JPS5679459A - Pretreatment method for plating of external lead wire after semiconductor molding - Google Patents

Pretreatment method for plating of external lead wire after semiconductor molding

Info

Publication number
JPS5679459A
JPS5679459A JP15640679A JP15640679A JPS5679459A JP S5679459 A JPS5679459 A JP S5679459A JP 15640679 A JP15640679 A JP 15640679A JP 15640679 A JP15640679 A JP 15640679A JP S5679459 A JPS5679459 A JP S5679459A
Authority
JP
Japan
Prior art keywords
copper
electrolysis
resin film
liquid
positive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15640679A
Other languages
English (en)
Other versions
JPS6024586B2 (ja
Inventor
Katsumi Umeda
Yoshio Shinozuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOGE DENKI KOGYO KK
Noge Electric Industries Co Ltd
Original Assignee
NOGE DENKI KOGYO KK
Noge Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOGE DENKI KOGYO KK, Noge Electric Industries Co Ltd filed Critical NOGE DENKI KOGYO KK
Priority to JP15640679A priority Critical patent/JPS6024586B2/ja
Publication of JPS5679459A publication Critical patent/JPS5679459A/ja
Publication of JPS6024586B2 publication Critical patent/JPS6024586B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15640679A 1979-12-04 1979-12-04 半導体装置モ−ルド後の外部リ−ドのめつき前処理方法 Expired JPS6024586B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15640679A JPS6024586B2 (ja) 1979-12-04 1979-12-04 半導体装置モ−ルド後の外部リ−ドのめつき前処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15640679A JPS6024586B2 (ja) 1979-12-04 1979-12-04 半導体装置モ−ルド後の外部リ−ドのめつき前処理方法

Publications (2)

Publication Number Publication Date
JPS5679459A true JPS5679459A (en) 1981-06-30
JPS6024586B2 JPS6024586B2 (ja) 1985-06-13

Family

ID=15627039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15640679A Expired JPS6024586B2 (ja) 1979-12-04 1979-12-04 半導体装置モ−ルド後の外部リ−ドのめつき前処理方法

Country Status (1)

Country Link
JP (1) JPS6024586B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188830A (en) * 1981-05-16 1982-11-19 Toshiba Corp Removing method for resin burr of semiconductor device
JPS58111358A (ja) * 1981-12-25 1983-07-02 Kyushu Nogeden:Kk モ−ルド済み半導体装置の外部リ−ド上のモ−ルド被膜膨潤装置
JPS63142824A (ja) * 1986-12-05 1988-06-15 Mitsubishi Electric Corp 樹脂封止型半導体装置の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6118886U (ja) * 1984-07-05 1986-02-03 敏 田中 鉛筆ホルダ−

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188830A (en) * 1981-05-16 1982-11-19 Toshiba Corp Removing method for resin burr of semiconductor device
JPH0223026B2 (ja) * 1981-05-16 1990-05-22 Tokyo Shibaura Electric Co
JPS58111358A (ja) * 1981-12-25 1983-07-02 Kyushu Nogeden:Kk モ−ルド済み半導体装置の外部リ−ド上のモ−ルド被膜膨潤装置
JPS63142824A (ja) * 1986-12-05 1988-06-15 Mitsubishi Electric Corp 樹脂封止型半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6024586B2 (ja) 1985-06-13

Similar Documents

Publication Publication Date Title
CN204993518U (zh) 一种金属手机后壳
JPS5679459A (en) Pretreatment method for plating of external lead wire after semiconductor molding
WO2002064862A2 (en) Method for producing plated molded product
CN111996582A (zh) 一种用于银工件的电化学抛光液及其应用和银工件的抗氧化方法
KR840000981A (ko) 금 도금 방법
ZA792309B (en) Process for sealing anodised aluminium
GB860290A (en) Electroformed article and a method of making the same
CN205603676U (zh) 一种铜牌镀锌生产线
JPS56135954A (en) Treatment of outside lead of mold semiconductor device before plating
JP3155551B2 (ja) グラフィック印刷用エッチング原板の製造方法とその装置
GB907950A (en) Electro-plating thin wire
JP2005520048A5 (ja)
CN202219250U (zh) 太阳能电池硅片的清洗装置
US3397133A (en) Apparatus for producing silver nitrate
JPS5467376A (en) Production of plastic molded type semiconductor device
JPS56110242A (en) Removal of oozed resin thin film
JPS5719064A (en) Coating method for aluminum product
JPS55125125A (en) Production of flexible copper-laminated substrate
JPS54121239A (en) Plating internal surface of elongated metal pipe
KR940021155A (ko) 다공성 금형의 전주(電鑄)형성 방법
JPS5591994A (en) High speed electrolytic silver plating method
SU105697A1 (ru) Способ латунировани поверхности стальной арматуры
GB1404289A (en) Electrophoretic coating
JPS5694155A (en) Process for making selective absorption film for solar energy
JPS5534485A (en) Manufacture of resin sealed type semiconductor