JPS5633828A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5633828A
JPS5633828A JP10986279A JP10986279A JPS5633828A JP S5633828 A JPS5633828 A JP S5633828A JP 10986279 A JP10986279 A JP 10986279A JP 10986279 A JP10986279 A JP 10986279A JP S5633828 A JPS5633828 A JP S5633828A
Authority
JP
Japan
Prior art keywords
vernier
accuracy
alignment
chip
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10986279A
Other languages
Japanese (ja)
Inventor
Junichi Hoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP10986279A priority Critical patent/JPS5633828A/en
Publication of JPS5633828A publication Critical patent/JPS5633828A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To improve the alignment accuracy and to permit the reading of a deviation amount with good accuracy by forming a vernier for alignment with an inclination to the X-Y axis of a chip. CONSTITUTION:The vernier 8 is formed on the surface of a chip 6 for a semiconductor device required alignment at an inclined angle of 45 deg. to the X-Y axis of the chip 6 by photolingraphy. In this way, with two lines drawn at an angle of 45 deg. from the most approached X-Y axis, the space between the lines will be 1/2<1/2> of the unit length of an X-Y grid. Therefore, the reading unit DELTAb of the vernier will be made to 1/2<1/2> of that when the vernier is not slanted. Therefore, a deviation amount will be read with the accuracy of 1/2<1/2> and high accuracy alignment will be attained. Furthermore, reading accuracy will be adjusted by suitably selecting an angle of the inclination theta of the vernier.
JP10986279A 1979-08-29 1979-08-29 Semiconductor device Pending JPS5633828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10986279A JPS5633828A (en) 1979-08-29 1979-08-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10986279A JPS5633828A (en) 1979-08-29 1979-08-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5633828A true JPS5633828A (en) 1981-04-04

Family

ID=14521072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10986279A Pending JPS5633828A (en) 1979-08-29 1979-08-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5633828A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6443865B1 (en) 2000-03-17 2002-09-03 Shimano Inc. Bicycle front chainwheel assembly
US20150101161A1 (en) * 2013-10-16 2015-04-16 Mitsubishi Electric Corporation Optical semiconductor device, method for manufacturing optical semiconductor device, and method for manufacturing optical module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6443865B1 (en) 2000-03-17 2002-09-03 Shimano Inc. Bicycle front chainwheel assembly
US6450909B1 (en) 2000-03-17 2002-09-17 Shimano Inc. Bicycle front chainwheel assembly
US6475110B1 (en) 2000-03-17 2002-11-05 Shimano Inc. Bicycle front chainwheel assembly
US20150101161A1 (en) * 2013-10-16 2015-04-16 Mitsubishi Electric Corporation Optical semiconductor device, method for manufacturing optical semiconductor device, and method for manufacturing optical module
US9263853B2 (en) * 2013-10-16 2016-02-16 Mitsubishi Electric Corporation Optical semiconductor device, method for manufacturing optical semiconductor device, and method for manufacturing optical module

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