JPS5650529A - Take out device for wafer pellet - Google Patents

Take out device for wafer pellet

Info

Publication number
JPS5650529A
JPS5650529A JP12533879A JP12533879A JPS5650529A JP S5650529 A JPS5650529 A JP S5650529A JP 12533879 A JP12533879 A JP 12533879A JP 12533879 A JP12533879 A JP 12533879A JP S5650529 A JPS5650529 A JP S5650529A
Authority
JP
Japan
Prior art keywords
pellet
tape
wafer
stuck
take out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12533879A
Other languages
Japanese (ja)
Inventor
Hideo Kamikawauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiichi Seiki Kk
Original Assignee
Daiichi Seiki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiichi Seiki Kk filed Critical Daiichi Seiki Kk
Priority to JP12533879A priority Critical patent/JPS5650529A/en
Publication of JPS5650529A publication Critical patent/JPS5650529A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To make it possible to take out a pellet securely from a tape without a slipping off the position by a method wherein the pressure at a depressed portion provided at the four corners of a wafer pellet being stuck to a masking tape is reduced. CONSTITUTION:When the pellet 1 stuck to a masking tape 2 comes to the center of a suction part 5, the pressure is reduced at the suction part 5, the tape 2 is curved downward as the dotted line and the pellet 1 is separated from the tape at the four corners. At this time the pellet 1 is stuck to the tape 2 at the center portion. Then the pellet is sucked up by a suction pipe 10, the pellet is separated from the tape and can be shifted to the desired position. In said mechanism, although the tape and the wafer are stuck rather strongly, since the four corners of the wafer are separated, the pellet can not only be sucked up easily, but also there is no fear for the damage of the pellet or the slipping position.
JP12533879A 1979-10-01 1979-10-01 Take out device for wafer pellet Pending JPS5650529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12533879A JPS5650529A (en) 1979-10-01 1979-10-01 Take out device for wafer pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12533879A JPS5650529A (en) 1979-10-01 1979-10-01 Take out device for wafer pellet

Publications (1)

Publication Number Publication Date
JPS5650529A true JPS5650529A (en) 1981-05-07

Family

ID=14907635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12533879A Pending JPS5650529A (en) 1979-10-01 1979-10-01 Take out device for wafer pellet

Country Status (1)

Country Link
JP (1) JPS5650529A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58183030A (en) * 1982-04-16 1983-10-26 花王株式会社 Kneading oils and fats composition for making confectionery and bead
EP0643916A2 (en) * 1993-08-31 1995-03-22 Unilever N.V. Choux-mixes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58183030A (en) * 1982-04-16 1983-10-26 花王株式会社 Kneading oils and fats composition for making confectionery and bead
JPS6028245B2 (en) * 1982-04-16 1985-07-03 花王株式会社 Kneaded oil and fat composition for confectionery and bread making
EP0643916A2 (en) * 1993-08-31 1995-03-22 Unilever N.V. Choux-mixes
EP0643916A3 (en) * 1993-08-31 1997-02-12 Unilever Nv Choux-mixes.

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