JPS5667947A - Case of microwave integrated circuit system - Google Patents

Case of microwave integrated circuit system

Info

Publication number
JPS5667947A
JPS5667947A JP14521079A JP14521079A JPS5667947A JP S5667947 A JPS5667947 A JP S5667947A JP 14521079 A JP14521079 A JP 14521079A JP 14521079 A JP14521079 A JP 14521079A JP S5667947 A JPS5667947 A JP S5667947A
Authority
JP
Japan
Prior art keywords
substrate
integrated circuit
circuit system
brazing
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14521079A
Other languages
Japanese (ja)
Inventor
Tetsuo Mori
Osamu Ishihara
Hiroshi Sawano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14521079A priority Critical patent/JPS5667947A/en
Publication of JPS5667947A publication Critical patent/JPS5667947A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain a good high frequency characteristics by a method wherein through holes or a concave place spilling a brazing material are installed at an earthing surface to which a substrate of a micro wave integrated circuit system is fixedly earthed by brazing. CONSTITUTION:Many through holes 5 spilling brazing materials are installed at an earthing surface 6 of a case 1 and a substrate 2 of a microwave integrated circuit system is laid upon this earthing surface 6 and it is fixedly earthed by means of a brazing. By performing in this way, an excessive brazing material and the air between the substrate and the earthing surface can spill from the through holes 5, as a result, it is enabled that the overflowed excessive brazing material from the surface of the substrate does not impair the circuit operation and an insufficient stickiness between the substrate and the case due to an air layer does not deteriorate high frequency characteristics.
JP14521079A 1979-11-08 1979-11-08 Case of microwave integrated circuit system Pending JPS5667947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14521079A JPS5667947A (en) 1979-11-08 1979-11-08 Case of microwave integrated circuit system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14521079A JPS5667947A (en) 1979-11-08 1979-11-08 Case of microwave integrated circuit system

Publications (1)

Publication Number Publication Date
JPS5667947A true JPS5667947A (en) 1981-06-08

Family

ID=15379921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14521079A Pending JPS5667947A (en) 1979-11-08 1979-11-08 Case of microwave integrated circuit system

Country Status (1)

Country Link
JP (1) JPS5667947A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0583024A (en) * 1991-09-20 1993-04-02 Matsushita Electric Ind Co Ltd Microstrip antenna
JP2007038335A (en) * 2005-08-02 2007-02-15 Asmo Co Ltd Shaft manufacturing method
JP2009213050A (en) * 2008-03-06 2009-09-17 Denso Corp High-frequency device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0583024A (en) * 1991-09-20 1993-04-02 Matsushita Electric Ind Co Ltd Microstrip antenna
JP2007038335A (en) * 2005-08-02 2007-02-15 Asmo Co Ltd Shaft manufacturing method
JP2009213050A (en) * 2008-03-06 2009-09-17 Denso Corp High-frequency device
JP4645664B2 (en) * 2008-03-06 2011-03-09 株式会社デンソー High frequency equipment
US8134427B2 (en) 2008-03-06 2012-03-13 Denso Corporation Waveguide tube formed by laminating a plate and substrates having waveguide passages

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