JPS5619647A - Manufacture of electronic parts - Google Patents
Manufacture of electronic partsInfo
- Publication number
- JPS5619647A JPS5619647A JP9523679A JP9523679A JPS5619647A JP S5619647 A JPS5619647 A JP S5619647A JP 9523679 A JP9523679 A JP 9523679A JP 9523679 A JP9523679 A JP 9523679A JP S5619647 A JPS5619647 A JP S5619647A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- plating
- solder
- lead wire
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To perform an easy product control and, particularly, to prevent a contact with a neighboring lead while performing a solder-plating by a method wherein the electronic parts are holder in the same jig in an alignment for all the processes including a heat-treatment, a solder-plating and throughout the subsequent processes. CONSTITUTION:A thin plate 18 is fixed on a lower surface of a jig body 16, a glass tube 6' and a conductor 2 having a lead wire 4 in one united body are inserted into a through hole 19 and have the lead wire 4 protruded from a hole 21. Then, an element 1 and a conductor 3 are inserted, a lead wire 5 is passed through a hole 20 on a thin plate 17 and the plate 17 is fixed on the upper surface of the body 16. The lead wire 5 is pushed out by a plate 22, it is heated by applying a current on the jig, the glass tube 6' is melted and a sealing glass is formed on the conductors 2 and 3. Then, with a jig 15 reversed, the lead wires 4 and 5 are soaked down to the base in a solder vessel successively and a plating is performed. Next, characteristic inspection, sorting and marking are performed at every individual jig and the jigs are disassembled at the time which is considered suitable. In this constitution, an efficient control can be performed and a solder-plating can also be done on a lead of nonmagnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9523679A JPS6022824B2 (en) | 1979-07-25 | 1979-07-25 | Manufacturing method for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9523679A JPS6022824B2 (en) | 1979-07-25 | 1979-07-25 | Manufacturing method for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5619647A true JPS5619647A (en) | 1981-02-24 |
| JPS6022824B2 JPS6022824B2 (en) | 1985-06-04 |
Family
ID=14132118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9523679A Expired JPS6022824B2 (en) | 1979-07-25 | 1979-07-25 | Manufacturing method for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6022824B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61256619A (en) * | 1985-05-09 | 1986-11-14 | 松下電器産業株式会社 | Multi-element type chip-shaped solid electrolytic capacitor |
-
1979
- 1979-07-25 JP JP9523679A patent/JPS6022824B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6022824B2 (en) | 1985-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HK14785A (en) | Method and apparatus for the production of electrical contacts with crimp connections | |
| GB2078545B (en) | Textiles with improved electrical conducting properties and process for their manufacture | |
| JPS5721230A (en) | Positioning method in wire cut electric discharge processing | |
| JPS5619647A (en) | Manufacture of electronic parts | |
| GB2039535B (en) | Process for coating an electrically nonconductive material with metal | |
| GB786281A (en) | Improvements in or relating to methods of manufacturing semiconductor systems | |
| DE69119093D1 (en) | METHOD AND DEVICE FOR INSERTING AN ELECTRICALLY CONDUCTING LIQUID BETWEEN ELECTRODES IN A SHOCK SHAFT DEVICE | |
| US3704436A (en) | Multi-wire potentiometer contact device | |
| US4007097A (en) | Process for selectively applying a metal coating to the metallic parts of elements which pass through an insulator | |
| MY100675A (en) | Method for the multiple use of a copper wire used as electrode wire for electrical resistance longitudinal seam welding. | |
| ATE20442T1 (en) | PROCESS FOR ELECTRIC RESISTANCE ROLL SEAM WELDING WITH ONLY ONE ELECTRODE WIRE AND WELDING MACHINE TO CARRY OUT THE PROCESS. | |
| US4048043A (en) | Selective plating apparatus | |
| JPS57111056A (en) | Semiconductor device | |
| JPS5315239A (en) | Resistance welding electrode for articles coated with electric insulating material | |
| JPS5514891A (en) | Continuous heat treatment device for metal material | |
| JPS6455227A (en) | Bristle setting process of metallic pile | |
| US3176376A (en) | Method of making semiconductor device | |
| US2856571A (en) | Subminiature semiconductor instrument and method and apparatus for producing the same | |
| JPS57178146A (en) | Detector for gaseous component | |
| JPS5690545A (en) | Plating method of lead terminal for semiconductor device | |
| JP2620355B2 (en) | Semiconductor device manufacturing method and manufacturing apparatus | |
| SU1184873A1 (en) | Device for applying coatings by electrophoresis on articles of complicated configuration | |
| JPS57153431A (en) | Electroplating method for semiconductor wafer | |
| JPS5841663B2 (en) | Manufacturing method of semiconductor device | |
| JPS6456817A (en) | Heat treatment method |