JPS5841663B2 - Manufacturing method of semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device having a lead wire for deriving an example part, particularly a DHD (Double Heatsink Diode).
e) A method for manufacturing a glass-sealed diode.

Most diode products currently on the market are DHD.
It is a type glass sealed diode.

For this type of diode, first, an external lead wire is prepared by cutting copper wire material to a predetermined length and welding it to an exit conductor (Dumet material) suitable for glass sealing.Then, the diode element is mounted and sealed with a glass tube. be stopped.

The heat-sealed diode lead wires are solder plated.

After inspecting and sorting each test item, each sorting group is marked with product identification markings and is equipped with the specifications for each product, resulting in a finished product.

However, such a diode manufacturing method has various problems as described below.

1. In the sealing process, it is difficult to attach the lead wire to the sealing jig because the lead wire is long and thin and bends easily.

2. Lead wires are bent during plating work, so lead stretching work is required.

3. In the characteristic selection process, if the lead wire is bent, the lead wire cannot be attached to or removed from the measurement terminal incompletely, reducing work efficiency and making it impossible to perform accurate sorting.

These defects are mainly caused by the welding of the lead wire and the Hiji conductor prior to the sealing process, and also because the plating process is performed after the sealing process after heat treatment. This made the process complicated and became a major obstacle to installing an entire automated line.

Therefore, an object of the present invention was proposed in view of the above-mentioned drawbacks, and it is an object of the present invention to provide a semiconductor device, particularly a DHD device, which is improved in terms of labor saving.
A method for manufacturing a shape-sealed diode is presented.

The gist of the present invention is to first seal and sort semiconductor elements by using the exposed conductor without external lead wires attached, and then to attach the plated lead wire to the exposed conductor. It's about welding.

Therefore, the conventional troubles caused by external lead wires before the screening and inspection process are completely eliminated.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described in detail below in comparison with a conventional example according to the drawings.

FIG. 1 is a partial sectional view of a DHD type glass-sealed diode according to the manufacturing method of the present invention, in which a diode element 1 having an Ag bump electrode on one side and a substrate electrode on the other side is made of a Dumet material of a copper-coated metal wire. A pair of sunrise conductors 2 consisting of
3 is clamped on the butt surface.

This diode element 1 and part of the outlet conductors 2 and 3 are sealed by a glass tube 4 of an insulating envelope.

Lead wires 6 and 7 for leading out the row portion are welded to the sunrise conductors 2 and 3 on the side of the sealed body row of this diode element, respectively.

These lead wires 6 and 7 are coated with metal plating, for example, solder plating 8°9 to improve the contact resistance of the lead wires and improve solderability.

Further, on the outer surface of the glass tube 4, marks 10 such as polarity, manufacturer's company name, etc. are stamped in addition to type indication based on sorting characteristics.

The method of manufacturing a diode according to the invention is carried out according to the process diagram shown in FIG.

That is, first, the parts are assembled in step 11 (sealing +).

Diode element 1, glass tube 4, and a pair of exposed conductors 2
, 3 are placed in a predetermined position in an appropriately molded sealing IL jig made of carbon material.

Each component housed in the jig is set in the sealing equipment of a power-controlled heating device, heated to a temperature slightly higher than the melting humidity of the glass tube 4, and the glass tube 4 is melted to the side of the outlet conductor 2゜3. Then, a sealed diode element 5 as shown in FIG. 3 is obtained.

In this case, the expansion coefficients of the glass tube 4 and the solar conductor 2.3 are selected to be equal to each other, so that a strong glass-to-metal seal is formed.

This sealed body 5 is then transferred to a sorting step 12, and a predetermined inspection item, for example, reverse leakage current I in the case of a constant voltage diode, is carried out.
R1 forward voltage drop ■F, Zener voltage ■Z, operating resistance RZ
The following characteristic tests are carried out, classification is made according to each standard level, and varieties are determined.

In this sorting step 12, an ordinary automatic characteristic sorting device for diodes is used.1. As shown in FIG. 3, the It, LI integrated unit 5 does not have a lead wire for derivation, so that the characteristic selection device can have a compact and simplified structure.

As a feature of the present invention, welding of the external lead wires 6 and 7 to the outlet conductors 2 and 3 is performed after the sorting step 12.

The lead wires 6 and 7 are prepared in advance by a plating process 13.

The lead wires 6 and 7 are usually copper-coated iron-nickel core wires, and are electroplated with a solder material containing tin or lead as a main component.

In this case, the lead wire material may be replaced with the above-mentioned base iron, nickel, or other metal lead material, and the plating material may be replaced with gold, silver, or other plating material.

Further, as a plating method, electroplating, chemical plating, other dipping methods, etc. may be appropriately adopted depending on the plating material.

In the lead welding process 14, the plated lead wires 6, 7 are separated for each group of diodes divided in the sorting process 12.
are electrically welded to the lead conductors 2 and 3 of the sealing body 5.

The plated lead wires 6 and 7 may be either pre-cut to predetermined dimensions or spool-shaped, and furthermore, both electrodes may be welded simultaneously in the welding step 14.

Next, in a marking step 15, the quartz sealed bodies are sorted by type and welded with plated lead wires, and marks 10 such as polarity marks are marked on the outer circumferential surface of the glass tube 4 for each group. The DHD glass-sealed diode is completed by stamping, final inspection if necessary, counting, and blunt mounting of a predetermined case.

These processes are usually constructed on automated lines using belt conveyors.

On the other hand, in the conventional example shown in FIG. 4, there is first a lead welding step 16, in which the lead wire and the sunrise conductor are welded to prepare a pair of slag leads.

Normally, the production of this slug lead is automated, but it is prepared without solder plating in preparation for the next sealing process 1T.

That is, the sealing temperature of the glass tube is usually 6000 to 800
°C, which is higher than the melting point of the half-metal material, so plating cannot be applied to this slag lead.

Therefore, the lead plating process 18 is required after the sealing process 17JJ.

The lead plating process 18 usually uses a solder material mainly consisting of tin and lead, and the plating methods include (a) the barrel method, which is suitable for plating large quantities of small items such as electrical parts, and (b) the barrel method.
Solder dip method etc. are adopted.

However, the former barrel method has the disadvantage that the lead wire is bent, and although not shown, lead correction work is required after the lead plating process 18.

In addition, the latter solder dip method has the disadvantage that solder plating is difficult to achieve uniformly, and thermal shock is applied to the glass tube and diode element, causing deterioration of the characteristics of the diode.

Furthermore, in both of these plating methods, it is necessary to treat the lead surface with acid or alkaline chemicals prior to plating in order to obtain a uniform plating finish, and this has the disadvantage that the sealed portion of the Dumet wire is contaminated by this chemical. There is.

After this plating work, in a sorting step 19, products are classified based on characteristic standards, and each product group is marked, and DHD diodes are completed in the same way.

In order to make the characteristics of the present invention easier to understand, the characteristics of the embodiment according to the present invention and the conventional process C will be compared as follows.

process Sealing process 0υ Sorting process (12) lead mets Main process α3) lead welding Process 04) Characteristics Traditionally, slag lead is used, but In the present invention, only the Hiji conductor is used. Therefore, the structure of Feng Shoji became simpler. mounting of assembled parts on jigs, etc. The handling process has been significantly improved. This helps improve efficiency.

The conventional sealing body has a lead shape. If the wire is attached and the lead wire is bent, the probe The lead may not be attached or removed completely. Although difficult to perform, the sealing method of the present invention There was no lead wire attached to the body. The sorting equipment can be made compact. The probe is simplified and the work ability is improved. It becomes.

Conventionally, lead plating was performed after sealing. melting of the glass in the sealing part. Although the lid is exposed to chemicals, the main In the invention, the lead wire itself is plated. Therefore, plating work is easy. It has none of the drawbacks of the conventional method.

In addition, conventionally the lead was removed after plating work. Stretching work was required, but it failed. It's not needed at all in Ming.

Previously, each Hiji conductor was melted. However, in the present invention, the sealed body Process characteristics simultaneously welded to a pair of sunrise conductors Completed, and in the middle of the conveyor It is also possible to install without any process. This allows for consistent work and labor-saving effects. It's thick.

As compared above, the manufacturing method according to the present invention does not require plating work with the diode element sealed, and enables assembly line work using a belt conveyor line that runs from the sealing process to the completion of the product.

Furthermore, since no easily bendable lead wires are attached to the sealed body up to the sorting process, each process equipment can be simplified and workability can be significantly improved, resulting in a large labor-saving effect.

[Brief explanation of drawings]

FIG. 1 is a partial sectional view of a DHD type glass Z-sealed diode according to the manufacturing method of the present invention, FIG. 2 is a main process diagram of FIG. 1,
Figure 3 is a vertical sectional view showing the sealed body after sealing in Figure 2;
The figure is a main process diagram of a conventional DHD type diode. 1... Diode element, 2, 3... Exit conductor, 4... Glass tube (insulating envelope), 5
......-Sealing body, 6.7... Lead wire for leading out to the outside, 8, 9... Plating layer, 11... Sealing process, 12... ... Sorting process, 13... Lead plating process, 14... Lead wire welding process.

Claims (1)

[Claims] A process of sealing the semiconductor element clamped by a pair of Hinode conductors by heat-sealing an insulating envelope, and a sorting process of inspecting the sealed semiconductor element using predetermined inspection items and classifying it according to standard levels. A method for manufacturing a semiconductor device, comprising the steps of plating lead wires for derivation, and welding the plated lead wires to the outlet conductor for each group divided in the sorting step.