JPS5655219A - Method of adjusting mold temperature and device thereof - Google Patents

Method of adjusting mold temperature and device thereof

Info

Publication number
JPS5655219A
JPS5655219A JP13136279A JP13136279A JPS5655219A JP S5655219 A JPS5655219 A JP S5655219A JP 13136279 A JP13136279 A JP 13136279A JP 13136279 A JP13136279 A JP 13136279A JP S5655219 A JPS5655219 A JP S5655219A
Authority
JP
Japan
Prior art keywords
mold
heating
temperature
valve
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13136279A
Other languages
Japanese (ja)
Inventor
Hidefumi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Kanto Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Seiki Co Ltd filed Critical Kanto Seiki Co Ltd
Priority to JP13136279A priority Critical patent/JPS5655219A/en
Publication of JPS5655219A publication Critical patent/JPS5655219A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/007—Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To mintain a mold in a proper temperature at all times and to improve a working efficiency by shortening a molding cycle, by a method wherein two molding temperatures are detected, a valve is switched over according to the temperature at each mold, and either a heating medium or a cooling medium is fed to the mold according to the condition. CONSTITUTION:With a pump 6 actuated after a heater 5 is electrified for heating and cooling water is fed to a cooler 8, liquid in a liquid bath 7 is heated when it passes through a heater 5 through a circulating pipe 3, and it further passes through a liquid flow hole 2 in a mold 1 through a valve 4 for heating a mold 1. It returns to a liquid bath 7 after passing through a valve 10, a solenoid operated valve 9, and a side path pipe 11, and cycles again for heating the mold 1. The mold 1 heated to a given temperature is adhered closely to a mold 1' heated in a manner described above, and a molding materal molten by heating is poured into a gap formed thereupon for performing a molding process. When temperature of the mold 1 rises, an electric output is generated in a temperature detector 12, and electricity to a heater 5 is turned off, whereby the mold 1 is cooled.
JP13136279A 1979-10-11 1979-10-11 Method of adjusting mold temperature and device thereof Pending JPS5655219A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13136279A JPS5655219A (en) 1979-10-11 1979-10-11 Method of adjusting mold temperature and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13136279A JPS5655219A (en) 1979-10-11 1979-10-11 Method of adjusting mold temperature and device thereof

Publications (1)

Publication Number Publication Date
JPS5655219A true JPS5655219A (en) 1981-05-15

Family

ID=15056145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13136279A Pending JPS5655219A (en) 1979-10-11 1979-10-11 Method of adjusting mold temperature and device thereof

Country Status (1)

Country Link
JP (1) JPS5655219A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949915A (en) * 1982-09-14 1984-03-22 Kanto Seiki Kk Method and apparatus for controlling mold temperature
US4621678A (en) * 1982-09-13 1986-11-11 Cosden Technology, Inc. Heat exchanger apparatus for extruding thermoplastic compositions
US4902454A (en) * 1985-09-16 1990-02-20 Engel Maschinenbau Gesellschaft M.B.H. Process of tempering plastic injection molding tools
US5182117A (en) * 1990-04-26 1993-01-26 Toshiba Machine Co., Ltd. Heating and cooling unit
EP1758721A1 (en) * 2004-06-11 2007-03-07 Samsung Electronics Co., Ltd. Mold apparatus
EP1772246A2 (en) 2005-09-22 2007-04-11 Star Seiki Co., Ltd. Mold temperature regulating apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149357A (en) * 1975-06-18 1976-12-22 Yazaki Ind Chem Co Ltd Automatic temperature control equipment for metal mold and system for controlling this equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149357A (en) * 1975-06-18 1976-12-22 Yazaki Ind Chem Co Ltd Automatic temperature control equipment for metal mold and system for controlling this equipment

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621678A (en) * 1982-09-13 1986-11-11 Cosden Technology, Inc. Heat exchanger apparatus for extruding thermoplastic compositions
JPS5949915A (en) * 1982-09-14 1984-03-22 Kanto Seiki Kk Method and apparatus for controlling mold temperature
JPH0335091B2 (en) * 1982-09-14 1991-05-27 Kanto Seiki Co
US4902454A (en) * 1985-09-16 1990-02-20 Engel Maschinenbau Gesellschaft M.B.H. Process of tempering plastic injection molding tools
US5182117A (en) * 1990-04-26 1993-01-26 Toshiba Machine Co., Ltd. Heating and cooling unit
EP1758721A1 (en) * 2004-06-11 2007-03-07 Samsung Electronics Co., Ltd. Mold apparatus
EP1758721A4 (en) * 2004-06-11 2009-04-29 Samsung Electronics Co Ltd Mold apparatus
EP1772246A2 (en) 2005-09-22 2007-04-11 Star Seiki Co., Ltd. Mold temperature regulating apparatus
EP1772246A3 (en) * 2005-09-22 2007-10-17 Star Seiki Co., Ltd. Mold temperature regulating apparatus

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