JPS5589364A - Powdery hot-melt mixture - Google Patents

Powdery hot-melt mixture

Info

Publication number
JPS5589364A
JPS5589364A JP16012078A JP16012078A JPS5589364A JP S5589364 A JPS5589364 A JP S5589364A JP 16012078 A JP16012078 A JP 16012078A JP 16012078 A JP16012078 A JP 16012078A JP S5589364 A JPS5589364 A JP S5589364A
Authority
JP
Japan
Prior art keywords
powder
nylon
melt mixture
mixture
copolyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16012078A
Other languages
Japanese (ja)
Inventor
Kazuo Saotome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D J- K INTERNATL KK
DEII JIEE KEE INTERNATIONAL KK
Original Assignee
D J- K INTERNATL KK
DEII JIEE KEE INTERNATIONAL KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by D J- K INTERNATL KK, DEII JIEE KEE INTERNATIONAL KK filed Critical D J- K INTERNATL KK
Priority to JP16012078A priority Critical patent/JPS5589364A/en
Publication of JPS5589364A publication Critical patent/JPS5589364A/en
Pending legal-status Critical Current

Links

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  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To prepare the title mixture for adhesive or powder coaing, having excellent wettability and high adhesivity to metal surface, at a low cost, by mixing powder of a polyamide such as nylon 11, nylon 12 or their copolyamide, with powder of an ionomer.
CONSTITUTION: A mixture of (A) powder of a polyamide selected from (a) nylon 11, (b) nylon 12, and (c) the copolyamide of (a) and (b), and (B) powder of an ionomer [e.g. the one having high melt flowability and a relatively high melt index, e.g. Surlin AD-8109 (MI 300, Na ion)]. The amounts of (A) and (B) components are, in general, 70W95wt% and 5W30wt%, respectively.
COPYRIGHT: (C)1980,JPO&Japio
JP16012078A 1978-12-27 1978-12-27 Powdery hot-melt mixture Pending JPS5589364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16012078A JPS5589364A (en) 1978-12-27 1978-12-27 Powdery hot-melt mixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16012078A JPS5589364A (en) 1978-12-27 1978-12-27 Powdery hot-melt mixture

Publications (1)

Publication Number Publication Date
JPS5589364A true JPS5589364A (en) 1980-07-05

Family

ID=15708287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16012078A Pending JPS5589364A (en) 1978-12-27 1978-12-27 Powdery hot-melt mixture

Country Status (1)

Country Link
JP (1) JPS5589364A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374231A (en) * 1980-05-13 1983-02-15 Raychem Corporation Adhesive composition
JPS6195029A (en) * 1984-10-15 1986-05-13 Mitsui Toatsu Chem Inc Production of polyimide resin powder, bonding method and film-forming method using polyimide resin powder
JPH11349867A (en) * 1998-05-26 1999-12-21 Creanova Spezialchem Gmbh Powder coating composition for electrostatic coating
JP2011522946A (en) * 2008-06-13 2011-08-04 ボスティク エス．アー． Novel polyamide-based hot melt adhesive composition
JP2013096071A (en) * 2011-10-28 2013-05-20 Tokyo Printing Ink Mfg Co Ltd Structure sheet for waste water
JP2013528250A (en) * 2010-06-11 2013-07-08 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Polymer formulations useful for ballistic applications
JP2020023674A (en) * 2018-07-25 2020-02-13 サンスター技研株式会社 Hot-melt adhesive for structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374231A (en) * 1980-05-13 1983-02-15 Raychem Corporation Adhesive composition
JPS6195029A (en) * 1984-10-15 1986-05-13 Mitsui Toatsu Chem Inc Production of polyimide resin powder, bonding method and film-forming method using polyimide resin powder
JPH11349867A (en) * 1998-05-26 1999-12-21 Creanova Spezialchem Gmbh Powder coating composition for electrostatic coating
JP2011522946A (en) * 2008-06-13 2011-08-04 ボスティク エス．アー． Novel polyamide-based hot melt adhesive composition
JP2013528250A (en) * 2010-06-11 2013-07-08 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Polymer formulations useful for ballistic applications
JP2013096071A (en) * 2011-10-28 2013-05-20 Tokyo Printing Ink Mfg Co Ltd Structure sheet for waste water
JP2020023674A (en) * 2018-07-25 2020-02-13 サンスター技研株式会社 Hot-melt adhesive for structure

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