JPS564258A - Boiling cooler - Google Patents

Boiling cooler

Info

Publication number
JPS564258A
JPS564258A JP8091679A JP8091679A JPS564258A JP S564258 A JPS564258 A JP S564258A JP 8091679 A JP8091679 A JP 8091679A JP 8091679 A JP8091679 A JP 8091679A JP S564258 A JPS564258 A JP S564258A
Authority
JP
Japan
Prior art keywords
space
pipe
mold
fin
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8091679A
Other languages
Japanese (ja)
Inventor
Shogo Itano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8091679A priority Critical patent/JPS564258A/en
Publication of JPS564258A publication Critical patent/JPS564258A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To facilitate installation work, by mold-fixing a radiation fin inside a casing made of an insulator and having a space for filling a coolant and by providing a pipe which is located outside the space distantly from the radiation fin and serves to connect a cooler and a condenser to each other. CONSTITUTION:An annular space 17 for filling a coolant is formed in a casing 16 which is made of an insulator and extends vertically. A radiation fin 18 is mold- fixing inside the space 17. The fin is provided with a pair of annular recesses 19 to facilitate sealing-up and securing. A connection pipe 20 is mold-fixing outside the space 17 and electrically insulated from the fin 18 and communicates with the space. The front end of the pipe 20 is expanded to facilitate sealing-up and securing. Mounting holes 21 are provided at the four corners of the casing 16 so that the holes are located at a distance from the space. Since the pipe 20 is coupled to a condenser 6 through a bellows 8 only, the positioning of a boiling cooler 15 in the replacement of a semiconductor unit 11 is facilitated and simplified.
JP8091679A 1979-06-25 1979-06-25 Boiling cooler Pending JPS564258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8091679A JPS564258A (en) 1979-06-25 1979-06-25 Boiling cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8091679A JPS564258A (en) 1979-06-25 1979-06-25 Boiling cooler

Publications (1)

Publication Number Publication Date
JPS564258A true JPS564258A (en) 1981-01-17

Family

ID=13731717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8091679A Pending JPS564258A (en) 1979-06-25 1979-06-25 Boiling cooler

Country Status (1)

Country Link
JP (1) JPS564258A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0279974A (en) * 1988-09-16 1990-03-20 Agency Of Ind Science & Technol Biocatalyst and bioreactor using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0279974A (en) * 1988-09-16 1990-03-20 Agency Of Ind Science & Technol Biocatalyst and bioreactor using the same
JPH0528594B2 (en) * 1988-09-16 1993-04-26 Kogyo Gijutsuin

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