JPS566479A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS566479A JPS566479A JP8233579A JP8233579A JPS566479A JP S566479 A JPS566479 A JP S566479A JP 8233579 A JP8233579 A JP 8233579A JP 8233579 A JP8233579 A JP 8233579A JP S566479 A JPS566479 A JP S566479A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- integrated circuit
- semiconductor integrated
- electric signal
- electric signals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 108091008695 photoreceptors Proteins 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain inexpensively a semiconductor integrated circuit with high workability by supplying DC power for operating the circuit in the IC chip by a photocoupling type and introducing an electric signal in the IC chip externally thereby. CONSTITUTION:When a light is irradiated from a light emitting element 11 on a substrate 10 to a solar battery 8, the solar battery 8 generates a DC voltage and supplies it into a semiconductor integrated circuit in an IC chip 7 to allow the IC chip 7 to operate as predetermined. An electric signal outputted from the IC chip 7 in operation irradiates the light emitting elements 9a-9e on the IC chip 7 equivalent in magnitude to the electric signal. The lights from these elements are received by photoreceptors 12a-12e. Thus, electric signals substantially equal to the electric signals of the IC chip 7 are generated at the photoreceptor group 12 on the substrate 10 to lead out the electric signals in the IC chip 7 externally.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8233579A JPS566479A (en) | 1979-06-26 | 1979-06-26 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8233579A JPS566479A (en) | 1979-06-26 | 1979-06-26 | Semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS566479A true JPS566479A (en) | 1981-01-23 |
Family
ID=13771682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8233579A Pending JPS566479A (en) | 1979-06-26 | 1979-06-26 | Semiconductor integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS566479A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893268A (en) * | 1981-11-30 | 1983-06-02 | Toshiba Corp | Photocoupling integrated circuit |
JPS59501431A (en) * | 1982-08-19 | 1984-08-09 | ウエスターン エレクトリツク カムパニー,インコーポレーテツド | Optically coupled integrated circuit array |
US5200631A (en) * | 1991-08-06 | 1993-04-06 | International Business Machines Corporation | High speed optical interconnect |
JPH0629513A (en) * | 1991-12-23 | 1994-02-04 | Internatl Business Mach Corp <Ibm> | Bilithic composite system for photo- electronic integration |
-
1979
- 1979-06-26 JP JP8233579A patent/JPS566479A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893268A (en) * | 1981-11-30 | 1983-06-02 | Toshiba Corp | Photocoupling integrated circuit |
JPS59501431A (en) * | 1982-08-19 | 1984-08-09 | ウエスターン エレクトリツク カムパニー,インコーポレーテツド | Optically coupled integrated circuit array |
US5200631A (en) * | 1991-08-06 | 1993-04-06 | International Business Machines Corporation | High speed optical interconnect |
JPH0629513A (en) * | 1991-12-23 | 1994-02-04 | Internatl Business Mach Corp <Ibm> | Bilithic composite system for photo- electronic integration |
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