JPS57100754A - Semiconductor circuit device - Google Patents
Semiconductor circuit deviceInfo
- Publication number
- JPS57100754A JPS57100754A JP17668380A JP17668380A JPS57100754A JP S57100754 A JPS57100754 A JP S57100754A JP 17668380 A JP17668380 A JP 17668380A JP 17668380 A JP17668380 A JP 17668380A JP S57100754 A JPS57100754 A JP S57100754A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- substrate
- container
- thermally conductive
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the heat sink characteristics of an electronic circuit by sealing the electronic circuit constructed in laminate with a substrate carrying many ICs in a glass container filled with good thermally conductive gas. CONSTITUTION:An electronic circuit 4 constructed in laminate further with a substrate carrying many semiconductor integrated circuits is mounted on an insulating substrate 1 having a lead terminal 2, and high thermally conductive gas such as hydrogen, helium is filled in the space formed of an enclosure 3 and the substrate 1. In this manner gas convection is produced in the container, thereby radiating the heat from the surface of the wall of the container and improving the heat sink property.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17668380A JPS57100754A (en) | 1980-12-15 | 1980-12-15 | Semiconductor circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17668380A JPS57100754A (en) | 1980-12-15 | 1980-12-15 | Semiconductor circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57100754A true JPS57100754A (en) | 1982-06-23 |
Family
ID=16017892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17668380A Pending JPS57100754A (en) | 1980-12-15 | 1980-12-15 | Semiconductor circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57100754A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006018131A1 (en) * | 2004-08-12 | 2006-02-23 | Epcos Ag | Component arrangement provided with a carrier substrate |
-
1980
- 1980-12-15 JP JP17668380A patent/JPS57100754A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006018131A1 (en) * | 2004-08-12 | 2006-02-23 | Epcos Ag | Component arrangement provided with a carrier substrate |
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