JPS5662862A - Electrically conductive adhesive - Google Patents

Electrically conductive adhesive

Info

Publication number
JPS5662862A
JPS5662862A JP13908379A JP13908379A JPS5662862A JP S5662862 A JPS5662862 A JP S5662862A JP 13908379 A JP13908379 A JP 13908379A JP 13908379 A JP13908379 A JP 13908379A JP S5662862 A JPS5662862 A JP S5662862A
Authority
JP
Japan
Prior art keywords
powder
resin
electrically conductive
conductive adhesive
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13908379A
Other languages
Japanese (ja)
Inventor
Makoto Yoshida
Satoru Baba
Kimio Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OOPACK KK
OOPATSUKU KK
Original Assignee
OOPACK KK
OOPATSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OOPACK KK, OOPATSUKU KK filed Critical OOPACK KK
Priority to JP13908379A priority Critical patent/JPS5662862A/en
Publication of JPS5662862A publication Critical patent/JPS5662862A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: An electrically conductive adhesive, capable of inhibiting the settling of powder without damaging the electric conductivity and requiring the frequent agitation, and prepared by dispersing a silvered nickel (alloy) powder having a small specific gravity instead of silver powder conductor in a liquid resin.
CONSTITUTION: A silver coating layer 7 of thickness 0.02W3μ is formed on nickel (alloy) powder of small specific gravity, e.g. powder 6 of particle size 0.1W30μ, by the plating method. The coated powder 8 is then dispersed in a liquid synthetic resin 5, e.g. alkyd resin, phenolic resin or expoxy resin, to give the aimed electrically conductive adhesive 3.
COPYRIGHT: (C)1981,JPO&Japio
JP13908379A 1979-10-27 1979-10-27 Electrically conductive adhesive Pending JPS5662862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13908379A JPS5662862A (en) 1979-10-27 1979-10-27 Electrically conductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13908379A JPS5662862A (en) 1979-10-27 1979-10-27 Electrically conductive adhesive

Publications (1)

Publication Number Publication Date
JPS5662862A true JPS5662862A (en) 1981-05-29

Family

ID=15237080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13908379A Pending JPS5662862A (en) 1979-10-27 1979-10-27 Electrically conductive adhesive

Country Status (1)

Country Link
JP (1) JPS5662862A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767659A (en) * 1980-10-13 1982-04-24 Toichiro Izawa Resin composition containing metallic powder
JPS60233166A (en) * 1984-05-04 1985-11-19 Matsushita Electric Ind Co Ltd Electrically conductive coating material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767659A (en) * 1980-10-13 1982-04-24 Toichiro Izawa Resin composition containing metallic powder
JPS60233166A (en) * 1984-05-04 1985-11-19 Matsushita Electric Ind Co Ltd Electrically conductive coating material

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