JPS5628863A - Mark printing method and mark printing device for sealed semiconductor - Google Patents

Mark printing method and mark printing device for sealed semiconductor

Info

Publication number
JPS5628863A
JPS5628863A JP10537279A JP10537279A JPS5628863A JP S5628863 A JPS5628863 A JP S5628863A JP 10537279 A JP10537279 A JP 10537279A JP 10537279 A JP10537279 A JP 10537279A JP S5628863 A JPS5628863 A JP S5628863A
Authority
JP
Japan
Prior art keywords
mark
mark printing
sealed semiconductor
adhering
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10537279A
Other languages
Japanese (ja)
Inventor
Katsunao Takehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10537279A priority Critical patent/JPS5628863A/en
Publication of JPS5628863A publication Critical patent/JPS5628863A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B18/00—Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
    • C04B18/02—Agglomerated materials, e.g. artificial aggregates
    • C04B18/027—Lightweight materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Civil Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)

Abstract

PURPOSE: To improve a mark adhering power and provide a nonvanishing mark by a method wherein a surface of resin sealed semiconductor device is heated, a film of oozing mold releasing agent is dispersed or carbonized and cleared, thereafter the mark is printed.
CONSTITUTION: Resin sealed semiconductor device 1 which is fed one by one onto the shoot 3 by an automatic feeding mechanism 2 is heated by a heating roll 5a of the heating mechanism 5, fir example, 300W350°C, the mold releasing agent is dispersed or carbonized on the mark adhering surface 1a, cleaned, then a desired mark printing is performed on the mark adhering surface 1a cleaned by a printing roll 4a of the printing mechanism 4. Adhering between the mark ink and the resin becomes solidified, resulting in producing a mark having a good quality.
COPYRIGHT: (C)1981,JPO&Japio
JP10537279A 1979-08-18 1979-08-18 Mark printing method and mark printing device for sealed semiconductor Pending JPS5628863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10537279A JPS5628863A (en) 1979-08-18 1979-08-18 Mark printing method and mark printing device for sealed semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10537279A JPS5628863A (en) 1979-08-18 1979-08-18 Mark printing method and mark printing device for sealed semiconductor

Publications (1)

Publication Number Publication Date
JPS5628863A true JPS5628863A (en) 1981-03-23

Family

ID=14405859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10537279A Pending JPS5628863A (en) 1979-08-18 1979-08-18 Mark printing method and mark printing device for sealed semiconductor

Country Status (1)

Country Link
JP (1) JPS5628863A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739732U (en) * 1980-08-14 1982-03-03
US4655134A (en) * 1985-07-18 1987-04-07 Thomson Components-Mostek Corporation Method of branding a semiconductor chip package
JPS6482655A (en) * 1987-09-25 1989-03-28 Toshiba Corp Marking device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140463A (en) * 1978-04-21 1979-10-31 Nec Corp Process method for resin-sealed semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140463A (en) * 1978-04-21 1979-10-31 Nec Corp Process method for resin-sealed semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739732U (en) * 1980-08-14 1982-03-03
US4655134A (en) * 1985-07-18 1987-04-07 Thomson Components-Mostek Corporation Method of branding a semiconductor chip package
JPS6482655A (en) * 1987-09-25 1989-03-28 Toshiba Corp Marking device

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