JPS52145898A - Method of and device for machining work precisely placed in shining area of working laser - Google Patents

Method of and device for machining work precisely placed in shining area of working laser

Info

Publication number
JPS52145898A
JPS52145898A JP6206477A JP6206477A JPS52145898A JP S52145898 A JPS52145898 A JP S52145898A JP 6206477 A JP6206477 A JP 6206477A JP 6206477 A JP6206477 A JP 6206477A JP S52145898 A JPS52145898 A JP S52145898A
Authority
JP
Japan
Prior art keywords
machining work
working laser
precisely placed
work precisely
shining area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6206477A
Other languages
English (en)
Other versions
JPS5653470B2 (ja
Inventor
Matsuterin Anton
Heruman Maruseru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS52145898A publication Critical patent/JPS52145898A/ja
Publication of JPS5653470B2 publication Critical patent/JPS5653470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • B23K26/043Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP6206477A 1976-05-28 1977-05-27 Method of and device for machining work precisely placed in shining area of working laser Granted JPS52145898A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624121 DE2624121A1 (de) 1976-05-28 1976-05-28 Verfahren zum genauen bearbeiten eines im arbeitsfeld eines bearbeitungslasers angeordneten werkstueckes sowie vorrichtung zur ausuebung des verfahrens

Publications (2)

Publication Number Publication Date
JPS52145898A true JPS52145898A (en) 1977-12-05
JPS5653470B2 JPS5653470B2 (ja) 1981-12-18

Family

ID=5979298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6206477A Granted JPS52145898A (en) 1976-05-28 1977-05-27 Method of and device for machining work precisely placed in shining area of working laser

Country Status (10)

Country Link
JP (1) JPS52145898A (ja)
AT (1) AT355140B (ja)
BE (1) BE855155A (ja)
CH (1) CH616357A5 (ja)
DE (1) DE2624121A1 (ja)
FR (1) FR2352624A1 (ja)
GB (1) GB1575054A (ja)
IT (1) IT1079230B (ja)
NL (1) NL7705878A (ja)
SE (1) SE411717B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61103695A (ja) * 1984-10-29 1986-05-22 Mitsubishi Electric Corp 三次元レ−ザ加工機

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5566825A (en) * 1978-11-14 1980-05-20 Toshiba Corp Assembling method of electron gun
JPS6121192Y2 (ja) * 1980-09-02 1986-06-25
EP0075860A3 (en) * 1981-09-24 1984-12-27 James Robert Morris Microsurgical laser
DE3147355C2 (de) * 1981-11-30 1986-05-07 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Justieren des Bezugssystems eines vorprogrammierbaren Strahlenablenksystems eines im Riesenimpulsbetrieb arbeitenden Lasergerätes
DE3235714A1 (de) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum justieren von kontaktfedern in einem relais
DE3411140A1 (de) * 1984-03-26 1985-09-26 BIAS Forschungs- und Entwicklungs-Labor für angewandte Strahltechnik GmbH, 2820 Bremen Verfahren zum ausrichten eines arbeitskopfes fuer eine fokussierte hochleistungsenergiequelle und arbeitskopf, insbesondere zur durchfuehrung des verfahrens
DE3542328A1 (de) * 1985-01-16 1986-07-17 Wild Heerbrugg AG, Heerbrugg Verfahren und vorrichtung zum selbstaendigen ausrichten eines messinstruments auf einen zielpunkt
WO1986004847A1 (en) * 1985-02-23 1986-08-28 N.I.S. Engineering Limited Laser apparatus
DE3528047A1 (de) * 1985-08-05 1987-02-05 Bbc Brown Boveri & Cie Verfahren zum orten von unbekannten gegenstaenden
DE3539933A1 (de) * 1985-11-11 1987-05-14 Nixdorf Computer Ag Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine
DE3829350A1 (de) * 1988-08-30 1990-03-01 Messerschmitt Boelkow Blohm Verfahren und einrichtung zur positionierung von loetlasern
DE4430220C2 (de) * 1994-08-25 1998-01-22 Fraunhofer Ges Forschung Verfahren zur Steuerung der Laserstrahlintensitätsverteilung auf der Oberfläche zu bearbeitender Bauteile
DE29505985U1 (de) * 1995-04-06 1995-07-20 Bestenlehrer, Alexander, 91074 Herzogenaurach Vorrichtung zum Bearbeiten, insbesondere zum Polieren und Strukturieren von beliebigen 3D-Formflächen mittels eines Laserstrahls
DE19722415A1 (de) * 1997-05-28 1998-12-03 Fraunhofer Ges Forschung Verfahren zur Lage- und Formkorrektur der Bearbeitungsgeometrie bei der Laserbearbeitung
DE19963010B4 (de) * 1999-12-22 2005-02-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Laserbearbeitung von Werkstücken
JP2008537178A (ja) 2005-04-19 2008-09-11 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 層に向かって放射を指向させるデバイス、かかるデバイスを含む装置、およびかかる装置を使用する方法
ES2380041T3 (es) 2005-11-23 2012-05-08 Homag Holzbearbeitungssysteme Ag Procedimiento para el recubrimiento de componentes
JP6003934B2 (ja) * 2014-03-20 2016-10-05 トヨタ自動車株式会社 レーザー溶接検査装置及びレーザー溶接検査方法
EP3124163B1 (en) * 2015-07-29 2020-04-22 Yaskawa Slovenija d.o.o System and method for laser processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61103695A (ja) * 1984-10-29 1986-05-22 Mitsubishi Electric Corp 三次元レ−ザ加工機
JPH0257000B2 (ja) * 1984-10-29 1990-12-03 Mitsubishi Electric Corp

Also Published As

Publication number Publication date
JPS5653470B2 (ja) 1981-12-18
FR2352624A1 (fr) 1977-12-23
NL7705878A (nl) 1977-11-30
SE411717B (sv) 1980-02-04
SE7706257L (sv) 1977-11-29
DE2624121A1 (de) 1977-12-15
FR2352624B1 (ja) 1981-07-17
GB1575054A (en) 1980-09-17
CH616357A5 (en) 1980-03-31
IT1079230B (it) 1985-05-08
BE855155A (fr) 1977-09-16
AT355140B (de) 1980-02-11

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