JPS57102018A - Pattern correction - Google Patents
Pattern correctionInfo
- Publication number
- JPS57102018A JPS57102018A JP17918480A JP17918480A JPS57102018A JP S57102018 A JPS57102018 A JP S57102018A JP 17918480 A JP17918480 A JP 17918480A JP 17918480 A JP17918480 A JP 17918480A JP S57102018 A JPS57102018 A JP S57102018A
- Authority
- JP
- Japan
- Prior art keywords
- developing
- pattern
- plasma
- corrected
- dry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To make correction easy and simpify process by a method wherein after exposure of a required pattern, developing is performed to a halfway state, an electron beam is applied to a pin-hole part and dry-developing is performed, so that the pattern is corrected. CONSTITUTION:A metal thin film 6 formed on a transparent substrate 1 is coated with photosensitive resin 7 and a required pattern is exposed by ultraviolet rays. Then the substrate is immersed in a developing liquid for a period about a half of a usual developing period and is washed by pure water and then dried. At that time, as the developing is performed to a halfway state, the resist pattern is beginning to be formed. Failure inspection is carried out at this stage and a failure part 3 is exposed by an electron beam irradiation. After completion of the exposure, dry-developing is performed by a plasma equipment. The part irradiated by the light is removed with a relatively higher speed in plasma but the part irradiated by the electron beam has a high plasma resistivity. Thus the failure part 3 is corrected after the dry-developing in plasma, so that the corrected part 5 of the pattern is left as a correct pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17918480A JPS57102018A (en) | 1980-12-17 | 1980-12-17 | Pattern correction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17918480A JPS57102018A (en) | 1980-12-17 | 1980-12-17 | Pattern correction |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57102018A true JPS57102018A (en) | 1982-06-24 |
Family
ID=16061400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17918480A Pending JPS57102018A (en) | 1980-12-17 | 1980-12-17 | Pattern correction |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57102018A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5104772A (en) * | 1987-01-27 | 1992-04-14 | Fujitsu Limited | Method of forming fine resist pattern in electron beam or x-ray lithography |
-
1980
- 1980-12-17 JP JP17918480A patent/JPS57102018A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5104772A (en) * | 1987-01-27 | 1992-04-14 | Fujitsu Limited | Method of forming fine resist pattern in electron beam or x-ray lithography |
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