JPS5662864A - Heat-sensitive film adhesive - Google Patents
Heat-sensitive film adhesiveInfo
- Publication number
- JPS5662864A JPS5662864A JP13869779A JP13869779A JPS5662864A JP S5662864 A JPS5662864 A JP S5662864A JP 13869779 A JP13869779 A JP 13869779A JP 13869779 A JP13869779 A JP 13869779A JP S5662864 A JPS5662864 A JP S5662864A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- copolymer
- polyamide resin
- components
- crosslinked copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: The titled adhesive, suitable for bonding a (non)woven fabric, foam, wood, metal, paper, etc. having improved low-temperature adhesive property, heat resistance and hot tackiness, and prepared by incorporating a specific ion crosslinked copolymer and a polyamide resin in specified proportion.
CONSTITUTION: An adhesive comprising (A) 95W20pts.wt. ion crosslinked copolymer containing ehtylene as a copolymer consistutent, preferably ethylene-α,β-ethylenically unsaturated carvoxylic acid copolymer with an ethylene content ≥85mol%, preferably corsslinked with a metallic ion, and (B) 5W80pts.wt. polyamide resin, e.g. nylon-6, having a melting point ≤160°C, preferably 120W80°C. (C) A low- molecular weight polyethylene or halogenated paraffin wax is incorporated if necessary in an amount of 5W100pts.wt. per 100pts.wt. the total amount of the components (A) and (B). The melt index (MI) ratio of the components (A) to (B) is preferably in the range of the formula.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13869779A JPS5662864A (en) | 1979-10-29 | 1979-10-29 | Heat-sensitive film adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13869779A JPS5662864A (en) | 1979-10-29 | 1979-10-29 | Heat-sensitive film adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5662864A true JPS5662864A (en) | 1981-05-29 |
Family
ID=15228000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13869779A Pending JPS5662864A (en) | 1979-10-29 | 1979-10-29 | Heat-sensitive film adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5662864A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5971378A (en) * | 1982-10-19 | 1984-04-23 | Du Pont Mitsui Polychem Co Ltd | Heat-sensitive film adhesive |
JPS59220331A (en) * | 1983-05-06 | 1984-12-11 | ザ ダウ ケミカル カンパニ− | Inflated nylon film and manufacture thereof |
WO2006017784A1 (en) * | 2004-08-05 | 2006-02-16 | H.B. Fuller Licensing & Financing, Inc. | Polyamide adhesive and articles including the same |
-
1979
- 1979-10-29 JP JP13869779A patent/JPS5662864A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5971378A (en) * | 1982-10-19 | 1984-04-23 | Du Pont Mitsui Polychem Co Ltd | Heat-sensitive film adhesive |
JPH0324509B2 (en) * | 1982-10-19 | 1991-04-03 | Mitsui Du Pont Polychemical | |
JPS59220331A (en) * | 1983-05-06 | 1984-12-11 | ザ ダウ ケミカル カンパニ− | Inflated nylon film and manufacture thereof |
WO2006017784A1 (en) * | 2004-08-05 | 2006-02-16 | H.B. Fuller Licensing & Financing, Inc. | Polyamide adhesive and articles including the same |
US7537840B2 (en) | 2004-08-05 | 2009-05-26 | H.B. Licensing & Financing, Inc. | Polyamide adhesive and articles including the same |
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