JPS57103319A - Hermetically sealing method for electronic part - Google Patents

Hermetically sealing method for electronic part

Info

Publication number
JPS57103319A
JPS57103319A JP55179807A JP17980780A JPS57103319A JP S57103319 A JPS57103319 A JP S57103319A JP 55179807 A JP55179807 A JP 55179807A JP 17980780 A JP17980780 A JP 17980780A JP S57103319 A JPS57103319 A JP S57103319A
Authority
JP
Japan
Prior art keywords
case
resin
bonded
base
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55179807A
Other languages
English (en)
Japanese (ja)
Other versions
JPS632147B2 (enExample
Inventor
Toshio Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55179807A priority Critical patent/JPS57103319A/ja
Publication of JPS57103319A publication Critical patent/JPS57103319A/ja
Publication of JPS632147B2 publication Critical patent/JPS632147B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP55179807A 1980-12-19 1980-12-19 Hermetically sealing method for electronic part Granted JPS57103319A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55179807A JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55179807A JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Publications (2)

Publication Number Publication Date
JPS57103319A true JPS57103319A (en) 1982-06-26
JPS632147B2 JPS632147B2 (enExample) 1988-01-18

Family

ID=16072229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55179807A Granted JPS57103319A (en) 1980-12-19 1980-12-19 Hermetically sealing method for electronic part

Country Status (1)

Country Link
JP (1) JPS57103319A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111571A (en) * 1974-07-19 1976-01-29 Nitto Electric Ind Co Denkikairososhino patsukeejihoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111571A (en) * 1974-07-19 1976-01-29 Nitto Electric Ind Co Denkikairososhino patsukeejihoho

Also Published As

Publication number Publication date
JPS632147B2 (enExample) 1988-01-18

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