JPS5698244A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS5698244A JPS5698244A JP105680A JP105680A JPS5698244A JP S5698244 A JPS5698244 A JP S5698244A JP 105680 A JP105680 A JP 105680A JP 105680 A JP105680 A JP 105680A JP S5698244 A JPS5698244 A JP S5698244A
- Authority
- JP
- Japan
- Prior art keywords
- polyfunctional
- prepolymer
- combined
- cyanate ester
- polybutadiene resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 2
- 239000005062 Polybutadiene Substances 0.000 abstract 2
- 239000004643 cyanate ester Substances 0.000 abstract 2
- 229920002857 polybutadiene Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 238000005984 hydrogenation reaction Methods 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 150000003512 tertiary amines Chemical class 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP105680A JPS5698244A (en) | 1980-01-09 | 1980-01-09 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP105680A JPS5698244A (en) | 1980-01-09 | 1980-01-09 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5698244A true JPS5698244A (en) | 1981-08-07 |
| JPS6328099B2 JPS6328099B2 (enrdf_load_stackoverflow) | 1988-06-07 |
Family
ID=11490879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP105680A Granted JPS5698244A (en) | 1980-01-09 | 1980-01-09 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5698244A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271341A (ja) * | 1985-05-27 | 1986-12-01 | Mitsubishi Gas Chem Co Inc | ゴムの安定化方法 |
| JPH04366146A (ja) * | 1991-06-13 | 1992-12-18 | Shin Kobe Electric Mach Co Ltd | シアン酸エステル樹脂組成物 |
| JP2016135859A (ja) * | 2015-01-16 | 2016-07-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、接着補助層付き層間絶縁用樹脂フィルム、及びプリント配線板 |
| WO2018139368A1 (ja) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
-
1980
- 1980-01-09 JP JP105680A patent/JPS5698244A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271341A (ja) * | 1985-05-27 | 1986-12-01 | Mitsubishi Gas Chem Co Inc | ゴムの安定化方法 |
| JPH04366146A (ja) * | 1991-06-13 | 1992-12-18 | Shin Kobe Electric Mach Co Ltd | シアン酸エステル樹脂組成物 |
| JP2016135859A (ja) * | 2015-01-16 | 2016-07-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、接着補助層付き層間絶縁用樹脂フィルム、及びプリント配線板 |
| US10544305B2 (en) | 2015-01-16 | 2020-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
| WO2018139368A1 (ja) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| JPWO2018139368A1 (ja) * | 2017-01-26 | 2019-02-07 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| US11166370B2 (en) | 2017-01-26 | 2021-11-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6328099B2 (enrdf_load_stackoverflow) | 1988-06-07 |
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