JPS5624962A - Manufacture of lead frame for semiconductor device - Google Patents
Manufacture of lead frame for semiconductor deviceInfo
- Publication number
- JPS5624962A JPS5624962A JP10090379A JP10090379A JPS5624962A JP S5624962 A JPS5624962 A JP S5624962A JP 10090379 A JP10090379 A JP 10090379A JP 10090379 A JP10090379 A JP 10090379A JP S5624962 A JPS5624962 A JP S5624962A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mold
- manufacture
- semiconductor device
- shorten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10090379A JPS5624962A (en) | 1979-08-07 | 1979-08-07 | Manufacture of lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10090379A JPS5624962A (en) | 1979-08-07 | 1979-08-07 | Manufacture of lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5624962A true JPS5624962A (en) | 1981-03-10 |
| JPS6235270B2 JPS6235270B2 (ja) | 1987-07-31 |
Family
ID=14286297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10090379A Granted JPS5624962A (en) | 1979-08-07 | 1979-08-07 | Manufacture of lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5624962A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745768A (ja) * | 1992-07-09 | 1995-02-14 | Goto Seisakusho:Kk | 半導体装置用リードフレームの製造方法及びこれに用いるプレス成形装置 |
| JP2006116589A (ja) * | 2004-10-25 | 2006-05-11 | Nhk Spring Co Ltd | ブレーキディスク用ディスクブランクの製造方法 |
| JP2006339274A (ja) * | 2005-05-31 | 2006-12-14 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| US8875903B2 (en) | 2007-03-19 | 2014-11-04 | Palo Alto Research Center Incorporated | Vortex structure for high throughput continuous flow separation |
-
1979
- 1979-08-07 JP JP10090379A patent/JPS5624962A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745768A (ja) * | 1992-07-09 | 1995-02-14 | Goto Seisakusho:Kk | 半導体装置用リードフレームの製造方法及びこれに用いるプレス成形装置 |
| JP2006116589A (ja) * | 2004-10-25 | 2006-05-11 | Nhk Spring Co Ltd | ブレーキディスク用ディスクブランクの製造方法 |
| JP2006339274A (ja) * | 2005-05-31 | 2006-12-14 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| US8875903B2 (en) | 2007-03-19 | 2014-11-04 | Palo Alto Research Center Incorporated | Vortex structure for high throughput continuous flow separation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6235270B2 (ja) | 1987-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL51711A0 (en) | Molds and processes for producing contact lenses | |
| EP0032024A3 (en) | Process for producing semiconductor devices, devices produced by the process, and circuits and articles including such devices | |
| GB2050938B (en) | Method for the production of sawblades and blades produced by the method | |
| JPS52115728A (en) | Mold manufacturing process | |
| JPS5365387A (en) | Process for producing improved polybutadiene | |
| AU511037B2 (en) | Integrated ammonia-urea production process | |
| JPS52142621A (en) | Mold manufacturing process | |
| JPS5624962A (en) | Manufacture of lead frame for semiconductor device | |
| JPS5358593A (en) | Process for producing low molecularrweight polyyanhydrides | |
| JPS5317161A (en) | Process for producing ureaform | |
| JPS5373067A (en) | Polisher | |
| IT7824506A0 (it) | Impianto per la fabbricazione di mezze forme in staffa. | |
| JPS5298472A (en) | Lead frame for resin molding | |
| YU39659B (en) | Process for producing 1,-n-(alpha-hydroxy-omega-aminoacyl)-6'-n-methyl-3',4'-dideoxykanamycin b | |
| JPS53115176A (en) | Production of resn mold type semiconductor device | |
| GB1550722A (en) | Process for the production of 2,3-cycloalkenopyridines | |
| JPS5296680A (en) | Process for producing mold by utilyzing disposed plastics | |
| JPS5378773A (en) | Preparation for semiconductor device of glass mold type | |
| BE827644A (fr) | Procede de fabrication de l'hexanedione-2,5" | |
| YU40678B (en) | Process for producing d-threo-l-phenyl-2-trifluoro-acetamido-1,3-propandiol | |
| JPS5593243A (en) | Semiconductor device | |
| IT1074150B (it) | Procedimento ed impianto per produrre bicloruro di etilene | |
| JPS545391A (en) | Manufacture of semiconductor device | |
| JPS52107230A (en) | Mold manufacturing process | |
| JPS52109576A (en) | Process for producing mold |