JPS57133643A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS57133643A
JPS57133643A JP56019108A JP1910881A JPS57133643A JP S57133643 A JPS57133643 A JP S57133643A JP 56019108 A JP56019108 A JP 56019108A JP 1910881 A JP1910881 A JP 1910881A JP S57133643 A JPS57133643 A JP S57133643A
Authority
JP
Japan
Prior art keywords
lead
thermode
bump
chip
pressed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56019108A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347142B2 (env
Inventor
Kenichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56019108A priority Critical patent/JPS57133643A/ja
Publication of JPS57133643A publication Critical patent/JPS57133643A/ja
Publication of JPS6347142B2 publication Critical patent/JPS6347142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP56019108A 1981-02-13 1981-02-13 Bonding method Granted JPS57133643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56019108A JPS57133643A (en) 1981-02-13 1981-02-13 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56019108A JPS57133643A (en) 1981-02-13 1981-02-13 Bonding method

Publications (2)

Publication Number Publication Date
JPS57133643A true JPS57133643A (en) 1982-08-18
JPS6347142B2 JPS6347142B2 (env) 1988-09-20

Family

ID=11990278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56019108A Granted JPS57133643A (en) 1981-02-13 1981-02-13 Bonding method

Country Status (1)

Country Link
JP (1) JPS57133643A (env)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994411A (en) * 1988-03-10 1991-02-19 Hitachi, Ltd. Process of producing semiconductor device
US5093281A (en) * 1988-07-13 1992-03-03 Mitsubishi Denki Kabushiki Kaisha method for manufacturing semiconductor devices
WO2010114495A1 (en) * 2009-04-02 2010-10-07 Trimech Technology Pte. Ltd. A thermode assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994411A (en) * 1988-03-10 1991-02-19 Hitachi, Ltd. Process of producing semiconductor device
US5093281A (en) * 1988-07-13 1992-03-03 Mitsubishi Denki Kabushiki Kaisha method for manufacturing semiconductor devices
WO2010114495A1 (en) * 2009-04-02 2010-10-07 Trimech Technology Pte. Ltd. A thermode assembly

Also Published As

Publication number Publication date
JPS6347142B2 (env) 1988-09-20

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