JPS5653470B2 - - Google Patents

Info

Publication number
JPS5653470B2
JPS5653470B2 JP6206477A JP6206477A JPS5653470B2 JP S5653470 B2 JPS5653470 B2 JP S5653470B2 JP 6206477 A JP6206477 A JP 6206477A JP 6206477 A JP6206477 A JP 6206477A JP S5653470 B2 JPS5653470 B2 JP S5653470B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6206477A
Other versions
JPS52145898A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS52145898A publication Critical patent/JPS52145898A/ja
Publication of JPS5653470B2 publication Critical patent/JPS5653470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • B23K26/043Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP6206477A 1976-05-28 1977-05-27 Method of and device for machining work precisely placed in shining area of working laser Granted JPS52145898A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624121 DE2624121A1 (de) 1976-05-28 1976-05-28 Verfahren zum genauen bearbeiten eines im arbeitsfeld eines bearbeitungslasers angeordneten werkstueckes sowie vorrichtung zur ausuebung des verfahrens

Publications (2)

Publication Number Publication Date
JPS52145898A JPS52145898A (en) 1977-12-05
JPS5653470B2 true JPS5653470B2 (ja) 1981-12-18

Family

ID=5979298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6206477A Granted JPS52145898A (en) 1976-05-28 1977-05-27 Method of and device for machining work precisely placed in shining area of working laser

Country Status (10)

Country Link
JP (1) JPS52145898A (ja)
AT (1) AT355140B (ja)
BE (1) BE855155A (ja)
CH (1) CH616357A5 (ja)
DE (1) DE2624121A1 (ja)
FR (1) FR2352624A1 (ja)
GB (1) GB1575054A (ja)
IT (1) IT1079230B (ja)
NL (1) NL7705878A (ja)
SE (1) SE411717B (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5566825A (en) * 1978-11-14 1980-05-20 Toshiba Corp Assembling method of electron gun
JPS6121192Y2 (ja) * 1980-09-02 1986-06-25
CA1223644A (en) * 1981-09-24 1987-06-30 James R. Morris Microsurgical laser
DE3147355C2 (de) * 1981-11-30 1986-05-07 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Justieren des Bezugssystems eines vorprogrammierbaren Strahlenablenksystems eines im Riesenimpulsbetrieb arbeitenden Lasergerätes
DE3235714A1 (de) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum justieren von kontaktfedern in einem relais
DE3411140A1 (de) * 1984-03-26 1985-09-26 BIAS Forschungs- und Entwicklungs-Labor für angewandte Strahltechnik GmbH, 2820 Bremen Verfahren zum ausrichten eines arbeitskopfes fuer eine fokussierte hochleistungsenergiequelle und arbeitskopf, insbesondere zur durchfuehrung des verfahrens
JPS61103695A (ja) * 1984-10-29 1986-05-22 Mitsubishi Electric Corp 三次元レ−ザ加工機
DE3542328A1 (de) * 1985-01-16 1986-07-17 Wild Heerbrugg AG, Heerbrugg Verfahren und vorrichtung zum selbstaendigen ausrichten eines messinstruments auf einen zielpunkt
CA1265206A (en) * 1985-02-23 1990-01-30 Thomas L. Foulkes Laser apparatus with a focus control unit
DE3528047A1 (de) * 1985-08-05 1987-02-05 Bbc Brown Boveri & Cie Verfahren zum orten von unbekannten gegenstaenden
DE3539933A1 (de) * 1985-11-11 1987-05-14 Nixdorf Computer Ag Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine
DE3829350A1 (de) * 1988-08-30 1990-03-01 Messerschmitt Boelkow Blohm Verfahren und einrichtung zur positionierung von loetlasern
DE4430220C2 (de) 1994-08-25 1998-01-22 Fraunhofer Ges Forschung Verfahren zur Steuerung der Laserstrahlintensitätsverteilung auf der Oberfläche zu bearbeitender Bauteile
DE29505985U1 (de) * 1995-04-06 1995-07-20 Bestenlehrer Alexander Vorrichtung zum Bearbeiten, insbesondere zum Polieren und Strukturieren von beliebigen 3D-Formflächen mittels eines Laserstrahls
DE19722415A1 (de) * 1997-05-28 1998-12-03 Fraunhofer Ges Forschung Verfahren zur Lage- und Formkorrektur der Bearbeitungsgeometrie bei der Laserbearbeitung
DE19963010B4 (de) * 1999-12-22 2005-02-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Laserbearbeitung von Werkstücken
KR20070122548A (ko) 2005-04-19 2007-12-31 코닌클리케 필립스 일렉트로닉스 엔.브이. 층에 방사빔을 향하게 하는 장치, 이 장치를 구비한노광장치와, 이 노광장치를 사용하는 방법
EP2347873B1 (de) 2005-11-23 2022-03-23 HOMAG GmbH Verfahren und Vorrichtung zur Beschichtung von Bauteilen
JP6003934B2 (ja) * 2014-03-20 2016-10-05 トヨタ自動車株式会社 レーザー溶接検査装置及びレーザー溶接検査方法
PL3124163T3 (pl) * 2015-07-29 2020-10-19 Yaskawa Slovenija D.O.O Układ i sposób obróbki laserowej

Also Published As

Publication number Publication date
AT355140B (de) 1980-02-11
JPS52145898A (en) 1977-12-05
GB1575054A (en) 1980-09-17
SE411717B (sv) 1980-02-04
IT1079230B (it) 1985-05-08
BE855155A (fr) 1977-09-16
CH616357A5 (en) 1980-03-31
DE2624121A1 (de) 1977-12-15
FR2352624B1 (ja) 1981-07-17
SE7706257L (sv) 1977-11-29
NL7705878A (nl) 1977-11-30
FR2352624A1 (fr) 1977-12-23

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