JPS5689968A - Manufacturing of thermal head - Google Patents

Manufacturing of thermal head

Info

Publication number
JPS5689968A
JPS5689968A JP16798279A JP16798279A JPS5689968A JP S5689968 A JPS5689968 A JP S5689968A JP 16798279 A JP16798279 A JP 16798279A JP 16798279 A JP16798279 A JP 16798279A JP S5689968 A JPS5689968 A JP S5689968A
Authority
JP
Japan
Prior art keywords
layer
protecting
laminated
conducting
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16798279A
Other languages
Japanese (ja)
Other versions
JPS589570B2 (en
Inventor
Kiyoshi Sato
Minoru Terajima
Haruo Tanmachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54167982A priority Critical patent/JPS589570B2/en
Publication of JPS5689968A publication Critical patent/JPS5689968A/en
Publication of JPS589570B2 publication Critical patent/JPS589570B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE: To prevent separation of a protecting layer and generation of cracks in the protecting layer by a method wherein an adhesive layer consisting of a metal or a metal oxide having a higher adhesion than the adhesion between a conducting layer and the protecting layer is interposed between the conducting layer and the protecting layer.
CONSTITUTION: The protecting layer 6 wherein an SiO2 layer 7 and a Ta2O5 layer 8 are laminated in order is formed after the adhesive layer 10 of NiCr is laminated and formed on a resistance (TaN) layer 2, laminated and formed on a base 1 one by one, and the conducting layer 3 consisting of the NiCr layer 4 and an Au layer 5, laminated and formed on the resistance layer 2. The adhesive layer 10 as well as the conducting layer 3 are removed at an upper part of a heating dot section 9 and the heat generated at the dot section 9 is transmitted to a recording paper through the protecting layer 6. As the adhesive layer 10, metal or metal oxide of Ti or the like, which are having higher adhesion to the Au layer 5 and the SiO2 layer 7 respectively than the adhesion between the Au layer 5 and the SiO2 layer 7 and will never loose a resistance to heat at the vicinity of the dot section 9, may be utilized.
COPYRIGHT: (C)1981,JPO&Japio
JP54167982A 1979-12-24 1979-12-24 Thermal head manufacturing method Expired JPS589570B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54167982A JPS589570B2 (en) 1979-12-24 1979-12-24 Thermal head manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54167982A JPS589570B2 (en) 1979-12-24 1979-12-24 Thermal head manufacturing method

Publications (2)

Publication Number Publication Date
JPS5689968A true JPS5689968A (en) 1981-07-21
JPS589570B2 JPS589570B2 (en) 1983-02-22

Family

ID=15859608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54167982A Expired JPS589570B2 (en) 1979-12-24 1979-12-24 Thermal head manufacturing method

Country Status (1)

Country Link
JP (1) JPS589570B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57182466A (en) * 1981-05-07 1982-11-10 Seiko Epson Corp Serial printer
JPS6069652U (en) * 1983-10-21 1985-05-17 株式会社田村電機製作所 thermal head
JPH02141262A (en) * 1988-11-22 1990-05-30 Oki Electric Ind Co Ltd Thermal head and production thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142528A (en) * 1976-05-21 1977-11-28 Matsushita Electric Ind Co Ltd Heating elements for printing letters

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142528A (en) * 1976-05-21 1977-11-28 Matsushita Electric Ind Co Ltd Heating elements for printing letters

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57182466A (en) * 1981-05-07 1982-11-10 Seiko Epson Corp Serial printer
JPS6069652U (en) * 1983-10-21 1985-05-17 株式会社田村電機製作所 thermal head
JPH02141262A (en) * 1988-11-22 1990-05-30 Oki Electric Ind Co Ltd Thermal head and production thereof

Also Published As

Publication number Publication date
JPS589570B2 (en) 1983-02-22

Similar Documents

Publication Publication Date Title
EP1074391A4 (en) Thermal print head and method of manufacture thereof
JPS5689968A (en) Manufacturing of thermal head
EP0385757A3 (en) Substrate for thermal recording head and thermal recording head using same
EP0782152A4 (en) Thermal head and its manufacture
JPS5637177A (en) Resistor for heat-sensitive recording head and manufacture thereof
JPS55114579A (en) Thin-film type thermal recording head
JPS5527863A (en) Amorphous phosphorus boron compound
JPS5356042A (en) Thermal head
JPS56130377A (en) Heat-sensitive recording head
JPS5720374A (en) Method of forming crossover in thermal head
JPS5787973A (en) Thermal head
JPS5720373A (en) Heat-sensitive recording head and production thereof
JPS5387242A (en) Thin film type thermal heads
JPS56123878A (en) Thermosensitive recording head
EP0825027A3 (en) An ink jet head substrate, a method for manufacturing the substrate, an ink jet recording head having the substrate, and a method for manufacturing the head
JPS5656886A (en) Thermal head
JPS5692079A (en) Film-coated thermal head
JPS57125333A (en) Temperature sensor
JPS5720372A (en) Thermal head
JPS5783475A (en) Thermal head
JPS56161177A (en) Thermosensitive recording head
JPS5526650A (en) Die bonding method for semiconductor pellet
JPS5613186A (en) Production of thermal head
JPS5368896A (en) Magnetic layer-built unit and preparation with magnetic head
JPS5614499A (en) Si pellet bonding method