JPS5684340A - High expansion seal bonding material - Google Patents
High expansion seal bonding materialInfo
- Publication number
- JPS5684340A JPS5684340A JP15782279A JP15782279A JPS5684340A JP S5684340 A JPS5684340 A JP S5684340A JP 15782279 A JP15782279 A JP 15782279A JP 15782279 A JP15782279 A JP 15782279A JP S5684340 A JPS5684340 A JP S5684340A
- Authority
- JP
- Japan
- Prior art keywords
- component
- bonding material
- high expansion
- expansion seal
- seal bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000014692 zinc oxide Nutrition 0.000 abstract 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 abstract 1
- 150000001342 alkaline earth metals Chemical class 0.000 abstract 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000004327 boric acid Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Glass Compositions (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15782279A JPS5684340A (en) | 1979-12-05 | 1979-12-05 | High expansion seal bonding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15782279A JPS5684340A (en) | 1979-12-05 | 1979-12-05 | High expansion seal bonding material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5684340A true JPS5684340A (en) | 1981-07-09 |
JPS6357375B2 JPS6357375B2 (enrdf_load_stackoverflow) | 1988-11-11 |
Family
ID=15658057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15782279A Granted JPS5684340A (en) | 1979-12-05 | 1979-12-05 | High expansion seal bonding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5684340A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6487531A (en) * | 1987-06-18 | 1989-03-31 | Asahi Glass Co Ltd | Glass glaze |
JP2013525259A (ja) * | 2010-05-07 | 2013-06-20 | オスラム ゲーエムベーハー | アルカリ不含及びハロゲン不含の金属リン酸塩を含むオプトエレクトロニク半導体デバイス |
-
1979
- 1979-12-05 JP JP15782279A patent/JPS5684340A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6487531A (en) * | 1987-06-18 | 1989-03-31 | Asahi Glass Co Ltd | Glass glaze |
JP2013525259A (ja) * | 2010-05-07 | 2013-06-20 | オスラム ゲーエムベーハー | アルカリ不含及びハロゲン不含の金属リン酸塩を含むオプトエレクトロニク半導体デバイス |
US8772821B2 (en) | 2010-05-07 | 2014-07-08 | Osram Gmbh | Optoelectronic semiconductor part containing alkali-free and halogen-free metal phosphate |
Also Published As
Publication number | Publication date |
---|---|
JPS6357375B2 (enrdf_load_stackoverflow) | 1988-11-11 |
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