JPS5649930B2 - - Google Patents
Info
- Publication number
- JPS5649930B2 JPS5649930B2 JP7476472A JP7476472A JPS5649930B2 JP S5649930 B2 JPS5649930 B2 JP S5649930B2 JP 7476472 A JP7476472 A JP 7476472A JP 7476472 A JP7476472 A JP 7476472A JP S5649930 B2 JPS5649930 B2 JP S5649930B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476472A JPS5649930B2 (cg-RX-API-DMAC7.html) | 1972-07-25 | 1972-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476472A JPS5649930B2 (cg-RX-API-DMAC7.html) | 1972-07-25 | 1972-07-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4932999A JPS4932999A (cg-RX-API-DMAC7.html) | 1974-03-26 |
| JPS5649930B2 true JPS5649930B2 (cg-RX-API-DMAC7.html) | 1981-11-26 |
Family
ID=13556660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7476472A Expired JPS5649930B2 (cg-RX-API-DMAC7.html) | 1972-07-25 | 1972-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5649930B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920370A (ja) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | 導電性接着剤 |
| JPH0618853B2 (ja) * | 1987-04-03 | 1994-03-16 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
| JPH01316365A (ja) * | 1988-03-24 | 1989-12-21 | Shikoku Chem Corp | １−ベンジルイミダゾール化合物、該化合物の合成方法及び該化合物を用いるポリエポキシ樹脂の硬化方法 |
| US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| EP2192139A4 (en) | 2007-09-21 | 2012-08-15 | Nippon Soda Co | COMPRISING COMPLEX WITH AN EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGING |
| US8623942B2 (en) | 2009-03-11 | 2014-01-07 | Nippon Soda Co., Ltd. | Epoxy resin composition, curing agent, and curing accelerator |
| US9023956B2 (en) | 2009-03-17 | 2015-05-05 | Nippon Soda Co., Ltd. | Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| KR101493625B1 (ko) * | 2010-09-15 | 2015-02-23 | 닛뽕소다 가부시키가이샤 | 액상의 경화성 에폭시 수지 조성물 및 그것을 함유하는 접착제 |
| JP2013213168A (ja) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | プリプレグ用エポキシ樹脂組成物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497599A (cg-RX-API-DMAC7.html) * | 1972-05-29 | 1974-01-23 |
-
1972
- 1972-07-25 JP JP7476472A patent/JPS5649930B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4932999A (cg-RX-API-DMAC7.html) | 1974-03-26 |