JPS5655057A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5655057A
JPS5655057A JP13142179A JP13142179A JPS5655057A JP S5655057 A JPS5655057 A JP S5655057A JP 13142179 A JP13142179 A JP 13142179A JP 13142179 A JP13142179 A JP 13142179A JP S5655057 A JPS5655057 A JP S5655057A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
counterslack
postcuring
slack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13142179A
Other languages
English (en)
Other versions
JPS5753659B2 (ja
Inventor
Yoshiaki Sano
Kazuya Takahashi
Masaru Nemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13142179A priority Critical patent/JPS5655057A/ja
Publication of JPS5655057A publication Critical patent/JPS5655057A/ja
Publication of JPS5753659B2 publication Critical patent/JPS5753659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/0198—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP13142179A 1979-10-12 1979-10-12 Manufacture of semiconductor device Granted JPS5655057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13142179A JPS5655057A (en) 1979-10-12 1979-10-12 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13142179A JPS5655057A (en) 1979-10-12 1979-10-12 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5655057A true JPS5655057A (en) 1981-05-15
JPS5753659B2 JPS5753659B2 (ja) 1982-11-13

Family

ID=15057563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13142179A Granted JPS5655057A (en) 1979-10-12 1979-10-12 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5655057A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04313245A (ja) * 1991-04-11 1992-11-05 Mitsui High Tec Inc 半導体装置の製造方法
US5492866A (en) * 1992-07-31 1996-02-20 Nec Corporation Process for correcting warped surface of plastic encapsulated semiconductor device
JP2009194345A (ja) * 2008-02-18 2009-08-27 Spansion Llc 半導体装置の製造方法
EP1946373A4 (en) * 2005-10-19 2010-04-07 Texas Instruments Inc Semiconductor assembly for improved device warpage and solder ball coplanarity
JP2010115042A (ja) * 2008-11-07 2010-05-20 Yaskawa Electric Corp リニアモータ電機子およびリニアモータ並びにそれを用いたテーブル送り装置。

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538088A (en) * 1978-09-11 1980-03-17 Nec Kyushu Ltd Resin sealing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538088A (en) * 1978-09-11 1980-03-17 Nec Kyushu Ltd Resin sealing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04313245A (ja) * 1991-04-11 1992-11-05 Mitsui High Tec Inc 半導体装置の製造方法
US5492866A (en) * 1992-07-31 1996-02-20 Nec Corporation Process for correcting warped surface of plastic encapsulated semiconductor device
EP1946373A4 (en) * 2005-10-19 2010-04-07 Texas Instruments Inc Semiconductor assembly for improved device warpage and solder ball coplanarity
JP2009194345A (ja) * 2008-02-18 2009-08-27 Spansion Llc 半導体装置の製造方法
JP2010115042A (ja) * 2008-11-07 2010-05-20 Yaskawa Electric Corp リニアモータ電機子およびリニアモータ並びにそれを用いたテーブル送り装置。

Also Published As

Publication number Publication date
JPS5753659B2 (ja) 1982-11-13

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