung und im Schnitt den Aufbau eines gekühlten Metall-Keramik-Substrates, der Teilaspekte der vorliegenden Erfindung betrifft;
• 2 in vereinfachter Darstellung und in Draufsicht eine der die Kühlerstruktur bildenden Schichten aus Keramik des Substrates der 1;
• 3 in vergrößerter Teildarstellung und in Draufsicht einen die Kühlerstruktur bildenden Bereich der Schicht aus Keramik, der einen Teilaspekt der vorliegenden Erfindung betrifft;
• 4 in Einzeldarstellung einen Schnitt durch Pfosten der Kühlerstruktur des Substrates der 3 gemäß der vorliegenden Erfindung;
• 5-7 jeweils in vereinfachter Darstellung und im Schnitt weitere Ausführungsformen eines Metall-Keramik-Substrates, Teilaspekte der vorliegende Erfindung betreffend;
• 8 in vereinfachter Darstellung und im Schnitt eine Schicht aus keramischen Werkstoff.

Further developments, advantages and possible uses of the invention also result from the following description of exemplary embodiments and from the figures.
The invention is explained in more detail below with reference to the figures using exemplary embodiments. Show it:

• 1 in a simplified representation and in section the structure of a cooled metal-ceramic substrate, which relates to partial aspects of the present invention;
• 2 in a simplified representation and in plan view one of the layers of ceramic of the substrate of FIG. 1 forming the cooler structure;
• 3 in an enlarged partial representation and in plan view, a region of the layer of ceramic which forms the cooler structure and relates to a partial aspect of the present invention;
• 4 in a single representation a section through the post of the cooler structure of the substrate 3 according to the present invention;
• 5-7 each in a simplified representation and in section further embodiments of a metal-ceramic substrate, relating to partial aspects of the present invention;
• 8th in a simplified representation and in section, a layer of ceramic material.

That in the 1 , which relates to partial aspects of the present invention, a cooled metal-ceramic substrate, generally designated 1a, essentially consists of a plate-shaped substrate body 12 , of several layers arranged one above the other and connected to each other over a large area 12.1 and 12.2 consists exclusively of ceramic, in the embodiment shown from one layer 12.1 and a total of four layers 12.2 , The layer 12.1 forms at the for the 1 selected representation the underside of the metal-ceramic substrate 1a or the substrate body 12 , On top of the substrate body 12 or on the upper layer 12.2 is an external metallization 9 applied to the training of areas 9.1 and 9.2 is structured in a suitable manner in the form of conductor tracks, contact surfaces, mounting surfaces, etc. In the illustrated embodiment, the area has 9.2 on which an electrical component 11 is applied in the form of a power component, one compared to the other areas 9.1 significantly increased thickness, so that this is the component 11 load-bearing and laterally over the component 11 protruding area 9.2 also serves optimally as a heat spreader. The area 9.2 is realized, for example, in that the metallization 9 there is multilayered. In the layers 12.2 is a cooler structure with a plurality of cooling or flow channels formed in the 1 very schematically with 13 are indicated and in the case of use of the metal-ceramic substrate 1a and from the component 11 and, if appropriate, other components formed for cooling circuit are flowed through by the liquid cooling medium (eg water).

According to the 2 and 3 These are flow channels that relate to aspects of the present invention 13 formed by the layers 12.2 in their area forming the cooler structure 14 with a variety of openings 15 are formed by a surface side of the respective layer 12.2 extend to the other side of the surface. The cooling medium preferably flows through an inlet 13.1 to an outlet 13.2 , The openings 15 are of material webs 16 surround yourself at intersection areas 17 cross. The openings are in detail 15 in the layers 12.2 executed so that the material webs 16 in the in the 2 and 3 with the double arrow A indicated axis direction pairs of two immediately successive intersection points 17 form. This makes it possible to have adjacent layers 12.2 in the axial direction A around the center distance of the adjacent intersection areas 17 staggered so that the openings 15 one shift 12.2 congruent with material bars 16 the neighboring layer 12.2 lie, i.e. flow paths or channels 13 result for the cooling medium, which branch for an optimal cooling effect in at least three mutually perpendicular spatial axes. The intersection areas 17 neighboring layers 12.2 are aligned and form continuous posts 18 , which are made of ceramic and from the top of the substrate body 12 down to the layers 12.2 facing surface side of the layer 12.1 pass.

The metal-ceramic substrate 1a are the flow channels 13 the cooler structure only in the layers 12.2 made of ceramic by appropriate structuring of these layers, the flow channels 13 but are on the top of the substrate body 12 through the metallization 9 or their area 9.2 closed so that the flow channels 13 right up to the metallization 9 or the area 9.2 range and the cooling medium the upper metallization 9 and in particular also the component 11 supporting area 9.2 flows directly and cools.

A specialty of the metal-ceramic substrate 1a is also that in addition to the outer metallization 9 inner, also structured metallizations 19 are provided with a small thickness between the layers of ceramic, in the embodiment shown between the layers 12.2 , With vias 10 from the metallic material, preferably from the material of the metallizations 9 or 19 are areas 9.1 the outer metallization 9 with areas of internal metallization 19 as well as areas of internal metallization 19 interconnected electrically, but also thermally. The vias 10 are located outside of the flow channels 13 forming cooler structure.

The structuring of the layers 12.2 to form the openings 15 is preferably carried out by appropriate shaping, punching or cutting (also laser cutting) of the still green, non-fired ceramic layers or foils.

A specialty of the metal-ceramic substrate 1a is also that the structures of the outer metallization 9 partly through vias 10 from metallic material, for example from that for the metallizations 9 . 19 used metallic material electrically as well as thermally with the inner metallizations 19 are connected, preferably with areas of metallization 9 . 19 that are outside of the flow channels 13 formed cooling structure lie.

The 4 shows one of the posts in single representation 18 in a modified embodiment of the metal-ceramic substrate 1a according to the present invention. While above it was assumed that the post 18 exclusively from the intersection areas 17 of layers 12.2 are formed and thus consist of ceramic throughout, shows 4 an apprenticeship where the posts 18 according to the invention, each with a core 20 are executed by the ceramic of the layers 12.2 is enclosed and made of a metallic material, for example from the material of the metallizations 9 and or 19 consists.

Related to the partial aspects of the present invention 5 shows similar in a representation 1 as a further embodiment, a cooled metal-ceramic substrate 1b , which differs from the metal-ceramic substrate 1a essentially only differs in that the substrate body 12 not only on the bottom, but also on the one with the metallization 9 provided the top, the continuous, unstructured layer 12.1 made of ceramic, that is the actual cooling structure and with the openings 15 provided layers 12.2 ceramic between the two outer layers 12.1 are arranged. At the in the 5 shown embodiment has the substrate body 12 a total of three layers 12.2 and two layers 12.1 on. Through this design, the flow channels 13 not only in the layers 12.2 provided from ceramic, but also limited exclusively by ceramic material, ie the walls of the flow channels 13 consist exclusively of ceramic, which offers advantages in terms of preventing corrosion, among other things.

Even with the metal-ceramic substrate 1b are again outside of the flow channels 13 formed cooler structure in the layers 12.1 and 12.2 vias 10 provided the areas 9.1 the structured outer metallization 9 with areas of structured inner metallization 19 between layers 12.1 and 12.2 and areas of structured inner metallization 19 connect with each other.

Related to the partial aspects of the present invention 6 shows as a further embodiment a metal-ceramic substrate 1c , which in turn is a ceramic structure or a ceramic substrate 21 of several layers stacked on top of each other and connected to each other over a large area 22 - 25 exclusively made of ceramics, of which at the for the 7 chosen representation the layer 22 the top and the layer 25 the bottom of the ceramic substrate 21 form. Upper surface side of the layer facing away from the other layers 22 is the structured outer metallization 9 with the areas 9.1 and 9.2 applied. On the lower surface side of the layer facing away from the other layers 25 is also a structured metallization 9 applied, among other things, the area 9.1 forms. In the fields 9.1 and 9.2 the upper outer metallization 9 as well as on the area 9.1 the lower outer metallization 9 is a component 11 applied. In the shift 23 is at least one flow channel 26 provided, namely for a liquid cooling medium which the flow channel 26 corresponding to the arrow B over one on the underside of the metal-ceramic substrate 1c provided connection 27 fed and after flowing through the flow channel 26 on one also on the underside of the metal-ceramic substrate 1c provided connection 28 according to arrow C from the flow channel 26 is dissipated.

The two connections 27 and 28 are, for example, each of sleeves or pipe pieces made of a metallic material, preferably of the material of the lower outer metallization 9 or made from a material compatible with this material. The at least one flow channel 26 is through the shift 22 from the upper, outer metallization 9 Cut. The connections 27 and 28 are each via connecting channels and in the ceramic layers 24 and 25 openings provided 29 with the flow channel 26 connected.

For the tight connection of the connections 27 and 28 is the bottom metallization 9 structured, for example, so that they each connect the relevant connection 27 respectively. 28 enclosing annular or slit-shaped area 9.3 with which the respective connection 27 respectively. 28 is connected in a suitable manner, for example by soldering.

Even the metal-ceramic substrate 1c again has several vias 10 in the ceramic substrate 21 or in the layers there 21 and 24 on the outside of the cooler structure or the at least one flow channel 26 and the areas 9.1 the outer metallization 9 with areas of between layers 22 and 23 trained inner metallization or between the layers 23-25 trained inner metallizations 19 connect electrically, but also thermally.

Related to the partial aspects of the present invention 7 shows as a further embodiment a cooled metal-ceramic substrate 1d , which differs from the metal-ceramic substrate 1c first distinguishes in that the cooling structure or the at least one cooling or flow channel 26 in the shift 24 is provided at the for the 7 selected representation on the the bottom of the metal-ceramic substrate 1d forming lower layer 25 immediately follows. Furthermore, the metal-ceramic substrate 1d the area 9.1 the lower, outer metallization 9 with the component 11 not on, but the one for attaching the connections 27 and 28 serving annular areas 9.3 , The areas 9.1 the upper, outer metallization 9 partially form contact surfaces or conductor tracks as well as fastening surfaces for components 11 , The area 9.2 the upper metallization 9 is in turn to accommodate a power component 11 educated. In order to achieve the best possible cooling effect, are in the layers 22 and 23 metallic vias 10 provided that immediately to the area 9.2 the upper metallization 9 range or with this area 9.2 are connected and which, despite the large number of ceramic layers, ensure optimal heat transfer from the area 9.2 to the additional ceramic layer 30 and thus the flow channel 24 Ensure coolant flowing through. The layers 22 - 25 and 30 are again made exclusively of ceramics.

All metal-ceramic substrates described above 1a . 1b . 1c and 1d What is common, among other things, is that this substrate has at least one inner cooling structure through which a liquid cooling medium can flow, and in particular also has multiple layers with inner metallizations 19 is executed. This makes it possible to create very complex circuits or modules, despite the optimal cooling or dissipation of heat loss through the internal cooler structure. Particularly advantageous designs result when layers of the inner cooler structure of metal layers 12.2 made of ceramic with the openings 15 is formed.

All metal-ceramic substrates described above 1a . 1b . 1c and 1d is also common that the inner metallizations 19 between layers 12.1 . 12.2 . 22-25 and 30 are provided, which are also part of the cooler structure, so that a very complex design of the respective substrate, particularly with regard to the conductor tracks, is possible with a compact design or reduced substrate construction volume.

As a material for the metallizations 9 . 19 as well as for the plated-through holes 10 For example, copper or aluminum or copper or aluminum alloys is suitable, the metallizations 9 are preferably formed from foils of copper or aluminum or copper or aluminum alloys. The inner metallizations 19 are preferably produced in thin or thick film technology using pastes containing corresponding metals and by baking. Of course, for the inner metallizations 19 thin foils of metallic material, for example of copper or aluminum or of copper or aluminum alloys, may also be used with preference. As a ceramic material for the layers 12.1 . 12.2 . 22 - 25 and 30 For example, a material from the following group aluminum oxide, aluminum nitride, silicon nitride, silicon carbide or a mixed ceramic made of aluminum oxide and zirconium oxide is suitable.

Joining the metallizations 9 . 19 forming metal foils with the layers of ceramic and the metal foils or layers of metal of the area 9.2 with one another, for example, by DMB bonding or by soldering, in particular active soldering. Other methods, for example joining by gluing, are also possible in principle.

The ceramic layers are preferably joined directly by sintering. Other methods are also possible, for example active soldering, DMB bonding using a thin oxidized metal foil in each case between the layers of ceramic to be bonded to one another or bonding by gluing.

At least one of the layers 12.1 . 12.2 . 22 - 25 . 30 Ceramic can in turn also have multiple layers, for example with a base layer 01.03 made of ceramic, for example silicon nitride, and with intermediate layers 3.2 for example made of an oxide ceramic on both surface sides of the base layer 01.03 be formed as shown in Figure 8 for the layer 3 is shown.

Claims (14)

Metal-ceramic substrate with a plurality of layers (12.1, 12.2) forming a substrate body (12), each of which consists of a ceramic material and is stacked on top of one another and connected to one another in a flat manner to form the substrate body (12, 21), furthermore with at least one outer metallization (9) formed by a metallic material, which is provided on at least one surface side of the substrate body (12, 21) and for forming conductor tracks, contact surfaces and / or fastening surfaces for areas (9.1, 9.2) forming components (11) ) is structured, furthermore with a cooler structure which is provided exclusively in the layers (12.2) made of the ceramic material and is formed by at least two adjoining layers (12.2) made of the ceramic material, which is used to form at least one cooling channel (13, 26) which is provided by one Cooling medium can flow through, are provided with a plurality of openings (15) such that the cooling channel (13, 26) has flow paths for the cooling medium, which are in the direction parallel to the surface sides of the layers (12.2, 23, 24) and perpendicularly thereto branch, the openings (15) in the layers (12.2) forming the cooler structure forming a sieve-like structure, in which the openings (15) are surrounded by intersecting material webs (16) made of the ceramic material and are separated from one another, whereby the openings (15) in adjacent layers (12.2) forming the cooler structure are arranged such that each Opening (15) in a layer (12.2) is opposite a material web (16) made of the ceramic material of an adjacent layer (12.2), wherein crossing points (17) of the material webs (16) of each layer (12.2) cross points (17) of the material webs (16) of the adjacent layer (12.2) adjoin one another in a direction perpendicular to the surface sides of the layers (12.2) and thereby mullion within the cooling structure (18) form and the posts (18) formed by the crossing points (17) are provided with a core made of metallic material, which ends at a layer (12.1) made of a ceramic material. Metal-ceramic substrate after Claim 1 , characterized in that the cooler structure is formed from more than two layers (12.2) of the ceramic material. Metal-ceramic substrate according to one of the Claims 1 or 2 , characterized in that the at least one cooling duct (13, 26) forming the cooler structure is limited exclusively by the ceramic material. Metal-ceramic substrate according to one of claims -1 or 2, characterized in that the at least one cooling channel (13, 26) forming the cooler structure is limited on one side by a metallization made of a metallic material. Metal-ceramic substrate after Claim 4 , characterized in that the at least one cooling channel (13) borders on the outer metallization (9) or on at least one area (9.2) of the outer metallization (9). Metal-ceramic substrate according to one of the Claims 1 to 4 , characterized in that at least one layer (12.1) made of the ceramic material is provided between the at least one cooling channel (13) of the cooler structure and the at least one outer metallization (9), and in that at least one layer (12.1) made of the ceramic Material at least one through-contact (10) is provided, which extends to the outer metallization (9). Metal-ceramic substrate according to one of the preceding claims, characterized by at least one inner metallization (19) formed by a metallic material and by at least one through-contact (10) formed by a metallic material in at least one layer (12.1, 12.2) made of ceramic Material, the at least one via (10) at least one area (9.1) of the at least one outer metallization (9) with an area of an inner metallization (19) and / or at least two through the layer (12.1, 12.2) made of ceramic Material interconnected inner metallizations (19) connects. Metal-ceramic substrate after Claim 7 , characterized in that the at least one inner metallization (19) and / or plated-through hole (10) are located outside the region of the substrate body (12) forming the cooler structure. Metal-ceramic substrate after Claim 6 or 7 , characterized in that there is at least one inner metallization (19) between two layers of the substrate body (12), of which at least one layer (12.2) also forms the cooler structure with the at least one cooling channel (13), and / or that at least one Plating (10) is provided in a layer (12.2) of the substrate body (12) which is also part of the cooler structure. Metal-ceramic substrate according to one of the preceding claims, characterized in that the surface side of the substrate body (12) which has at least one outer metallization (9) is formed by a layer (12.1) made of the ceramic material. Metal-ceramic substrate according to one of the preceding claims, characterized in that the substrate body (12) is provided with the outer metallization (9) on its two surface sides facing away from one another and each formed by a layer of the ceramic material. Metal-ceramic substrate according to one of the preceding claims, characterized in that the at least one outer metallization (9) is formed by a film made of the metallic material with a thickness in the range between 0.15 mm and 0.6 mm. Metal-ceramic substrate according to one of the preceding claims, characterized in that the ceramic material is a material from the following group aluminum oxide, aluminum nitride, silicon nitride, silicon carbide or a mixed ceramic made of aluminum oxide and zirconium oxide, and / or that the metallic material is copper or aluminum or is a copper or aluminum alloy. Metal-ceramic substrate according to one of the preceding claims, characterized in that the layers of the substrate body (12) are connected to one another by surface bonding, preferably by active soldering and / or DMB bonding and / or by adhesive bonding and / or by sinter bonding.

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