JPS57100754A - Semiconductor circuit device - Google Patents

Semiconductor circuit device

Info

Publication number
JPS57100754A
JPS57100754A JP17668380A JP17668380A JPS57100754A JP S57100754 A JPS57100754 A JP S57100754A JP 17668380 A JP17668380 A JP 17668380A JP 17668380 A JP17668380 A JP 17668380A JP S57100754 A JPS57100754 A JP S57100754A
Authority
JP
Japan
Prior art keywords
electronic circuit
substrate
container
thermally conductive
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17668380A
Other languages
Japanese (ja)
Inventor
Yasuo Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17668380A priority Critical patent/JPS57100754A/en
Publication of JPS57100754A publication Critical patent/JPS57100754A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the heat sink characteristics of an electronic circuit by sealing the electronic circuit constructed in laminate with a substrate carrying many ICs in a glass container filled with good thermally conductive gas. CONSTITUTION:An electronic circuit 4 constructed in laminate further with a substrate carrying many semiconductor integrated circuits is mounted on an insulating substrate 1 having a lead terminal 2, and high thermally conductive gas such as hydrogen, helium is filled in the space formed of an enclosure 3 and the substrate 1. In this manner gas convection is produced in the container, thereby radiating the heat from the surface of the wall of the container and improving the heat sink property.
JP17668380A 1980-12-15 1980-12-15 Semiconductor circuit device Pending JPS57100754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17668380A JPS57100754A (en) 1980-12-15 1980-12-15 Semiconductor circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17668380A JPS57100754A (en) 1980-12-15 1980-12-15 Semiconductor circuit device

Publications (1)

Publication Number Publication Date
JPS57100754A true JPS57100754A (en) 1982-06-23

Family

ID=16017892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17668380A Pending JPS57100754A (en) 1980-12-15 1980-12-15 Semiconductor circuit device

Country Status (1)

Country Link
JP (1) JPS57100754A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006018131A1 (en) * 2004-08-12 2006-02-23 Epcos Ag Component arrangement provided with a carrier substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006018131A1 (en) * 2004-08-12 2006-02-23 Epcos Ag Component arrangement provided with a carrier substrate

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