JPS5633851A - Semiconductor pellet and method for removing burr - Google Patents

Semiconductor pellet and method for removing burr

Info

Publication number
JPS5633851A
JPS5633851A JP10914679A JP10914679A JPS5633851A JP S5633851 A JPS5633851 A JP S5633851A JP 10914679 A JP10914679 A JP 10914679A JP 10914679 A JP10914679 A JP 10914679A JP S5633851 A JPS5633851 A JP S5633851A
Authority
JP
Japan
Prior art keywords
pellets
sieve
wafer
cracking
burr
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10914679A
Other languages
Japanese (ja)
Inventor
Hajime Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10914679A priority Critical patent/JPS5633851A/en
Publication of JPS5633851A publication Critical patent/JPS5633851A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To remove the burr occurring on the whole sides of the pellets at cracking a wafer by vibrating a sieve wherein plural pellets are put in the sieve. CONSTITUTION:A semiconductor wafer is diced as far as the midway of the direction of its thickness. Then, many pellets 3 obtained by cracking the wafer are put in a plane sieve 8 and the sieve 8 is vibrated. With the vibration repeated for the scores of minutes, the cracked parts of the pellets 3 on the sides of the semiconductor pellets which occurred by cracking the wafer become obtuse angle shape and the burr which have a bad effect on characteristics will be eliminated.
JP10914679A 1979-08-29 1979-08-29 Semiconductor pellet and method for removing burr Pending JPS5633851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10914679A JPS5633851A (en) 1979-08-29 1979-08-29 Semiconductor pellet and method for removing burr

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10914679A JPS5633851A (en) 1979-08-29 1979-08-29 Semiconductor pellet and method for removing burr

Publications (1)

Publication Number Publication Date
JPS5633851A true JPS5633851A (en) 1981-04-04

Family

ID=14502766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10914679A Pending JPS5633851A (en) 1979-08-29 1979-08-29 Semiconductor pellet and method for removing burr

Country Status (1)

Country Link
JP (1) JPS5633851A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5462900A (en) * 1993-03-15 1995-10-31 Rohm Co., Ltd. Method of manufacturing semiconductor elements without burrs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5462900A (en) * 1993-03-15 1995-10-31 Rohm Co., Ltd. Method of manufacturing semiconductor elements without burrs

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