JPS5698245A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5698245A
JPS5698245A JP105780A JP105780A JPS5698245A JP S5698245 A JPS5698245 A JP S5698245A JP 105780 A JP105780 A JP 105780A JP 105780 A JP105780 A JP 105780A JP S5698245 A JPS5698245 A JP S5698245A
Authority
JP
Japan
Prior art keywords
polyfunctional
prepolymer
curable resin
heat
acrylonitrile copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP105780A
Other languages
Japanese (ja)
Other versions
JPS6328100B2 (en
Inventor
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP105780A priority Critical patent/JPS5698245A/en
Publication of JPS5698245A publication Critical patent/JPS5698245A/en
Publication of JPS6328100B2 publication Critical patent/JPS6328100B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To specific butadiene-acrylonitrile copolymer is added to a curable resin containing a polyfunctional cyanate ester, a polyfunctional maleimide and an epoxy resin to improve flexibility and elasticity largely.
CONSTITUTION: A butadiene-acrylonitrile copolymer bearing hydroxyls carboxyls on chain terminals, preferably having an average molecular weight of 700W5,000, is combined with a mixture or prereaction product from a polyfunctional cyanate ester or its prepolymer, a polyfunctional maleimide or its prepolymer and an epoxy resin. The resultant composition forms chemical bonds and crosslinking networks by itself with heat to become a heat-resistance resin, however, it is preferred that a catalyst such as an imidazole or tertiary amine is used to promote crosslinking and network formation.
COPYRIGHT: (C)1981,JPO&Japio
JP105780A 1980-01-09 1980-01-09 Curable resin composition Granted JPS5698245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP105780A JPS5698245A (en) 1980-01-09 1980-01-09 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP105780A JPS5698245A (en) 1980-01-09 1980-01-09 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS5698245A true JPS5698245A (en) 1981-08-07
JPS6328100B2 JPS6328100B2 (en) 1988-06-07

Family

ID=11490904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP105780A Granted JPS5698245A (en) 1980-01-09 1980-01-09 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5698245A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61271341A (en) * 1985-05-27 1986-12-01 Mitsubishi Gas Chem Co Inc Method for stabilizing rubber
JPS63186787A (en) * 1987-01-28 1988-08-02 Shin Etsu Chem Co Ltd Adhesive composition for flexible printed circuit board
JPH04366146A (en) * 1991-06-13 1992-12-18 Shin Kobe Electric Mach Co Ltd Cyanic seter resin composition
NL1006621C2 (en) * 1997-07-18 1999-01-19 Dsm Nv Radiation curable coating composition.
US6555593B1 (en) 1998-01-30 2003-04-29 Albemarle Corporation Photopolymerization compositions including maleimides and processes for using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61271341A (en) * 1985-05-27 1986-12-01 Mitsubishi Gas Chem Co Inc Method for stabilizing rubber
JPH0618934B2 (en) * 1985-05-27 1994-03-16 三菱瓦斯化学株式会社 Rubber stabilization method
JPS63186787A (en) * 1987-01-28 1988-08-02 Shin Etsu Chem Co Ltd Adhesive composition for flexible printed circuit board
JPH04366146A (en) * 1991-06-13 1992-12-18 Shin Kobe Electric Mach Co Ltd Cyanic seter resin composition
NL1006621C2 (en) * 1997-07-18 1999-01-19 Dsm Nv Radiation curable coating composition.
WO1999003930A1 (en) * 1997-07-18 1999-01-28 Dsm N.V. Radiation-curable coating composition
US6555593B1 (en) 1998-01-30 2003-04-29 Albemarle Corporation Photopolymerization compositions including maleimides and processes for using the same

Also Published As

Publication number Publication date
JPS6328100B2 (en) 1988-06-07

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