JPS57111054A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57111054A
JPS57111054A JP55185001A JP18500180A JPS57111054A JP S57111054 A JPS57111054 A JP S57111054A JP 55185001 A JP55185001 A JP 55185001A JP 18500180 A JP18500180 A JP 18500180A JP S57111054 A JPS57111054 A JP S57111054A
Authority
JP
Japan
Prior art keywords
bonding
pads
plate
type
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55185001A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344298B2 (OSRAM
Inventor
Shinjiro Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55185001A priority Critical patent/JPS57111054A/ja
Publication of JPS57111054A publication Critical patent/JPS57111054A/ja
Publication of JPS6344298B2 publication Critical patent/JPS6344298B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/65—

Landscapes

  • Wire Bonding (AREA)
JP55185001A 1980-12-27 1980-12-27 Semiconductor device Granted JPS57111054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55185001A JPS57111054A (en) 1980-12-27 1980-12-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55185001A JPS57111054A (en) 1980-12-27 1980-12-27 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57111054A true JPS57111054A (en) 1982-07-10
JPS6344298B2 JPS6344298B2 (OSRAM) 1988-09-05

Family

ID=16163034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55185001A Granted JPS57111054A (en) 1980-12-27 1980-12-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57111054A (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159751U (ja) * 1982-04-20 1983-10-25 京セラ株式会社 ヒ−トシンク機構付半導体パツケ−ジ
JPS59197158A (ja) * 1983-04-22 1984-11-08 Toshiba Corp 半導体装置
JPS6033441U (ja) * 1983-08-11 1985-03-07 富士電機株式会社 半導体装置
JP2001308265A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159751U (ja) * 1982-04-20 1983-10-25 京セラ株式会社 ヒ−トシンク機構付半導体パツケ−ジ
JPS59197158A (ja) * 1983-04-22 1984-11-08 Toshiba Corp 半導体装置
JPS6033441U (ja) * 1983-08-11 1985-03-07 富士電機株式会社 半導体装置
JP2001308265A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置

Also Published As

Publication number Publication date
JPS6344298B2 (OSRAM) 1988-09-05

Similar Documents

Publication Publication Date Title
JPS6428945A (en) Circuit package assembly
TW375816B (en) Semiconductor device
JPS55130178A (en) Semiconductor device
GB1060397A (en) Improvements in and relating to the manufacture of semiconductor devices
JPS5553446A (en) Container of electronic component
JPS57111054A (en) Semiconductor device
JPH0418694B2 (OSRAM)
JPS5745263A (en) Package for semiconductor device
JPS57164548A (en) Semiconductor device
JPS5449066A (en) Semiconductor device
JPS55165661A (en) Semiconductor device
JPS5785244A (en) Semiconductor device
JPS57115850A (en) Chip carrier for semiconductor ic
JPS5720440A (en) Semiconductor device
GB1199849A (en) Improvements in and relating to Contact Bonding and Lead Attachment of an Electrical Device
JPS5790992A (en) Semiconductor laser device
JPS6447063A (en) Structure of lead frame
JPS647645A (en) Semiconductor device and manufacture thereof
JPS54128278A (en) Resin-sealed semiconductor device and its packaging method
JPS57204154A (en) Structure of chip carrier
JPS564260A (en) Electronic device
JPS5772360A (en) Semiconductor device assembled according to film carrier system
JPS5745939A (en) Semiconductor device
JPS5723254A (en) Semiconductor device
JPS57177551A (en) Semiconductor device and manufacturing method therefor