JPS5710138A - Manufacture of photoresist - Google Patents
Manufacture of photoresistInfo
- Publication number
- JPS5710138A JPS5710138A JP8414480A JP8414480A JPS5710138A JP S5710138 A JPS5710138 A JP S5710138A JP 8414480 A JP8414480 A JP 8414480A JP 8414480 A JP8414480 A JP 8414480A JP S5710138 A JPS5710138 A JP S5710138A
- Authority
- JP
- Japan
- Prior art keywords
- lamination
- layer
- exposure
- solid surface
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
PURPOSE:To enhance the sensitivity by laminating a film-shaped photoresist on a solid surface under reduced pressure followed by exposure and development. CONSTITUTION:The photosensitive layer 2 of a photosensitive material composed of a flexible support 1 and the layer 2 is laminated on a plane solid surface by heating and pressurization in an atmosphere under <=200mm.Hg and imagewise irradiated with active rays of light to cure the exposed part, and the unexposed part is removed by dissolution in an org. solvent or an aqueous alkali soln. to manufacture a photoresist on the solid surface. The protective film 3 is peeled off before the lamination. The atmosphere during the lamination is preferably kept under <=60mm.Hg, and the exposure is carried out within 1 day after the lamination. The layer is lamination. The layer is laminated by pressurization at 50-160 deg.C softening temp. with a vacuum sticking device. The resist image can be formed while reducing the quantity of light for exposure to 2/3 of that of a conventional method in the presence of air.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8414480A JPS5710138A (en) | 1980-06-20 | 1980-06-20 | Manufacture of photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8414480A JPS5710138A (en) | 1980-06-20 | 1980-06-20 | Manufacture of photoresist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5710138A true JPS5710138A (en) | 1982-01-19 |
Family
ID=13822296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8414480A Pending JPS5710138A (en) | 1980-06-20 | 1980-06-20 | Manufacture of photoresist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5710138A (en) |
-
1980
- 1980-06-20 JP JP8414480A patent/JPS5710138A/en active Pending
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