JPS566459A - Removing method of component carried on printed board - Google Patents
Removing method of component carried on printed boardInfo
- Publication number
- JPS566459A JPS566459A JP8017179A JP8017179A JPS566459A JP S566459 A JPS566459 A JP S566459A JP 8017179 A JP8017179 A JP 8017179A JP 8017179 A JP8017179 A JP 8017179A JP S566459 A JPS566459 A JP S566459A
- Authority
- JP
- Japan
- Prior art keywords
- connecting portion
- solder
- printed board
- lead wire
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 abstract 7
- 238000010438 heat treatment Methods 0.000 abstract 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 5
- 239000011888 foil Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8017179A JPS566459A (en) | 1979-06-27 | 1979-06-27 | Removing method of component carried on printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8017179A JPS566459A (en) | 1979-06-27 | 1979-06-27 | Removing method of component carried on printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS566459A true JPS566459A (en) | 1981-01-23 |
JPS6129159B2 JPS6129159B2 (enrdf_load_stackoverflow) | 1986-07-04 |
Family
ID=13710877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8017179A Granted JPS566459A (en) | 1979-06-27 | 1979-06-27 | Removing method of component carried on printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS566459A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61108196A (ja) * | 1984-10-31 | 1986-05-26 | シャープ株式会社 | 素子の取りはずし装置 |
JPS62172175U (enrdf_load_stackoverflow) * | 1986-12-06 | 1987-10-31 | ||
US5172469A (en) * | 1991-05-08 | 1992-12-22 | Hughes Aircraft Company | Advanced part removal and torque shear station |
US5174016A (en) * | 1991-04-25 | 1992-12-29 | Toddco General, Inc. | Chip removal apparatus and method of using same |
-
1979
- 1979-06-27 JP JP8017179A patent/JPS566459A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61108196A (ja) * | 1984-10-31 | 1986-05-26 | シャープ株式会社 | 素子の取りはずし装置 |
JPS62172175U (enrdf_load_stackoverflow) * | 1986-12-06 | 1987-10-31 | ||
US5174016A (en) * | 1991-04-25 | 1992-12-29 | Toddco General, Inc. | Chip removal apparatus and method of using same |
US5172469A (en) * | 1991-05-08 | 1992-12-22 | Hughes Aircraft Company | Advanced part removal and torque shear station |
Also Published As
Publication number | Publication date |
---|---|
JPS6129159B2 (enrdf_load_stackoverflow) | 1986-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0376541A3 (en) | Removing meltable material | |
JPS6413735A (en) | Method of mounting semiconductor device and mounted semiconductor device | |
KR860003756A (ko) | 전자회로 장치와 그 제조방법 | |
ATE7868T1 (de) | Vorrichtung zum ausloeten elektronischer bauteile aus leiterplatten. | |
US3815806A (en) | Desoldering fixture | |
JPS54138371A (en) | Solder supplying method | |
JPS566459A (en) | Removing method of component carried on printed board | |
JPS5586130A (en) | Connection of semiconductor element | |
JPS6442193A (en) | Wiring board | |
JPS5554265A (en) | Reflow soldering method | |
JPS5640267A (en) | Pretinning method for flat lead | |
MY113624A (en) | Soldering apparatus and a method thereof | |
JPS5480254A (en) | Soldering method | |
JPS57188833A (en) | Connecting method for material to be connected | |
JPS63163273U (enrdf_load_stackoverflow) | ||
DE3370599D1 (en) | Working head for an electric device for desoldering soldering joints, and for the removal of the liquid solder | |
JPS5480255A (en) | Soldering method | |
ZA793505B (en) | A method of and device for connecting a cable to the surface of a metal work piece | |
JPS6448495A (en) | Soldering device for flat package ic | |
JPS56139276A (en) | Soldering device | |
JPS6418572A (en) | Soldering device | |
JPS63101174U (enrdf_load_stackoverflow) | ||
JPS6482691A (en) | Attachment of surface mounting component to printed board | |
JPS57197843A (en) | Lead pin for integrated circuit device | |
JPS5578552A (en) | Semiconductor |