JPS5623762A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPS5623762A JPS5623762A JP9838079A JP9838079A JPS5623762A JP S5623762 A JPS5623762 A JP S5623762A JP 9838079 A JP9838079 A JP 9838079A JP 9838079 A JP9838079 A JP 9838079A JP S5623762 A JPS5623762 A JP S5623762A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- approx
- silica powder
- acetic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000007789 sealing Methods 0.000 title 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 5
- 239000000843 powder Substances 0.000 abstract 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract 2
- 239000000378 calcium silicate Substances 0.000 abstract 2
- 229910052918 calcium silicate Inorganic materials 0.000 abstract 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 235000010216 calcium carbonate Nutrition 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9838079A JPS5623762A (en) | 1979-07-31 | 1979-07-31 | Epoxy resin composition for sealing semiconductor |
| US06/127,719 US4271061A (en) | 1979-03-06 | 1980-03-06 | Epoxy resin compositions for sealing semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9838079A JPS5623762A (en) | 1979-07-31 | 1979-07-31 | Epoxy resin composition for sealing semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5623762A true JPS5623762A (en) | 1981-03-06 |
| JPS5750063B2 JPS5750063B2 (enrdf_load_stackoverflow) | 1982-10-25 |
Family
ID=14218259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9838079A Granted JPS5623762A (en) | 1979-03-06 | 1979-07-31 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5623762A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278522A (ja) * | 1988-04-28 | 1989-11-08 | Somar Corp | 含浸に好適なエポキシ樹脂組成物 |
| JP2023530026A (ja) * | 2020-06-22 | 2023-07-12 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー | 光硬化性組成物 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124558U (enrdf_load_stackoverflow) * | 1986-01-30 | 1987-08-07 |
-
1979
- 1979-07-31 JP JP9838079A patent/JPS5623762A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278522A (ja) * | 1988-04-28 | 1989-11-08 | Somar Corp | 含浸に好適なエポキシ樹脂組成物 |
| JP2023530026A (ja) * | 2020-06-22 | 2023-07-12 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー | 光硬化性組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5750063B2 (enrdf_load_stackoverflow) | 1982-10-25 |
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