IT8424036A0 - POWER SEMICONDUCTORS. ARRANGEMENT FOR COOLING DIRECTLY BY BOILING OF - Google Patents

POWER SEMICONDUCTORS. ARRANGEMENT FOR COOLING DIRECTLY BY BOILING OF

Info

Publication number
IT8424036A0
IT8424036A0 IT8424036A IT2403684A IT8424036A0 IT 8424036 A0 IT8424036 A0 IT 8424036A0 IT 8424036 A IT8424036 A IT 8424036A IT 2403684 A IT2403684 A IT 2403684A IT 8424036 A0 IT8424036 A0 IT 8424036A0
Authority
IT
Italy
Prior art keywords
boiling
arrangement
power semiconductors
cooling directly
cooling
Prior art date
Application number
IT8424036A
Other languages
Italian (it)
Other versions
IT8424036A1 (en
IT1178756B (en
Inventor
Kurt Hahn
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of IT8424036A0 publication Critical patent/IT8424036A0/en
Publication of IT8424036A1 publication Critical patent/IT8424036A1/en
Application granted granted Critical
Publication of IT1178756B publication Critical patent/IT1178756B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT24036/84A 1983-12-14 1984-12-13 PROVISION FOR COOLING DIRECTLY BY BOILING POWER SEMICONDUCTORS IT1178756B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3345668A DE3345668C2 (en) 1983-12-14 1983-12-14 Arrangement for direct evaporative cooling of power semiconductor components

Publications (3)

Publication Number Publication Date
IT8424036A0 true IT8424036A0 (en) 1984-12-13
IT8424036A1 IT8424036A1 (en) 1986-06-13
IT1178756B IT1178756B (en) 1987-09-16

Family

ID=6217212

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24036/84A IT1178756B (en) 1983-12-14 1984-12-13 PROVISION FOR COOLING DIRECTLY BY BOILING POWER SEMICONDUCTORS

Country Status (6)

Country Link
AT (1) AT391776B (en)
CH (1) CH666142A5 (en)
DE (1) DE3345668C2 (en)
ES (1) ES538283A0 (en)
IT (1) IT1178756B (en)
TR (1) TR22333A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3542755C1 (en) * 1985-11-30 1986-10-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Arrangement for direct boiling cooling of components in power electronics

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573574A (en) * 1969-08-12 1971-04-06 Gen Motors Corp Controlled rectifier mounting assembly
FR2327642A1 (en) * 1975-10-06 1977-05-06 Alsthom Cgee Liquid cooled mount for power semiconductors - has stack of ceramic encased semiconductors immersed in liquid in finned metal casing
JPS55129462U (en) * 1979-03-08 1980-09-12
FR2481051A1 (en) * 1980-04-21 1981-10-23 Alsthom Atlantique DEVICE FOR SUPPORTING POWER SEMICONDUCTOR ACCESSORIES FOR THEIR IGNITION AND PROTECTION
DE8206226U1 (en) * 1982-03-04 1983-07-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt RECTIFIER WITH BOILING COOLING
DE3240502A1 (en) * 1982-10-30 1984-05-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Boiling/cooling container for power-electronics components

Also Published As

Publication number Publication date
ATA396584A (en) 1990-05-15
DE3345668A1 (en) 1985-07-04
TR22333A (en) 1987-02-13
DE3345668C2 (en) 1986-01-09
IT8424036A1 (en) 1986-06-13
IT1178756B (en) 1987-09-16
AT391776B (en) 1990-11-26
ES8603233A1 (en) 1986-01-01
ES538283A0 (en) 1986-01-01
CH666142A5 (en) 1988-06-30

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