JPS57118639A - Process control of semiconductor photo-etching - Google Patents

Process control of semiconductor photo-etching

Info

Publication number
JPS57118639A
JPS57118639A JP56004658A JP465881A JPS57118639A JP S57118639 A JPS57118639 A JP S57118639A JP 56004658 A JP56004658 A JP 56004658A JP 465881 A JP465881 A JP 465881A JP S57118639 A JPS57118639 A JP S57118639A
Authority
JP
Japan
Prior art keywords
information
control
unit
control information
process control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56004658A
Other languages
Japanese (ja)
Inventor
Chiharu Kato
Masatoshi Matsushita
Shigeo Furuguchi
Toshihiro Abe
Hatsuo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56004658A priority Critical patent/JPS57118639A/en
Publication of JPS57118639A publication Critical patent/JPS57118639A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To obtain the most suitable process control by a method wherein the photo-etching process is divided into a plurality of process units and control between respective units is performed. CONSTITUTION:A means, by which an information processig devie from which the most suitable control information of each unit is obained and a controller which controls the operation of each unit in accordance with the control information from the information processing device are furnished, is provided. For instance, to the respective units 1-5 of the photo-etching process control parts 1a-5a and measurement parts 1b-5b are provided. A higher ranked information processing device 6 has a function to output the most suitable control information for each unit 1-5 by analytical processing of the control information and the information of measured results and obtaining the error between the control information and the practice information and a function to perform the accident observation for each unit 1-5 and the like.
JP56004658A 1981-01-16 1981-01-16 Process control of semiconductor photo-etching Pending JPS57118639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56004658A JPS57118639A (en) 1981-01-16 1981-01-16 Process control of semiconductor photo-etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56004658A JPS57118639A (en) 1981-01-16 1981-01-16 Process control of semiconductor photo-etching

Publications (1)

Publication Number Publication Date
JPS57118639A true JPS57118639A (en) 1982-07-23

Family

ID=11590032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56004658A Pending JPS57118639A (en) 1981-01-16 1981-01-16 Process control of semiconductor photo-etching

Country Status (1)

Country Link
JP (1) JPS57118639A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225640A (en) * 1982-06-23 1983-12-27 Nec Corp Preparation of semiconductor device
JPS59201418A (en) * 1983-04-30 1984-11-15 Toshiba Corp Exposing apparatus
JPS59182966U (en) * 1983-05-20 1984-12-06 ソニー株式会社 Ceramic multilayer circuit board
JPS60117733A (en) * 1983-11-30 1985-06-25 Canon Hanbai Kk Developing device for wafer
JPH01239914A (en) * 1988-03-22 1989-09-25 Tokyo Electron Ltd Wafer treatment apparatus
JPH03123051A (en) * 1989-10-05 1991-05-24 Nec Yamagata Ltd Learning control system of semiconductor element manufacturing process
JP2004327778A (en) * 2003-04-25 2004-11-18 Ｆａｓｌ Ｊａｐａｎ 株式会社 Manufacturing process control method for semiconductor device, and manufacture process control apparatus for the semiconductor device
CN103092114A (en) * 2013-01-22 2013-05-08 中国科学院光电技术研究所 Embedded control equipment for lithography machine and control method thereof
JP2016213400A (en) * 2015-05-13 2016-12-15 三重富士通セミコンダクター株式会社 Defect detection system, defect detection method, semiconductor manufacturing device, and production management system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227367A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Photo resist processing apparatus
JPS5480081A (en) * 1977-12-09 1979-06-26 Ulvac Corp Process plate vacuum device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227367A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Photo resist processing apparatus
JPS5480081A (en) * 1977-12-09 1979-06-26 Ulvac Corp Process plate vacuum device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225640A (en) * 1982-06-23 1983-12-27 Nec Corp Preparation of semiconductor device
JPH0142497B2 (en) * 1982-06-23 1989-09-13 Nippon Electric Co
JPS59201418A (en) * 1983-04-30 1984-11-15 Toshiba Corp Exposing apparatus
JPH0141246B2 (en) * 1983-04-30 1989-09-04 Tokyo Shibaura Electric Co
JPS59182966U (en) * 1983-05-20 1984-12-06 ソニー株式会社 Ceramic multilayer circuit board
JPH0129801Y2 (en) * 1983-05-20 1989-09-11
JPS60117733A (en) * 1983-11-30 1985-06-25 Canon Hanbai Kk Developing device for wafer
JPH01239914A (en) * 1988-03-22 1989-09-25 Tokyo Electron Ltd Wafer treatment apparatus
JPH03123051A (en) * 1989-10-05 1991-05-24 Nec Yamagata Ltd Learning control system of semiconductor element manufacturing process
JP2004327778A (en) * 2003-04-25 2004-11-18 Ｆａｓｌ Ｊａｐａｎ 株式会社 Manufacturing process control method for semiconductor device, and manufacture process control apparatus for the semiconductor device
CN103092114A (en) * 2013-01-22 2013-05-08 中国科学院光电技术研究所 Embedded control equipment for lithography machine and control method thereof
JP2016213400A (en) * 2015-05-13 2016-12-15 三重富士通セミコンダクター株式会社 Defect detection system, defect detection method, semiconductor manufacturing device, and production management system

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