JPS57116775A - Etching solution for nickel - Google Patents

Etching solution for nickel

Info

Publication number
JPS57116775A
JPS57116775A JP56004321A JP432181A JPS57116775A JP S57116775 A JPS57116775 A JP S57116775A JP 56004321 A JP56004321 A JP 56004321A JP 432181 A JP432181 A JP 432181A JP S57116775 A JPS57116775 A JP S57116775A
Authority
JP
Japan
Prior art keywords
etching
soln
nickel
nh4cl
capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56004321A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6343470B2 (enrdf_load_stackoverflow
Inventor
Kazuhiko Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56004321A priority Critical patent/JPS57116775A/ja
Publication of JPS57116775A publication Critical patent/JPS57116775A/ja
Publication of JPS6343470B2 publication Critical patent/JPS6343470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
JP56004321A 1981-01-14 1981-01-14 Etching solution for nickel Granted JPS57116775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56004321A JPS57116775A (en) 1981-01-14 1981-01-14 Etching solution for nickel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56004321A JPS57116775A (en) 1981-01-14 1981-01-14 Etching solution for nickel

Publications (2)

Publication Number Publication Date
JPS57116775A true JPS57116775A (en) 1982-07-20
JPS6343470B2 JPS6343470B2 (enrdf_load_stackoverflow) 1988-08-30

Family

ID=11581191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56004321A Granted JPS57116775A (en) 1981-01-14 1981-01-14 Etching solution for nickel

Country Status (1)

Country Link
JP (1) JPS57116775A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0887439A1 (en) * 1997-06-12 1998-12-30 Macdermid Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
EP2021519A4 (en) * 2006-05-03 2016-11-09 Omg Electronic Chemicals Inc PROCESS AND COMPOSITION FOR SELECTIVE CUTTING OF NICKEL FROM SUBSTRATE
CN113265660A (zh) * 2021-04-30 2021-08-17 光华科学技术研究院(广东)有限公司 蚀刻液及其应用

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0887439A1 (en) * 1997-06-12 1998-12-30 Macdermid Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6503566B2 (en) 2000-06-08 2003-01-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
EP2021519A4 (en) * 2006-05-03 2016-11-09 Omg Electronic Chemicals Inc PROCESS AND COMPOSITION FOR SELECTIVE CUTTING OF NICKEL FROM SUBSTRATE
CN113265660A (zh) * 2021-04-30 2021-08-17 光华科学技术研究院(广东)有限公司 蚀刻液及其应用

Also Published As

Publication number Publication date
JPS6343470B2 (enrdf_load_stackoverflow) 1988-08-30

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