JPS5686926A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5686926A
JPS5686926A JP16413879A JP16413879A JPS5686926A JP S5686926 A JPS5686926 A JP S5686926A JP 16413879 A JP16413879 A JP 16413879A JP 16413879 A JP16413879 A JP 16413879A JP S5686926 A JPS5686926 A JP S5686926A
Authority
JP
Japan
Prior art keywords
compound
formula
incorporating
methyl
polyfunctional epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16413879A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16413879A priority Critical patent/JPS5686926A/en
Publication of JPS5686926A publication Critical patent/JPS5686926A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition, having a high heat distortion temperature and improved thermal stablility, flexural strength and moisture resistance, and obtained by incorporating an imide compound of specific structure with a polyfunctional epoxy compound.
CONSTITUTION: A composition obtained by incorporating (A) an imide compound expressed by formulas I and/or II [R1 is ethylenically unsaturated group; R2 is formula III (y is H, methyl, ethyl, Cl, Br or methoxy) or formula IV (z is H or methyl); (m+n) is 10 or less on an average, and preferably (m) and (n) are integers 1W5] with (B) a polyfunctional epoxy compound, and if necessary (C) a phenol-formaldehyde novolak type condensate. In case a compound of formula II is used as the component (A), the weight ratio of (A)/(B)/(C) is preferably 100/30W 500/10W200.
COPYRIGHT: (C)1981,JPO&Japio
JP16413879A 1979-12-19 1979-12-19 Epoxy resin composition Pending JPS5686926A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16413879A JPS5686926A (en) 1979-12-19 1979-12-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16413879A JPS5686926A (en) 1979-12-19 1979-12-19 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5686926A true JPS5686926A (en) 1981-07-15

Family

ID=15787464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16413879A Pending JPS5686926A (en) 1979-12-19 1979-12-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5686926A (en)

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