JPS6072409A - Manufacture for piezoelectric vibrator - Google Patents
Manufacture for piezoelectric vibratorInfo
- Publication number
- JPS6072409A JPS6072409A JP18114983A JP18114983A JPS6072409A JP S6072409 A JPS6072409 A JP S6072409A JP 18114983 A JP18114983 A JP 18114983A JP 18114983 A JP18114983 A JP 18114983A JP S6072409 A JPS6072409 A JP S6072409A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- piezoelectric
- diced
- laser ray
- split
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000013078 crystal Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000007796 conventional method Methods 0.000 description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- IBXOPEGTOZQGQO-UHFFFAOYSA-N [Li].[Nb] Chemical compound [Li].[Nb] IBXOPEGTOZQGQO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Abstract
Description
【発明の詳細な説明】
＋ａ＋ 発明の技術分野
本発明は圧電振動子の製造方法に係り、特に圧電素板の
切断方法に関する。DETAILED DESCRIPTION OF THE INVENTION +a+ Technical Field of the Invention The present invention relates to a method for manufacturing a piezoelectric vibrator, and more particularly to a method for cutting a piezoelectric plate.
（ｂｌ 技術の背景
タンタル酸すチューム（ＬｉＴａ０３） 、ニオブ酸す
チューム（Ｉ、１Ｎｂ０３）等の圧電性単結晶をストリ
ップ化したストリップ形圧電振動子は、振動子を小形化
しスプリアス特性を改善するにば有’ｙＪＪとされ、実
用化を目指して多くのωＦ究がなされている。(bl Technology background) Strip-type piezoelectric vibrators, which are made by stripping piezoelectric single crystals such as tantalum oxide (LiTa03) and niobium oxide (I, 1Nb03), are used to miniaturize the vibrator and improve spurious characteristics. It is said that there is 'yJJ, and many studies on ωF are being conducted with the aim of putting it into practical use.
ストリップ形圧電振動子は圧電素板と圧電素板の表′裏
面に被着形成された電極、および該電極に夕１部から交
流電界を印加するために圧電素板の１（小方向の両端に
設けられた端子電極によって４＋Ｘｌ成される。そして
該端子電極に交流電界を印加すると、圧電素板は印加電
界と等しい周波数の応力を４１Ｕ７、且つ印加電界の周
波数が圧電素板の固有振動数に合致すると共振し強勢な
振動が得られる。A strip-type piezoelectric vibrator consists of a piezoelectric plate, electrodes formed on the front and back surfaces of the piezoelectric plate, and electrodes formed on both ends of the piezoelectric plate (both ends in the small direction) to apply an alternating electric field to the electrodes from one side to the other. 4+Xl is formed by the terminal electrode provided at When it matches, resonance occurs and strong vibrations are obtained.
しかし圧電素板の共振は圧電素板の表裏面間においての
み生じるのではなく、側面が鏡面加工されていると、側
面の間でも共振が生じスプリアス特性を悪化させる。し
たがって圧電振動子の製造において、圧電素板の表裏面
は鏡面加工をする必要があるが、その他の面ば粗面加工
の力が良い’ｌ・、１性が得られる等、高品質、高積度
の圧電振動子を得るためには、圧電素板表面の加工’ｌ
’ｌ’Ｊ度にまで１−分な配慮が要求される。However, the resonance of the piezoelectric plate does not only occur between the front and back surfaces of the piezoelectric plate, but if the side surfaces are mirror-finished, resonance also occurs between the side surfaces, worsening spurious characteristics. Therefore, in the production of piezoelectric vibrators, it is necessary to mirror-finish the front and back surfaces of the piezoelectric plate, but other surfaces can be roughened to achieve high quality and uniformity. In order to obtain a multidimensional piezoelectric vibrator, the surface of the piezoelectric plate must be processed.
Extra care is required to the extent of 'l'J.
（Ｃ１従来技術と問題点
第１図は圧電振動子の製造においてタンクル酸リチュー
ム（ＬｉＴａ０３） 、ニオブ酸すチューム（ＬｉＮｂ
０３）等の圧電単結晶のウェハーを切Ｉｖｉ・分制して
圧電素板を得る従来技術の一例である。図に示すごとく
図示してない軸によって高速回転するダイシングソー１
によりウェハー２ （厚さ６０〜８０μｍ）の切断・分
割を行っている。しかしグイシングツ−により１００％
切断すると圧電素板の側面−が鏡面状になり、前述の如
く側面の間でも共振が生じスプリアス特性を悪化させる
ので、非能率的ではあるがグイシングツ−による切断は
表面に傷を付りる程度に止め、後はこの傷に沿ってウェ
ハーを割り一つ一つの圧電素板に分割している。(C1 Prior Art and Problems Figure 1 shows how lithium tancharate (LiTa03) and lithium niobium acid (LiNb) are used in the production of piezoelectric vibrators.
This is an example of a conventional technique in which a piezoelectric single crystal wafer such as No. 03) is cut and separated to obtain a piezoelectric element plate. As shown in the figure, a dicing saw 1 rotates at high speed by a shaft not shown.
The wafer 2 (thickness: 60 to 80 μm) is cut and divided. However, due to Guising Two, 100%
When cut, the sides of the piezoelectric plate become mirror-like, and as mentioned above, resonance occurs between the sides, worsening the spurious characteristics.Although it is inefficient, cutting with a guising tool only scratches the surface. The wafer is then split along these scratches to separate it into individual piezoelectric plates.
第２図は従来技術で切断・分割された圧電素板の形状で
第２図（ａ）はグイシングツ−により１００％切断した
もの、第２図（ｂ）ば表面に傷を付けこの傷に沿ってウ
ェハーを割り一つ一つの圧電素板に分割したものを示す
。Figure 2 shows the shape of a piezoelectric plate that has been cut and divided using the conventional technique. Figure 2 (a) shows the shape of a piezoelectric plate that has been cut 100% with a guising tool, and Figure 2 (b) shows the shape of a piezoelectric plate that has been cut and divided using a conventional technique. The wafer is divided into individual piezoelectric plates.
ｆｃＩ） 発明の目的
本発明の目的は端面の影響によるスプリアス発生を抑止
できる粗い切断面とな炉、且つ高速で切断・分割を行う
ことのできる圧電素板の切断方法を提供することにある
。fcI) Purpose of the Invention The purpose of the present invention is to provide a furnace with a rough cutting surface that can suppress the generation of spurious waves due to the influence of end faces, and a method of cutting piezoelectric blanks that can cut and divide at high speed.
（１３） 発明の構成
そしてこの目的はレーザ光線を圧電性Ｑ’Ｈ結晶よりな
るウェハーの面に照射しながら、該ウエハ−の全面にわ
たって走査せしめてウェハーのり月υｉ・分割を行い、
圧電素板を得ることで達成し−Ｃいる。(13) The structure and purpose of the invention is to irradiate the surface of a wafer made of piezoelectric Q'H crystal with a laser beam and scan the entire surface of the wafer to divide the wafer into two parts,
This was achieved by obtaining a piezoelectric plate.
（ｆｌ 発明の実施例 以下添付図により本発明の詳細な説明する。(fl Embodiments of the invention The present invention will be explained in detail below with reference to the accompanying drawings.
第３図は本発明になる圧電素板の製造方法である。FIG. 3 shows a method for manufacturing a piezoelectric element plate according to the present invention.
図に示す如く圧電性単結晶よりなるウェハー２の表面に
レーザ光線３を照射しながら、該ウェハー２の前後方向
、および左右方向に走査せしめてウェハーの切断・分割
を行っている。前後方向、才ｉよび左右方向の走査線で
切断・分割された個片４がそれぞれ圧電素板となる。As shown in the figure, the surface of a wafer 2 made of a piezoelectric single crystal is irradiated with a laser beam 3 while being scanned in the front-rear and left-right directions of the wafer 2 to cut and divide the wafer. Each piece 4 cut and divided along scanning lines in the front-rear direction, the horizontal direction, and the left-right direction becomes a piezoelectric element plate.
本発明になる製造方法で得られた＋１１ｉＩ片４は第４
図に示す如く、ダイシングソーにより１００％切Ｉυｉ
した個片（第２図参照）に比べて表面が適当に１゛１１
く、スプリアス発生を抑止することができる。またレー
ザ光線３の照射によって１００％切断できるので、ウェ
ハーを割り一つ一つの圧電素板に分割する作業が不要に
なる。+11iI piece 4 obtained by the manufacturing method of the present invention is the fourth
As shown in the figure, 100% cut Iυi with a dicing saw
Compared to the individual pieces (see Figure 2), the surface is approximately 1゛11.
This makes it possible to suppress the generation of spurious signals. Furthermore, since 100% cutting can be performed by irradiation with the laser beam 3, there is no need to divide the wafer into individual piezoelectric plates.
（ｇ） 発明の効果
以上述べたように本発明によれば、端面の影響によるス
プリアス発生を抑止できる粗い切断面となり、且つ高速
で切断・分割できる圧電素板の切断方法を提供すること
ができる。(g) Effects of the Invention As described above, according to the present invention, it is possible to provide a method for cutting a piezoelectric element plate, which provides a rough cut surface that can suppress the generation of spurious waves due to the influence of the end face, and which can cut and divide at high speed. .
第１図は従来技術の一例、第２図は従来技術で切断され
た圧電素板の形状で第２図（ａ）はダイシングソーによ
り１００％切断したもの、第２図（ｂｌは表面に傷をイ
」番）この傷に沿ってウェハーを割り圧電素板に分割し
たもの、第３図は本発明になる圧電素板の製造方法、第
４図は本発明になる製造方法で得られた個片を示す。
図においてｌはダイシングソー、２ばウェハー、３はレ
ーザ光線、４は切断された個片を示す。
第 １ 図
第３ 図
第２図
第４図Figure 1 shows an example of the conventional technique, Figure 2 shows the shape of a piezoelectric plate cut using the conventional technique, Figure 2 (a) shows one cut 100% with a dicing saw, Figure 2 (bl shows scratches on the surface). Figure 3 shows the method for manufacturing a piezoelectric element according to the present invention, and Figure 4 shows the result obtained using the manufacturing method according to the present invention. Individual pieces are shown. In the figure, 1 is a dicing saw, 2 is a wafer, 3 is a laser beam, and 4 is a cut piece. Figure 1 Figure 3 Figure 2 Figure 4
Claims (1)
よりなるウェハーの面に照射しながら、該ウェハーの全
面にわたって走査せしめてウェハーの切断・分割を行い
、圧電素板をｆＷることを特徴とする圧電振動子の製造
方法。In manufacturing a piezoelectric vibrator, a laser beam is irradiated onto the surface of a wafer made of a piezoelectric single crystal and scanned over the entire surface of the wafer to cut and divide the wafer, thereby fWing the piezoelectric element plate. A method for manufacturing a piezoelectric vibrator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18114983A JPS6072409A (en) | 1983-09-29 | 1983-09-29 | Manufacture for piezoelectric vibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18114983A JPS6072409A (en) | 1983-09-29 | 1983-09-29 | Manufacture for piezoelectric vibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6072409A true JPS6072409A (en) | 1985-04-24 |
Family
ID=16095737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18114983A Pending JPS6072409A (en) | 1983-09-29 | 1983-09-29 | Manufacture for piezoelectric vibrator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072409A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170314A (en) * | 1983-12-28 | 1985-09-03 | ルネ レフエ−ヴル | Method of producing small-sized piezoelectric device using laser machining and device formed by same method |
| WO2008040625A1 (en) * | 2006-09-29 | 2008-04-10 | Continental Automotive Gmbh | Method and device for producing ceramic stacks having a polygonal cross-section |
| US7827659B2 (en) * | 1996-01-26 | 2010-11-09 | Seiko Epson Corporation | Method of manufacturing an ink jet recording head having piezoelectric element |
| US20110050047A1 (en) * | 2009-08-28 | 2011-03-03 | Masashi Numata | Glass assembly cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
| US9960751B2 (en) | 2015-10-20 | 2018-05-01 | Seiko Epson Corporation | Piezoelectric vibrator, electronic apparatus, and vehicle |
-
1983
- 1983-09-29 JP JP18114983A patent/JPS6072409A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170314A (en) * | 1983-12-28 | 1985-09-03 | ルネ レフエ−ヴル | Method of producing small-sized piezoelectric device using laser machining and device formed by same method |
| US7827659B2 (en) * | 1996-01-26 | 2010-11-09 | Seiko Epson Corporation | Method of manufacturing an ink jet recording head having piezoelectric element |
| USRE45057E1 (en) * | 1996-01-26 | 2014-08-05 | Seiko Epson Corporation | Method of manufacturing an ink jet recording head having piezoelectric element |
| WO2008040625A1 (en) * | 2006-09-29 | 2008-04-10 | Continental Automotive Gmbh | Method and device for producing ceramic stacks having a polygonal cross-section |
| US20110050047A1 (en) * | 2009-08-28 | 2011-03-03 | Masashi Numata | Glass assembly cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
| US8615857B2 (en) * | 2009-08-28 | 2013-12-31 | Seiko Instruments Inc. | Method of manufacturing piezoelectric vibrators |
| US9960751B2 (en) | 2015-10-20 | 2018-05-01 | Seiko Epson Corporation | Piezoelectric vibrator, electronic apparatus, and vehicle |
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