JPS57106132A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57106132A JPS57106132A JP18353680A JP18353680A JPS57106132A JP S57106132 A JPS57106132 A JP S57106132A JP 18353680 A JP18353680 A JP 18353680A JP 18353680 A JP18353680 A JP 18353680A JP S57106132 A JPS57106132 A JP S57106132A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- semiconductor device
- grindstone
- machining accuracy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To enhance the machining accuracy of an apparatus for manufacturing a semiconductor device by providing means for setting a semiconductor pellet in parallel with the rotating plane of a grindstone axis and means for centering and holding the rotating axis of the pellet in a bevelling machine. CONSTITUTION:A semiconductor pallet is placed on a collet chuck, is projected on an upper jig 4 in contact, and a semiconductor element is centered by the collet chuck 8 as a collet sleeve 9 rises. A grindstone 7 is contacted with the outer peripheral surface of the pellet to bevel the pellet. Even if the parallelism is not produced in the element in this manner, the side of the pellet surface can be used as a machining reference surface, thereby improving the machining accuracy, and the yield and workability can be enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18353680A JPS57106132A (en) | 1980-12-24 | 1980-12-24 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18353680A JPS57106132A (en) | 1980-12-24 | 1980-12-24 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57106132A true JPS57106132A (en) | 1982-07-01 |
Family
ID=16137539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18353680A Pending JPS57106132A (en) | 1980-12-24 | 1980-12-24 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57106132A (en) |
-
1980
- 1980-12-24 JP JP18353680A patent/JPS57106132A/en active Pending
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